公开(公告)号：US10321566B2

公开(公告)日：2019-06-11

申请号：US15683138

申请日：2017-08-22

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Yasuyuki Hitsuoka

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/00 ,  H05K3/42

Abstract: A printed wiring board according to an aspect of the present invention includes an insulating resin, a plated copper formed on a front surface side of the insulating resin, and a plated copper formed on a back surface side of the insulating resin. The plated copper and the plated copper are electrically connected via a plated copper that fills a through hole penetrating the insulating resin from the front surface side to the back surface side. Furthermore, the through hole includes a conical section whose opening diameter decreases from the front surface side to the back surface side of the insulating resin, and a cylindrical section that communicates with the conical section at a bottom surface of the conical section.

公开(公告)号：US11764138B2

公开(公告)日：2023-09-19

申请号：US16938144

申请日：2020-07-24

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Osamu Koga ,  Yasuyuki Hitsuoka ,  Yoshito Akutagawa

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/532 ,  H01L23/498 ,  H01L21/48 ,  H01L23/15

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/76802 ,  H01L23/15

Abstract: A glass core device with a wiring pattern on a first surface of a glass core and a wiring pattern on a second surface thereof being electrically connected via a wiring pattern embedded in TGVs formed in the glass core. In a state of being cut out by dicing, each glass core has a second surface and side faces which are continuously covered with an outer protective layer.

公开(公告)号：US10966324B2

公开(公告)日：2021-03-30

申请号：US16439326

申请日：2019-06-12

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Yasuyuki Hitsuoka

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/16 ,  H05K3/20 ,  H05K3/30 ,  H05K3/36 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/06 ,  H05K3/18

Abstract: A wiring board, a multilayer wiring board, and a method of manufacturing a wiring board adapted to make the filling of through holes and the formation of fine wiring patterns. The wiring board comprises an insulator; a through hole between front and back surfaces of the insulator; a through hole conductor for electrically connecting front and back surface side openings; through hole lands around the front and the back surface side openings, and connected to the through hole conductor; lid plating conductors on the front and the back surface sides, and placed on the respective through hole lands; and wiring patterns formed on the front are compatible and the back surface of the insulator. The thickness of the through hole lands is 1.0 μm or more and 10.0 μm or less, and the area of each lid plating conductor is less than the area of each through hole land.

公开(公告)号：US20170354034A1

公开(公告)日：2017-12-07

申请号：US15683138

申请日：2017-08-22

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Yasuyuki Hitsuoka

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K1/09

CPC classification number: H05K1/115 ,  H05K1/09 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/423 ,  H05K3/425 ,  H05K3/426 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/107 ,  H05K2203/1572

Abstract: A printed wiring board according to an aspect of the present invention includes an insulating resin, a plated copper formed on a front surface side of the insulating resin, and a plated copper formed on a back surface side of the insulating resin. The plated copper and the plated copper are electrically connected via a plated copper that fills a through hole penetrating the insulating resin from the front surface side to the back surface side. Furthermore, the through hole includes a conical section whose opening diameter decreases from the front surface side to the back surface side of the insulating resin, and a cylindrical section that communicates with the conical section at a bottom surface of the conical section.