公开(公告)号：US12269225B2

公开(公告)日：2025-04-08

申请号：US17604489

申请日：2020-05-15

Applicant: Toray Industries, Inc.

Inventor： Takashi Fujioka ,  Naokichi Imai ,  Masato Honma ,  Yoshiki Takebe ,  Kotaro Shinohara

IPC: B29C70/88 ,  B29C70/20 ,  B29K77/00 ,  B29K81/00 ,  B29K105/08 ,  B29K105/10 ,  B29K307/04

Abstract: A fiber-reinforced plastic substrate is described in which a plurality of resins having different properties are firmly compounded and that includes components [A], [B], and [C]: [A] reinforcing fibers; [B] thermoplastic resin (b); and [C] thermoplastic resin (c), wherein the component [A] is arranged in one direction, in the fiber-reinforced plastic substrate, a resin area including the component [B] and a resin area including the component [C] are present, the resin area including the component [B] is present on a surface of one side of the fiber-reinforced plastic substrate, and a distance Ra(bc) between Hansen solubility parameters of the component [B] and the component [C] satisfies formula (1): Ra(bc)={4(δDB−δDC)2+(δPB−δPC)2+(δHB−δHC)2}1/2≥8 wherein Ra(bc), δDB, δDC, δPB, δPC, δHB and δHC are as defined.

公开(公告)号：US20180066118A1

公开(公告)日：2018-03-08

申请号：US15553788

申请日：2016-02-24

Applicant: Toray Industries, Inc.

Inventor： Tomohiro Takehara ,  Satoshi Seike ,  Masato Honma ,  Takashi Fujioka ,  Satomi Hiasa

IPC: C08J5/04 ,  C08J5/24 ,  B29B11/16

Abstract: A resin supply material is used for molding a fiber-reinforced resin and includes a continuous porous material and a resin. The continuous porous material has a bending resistance Grt of 10 mN·cm or more at 23° C., and a bending resistance ratio Gr of 0.7 or less, the bending resistance ratio Gr being expressed by the formula: Gr=Gmt/Grt Gmt: bending resistance of continuous porous material at 70° C.

公开(公告)号：US11800656B2

公开(公告)日：2023-10-24

申请号：US16325342

申请日：2017-09-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Mitsushige Hamaguchi ,  Takashi Fujioka ,  Masato Honma

IPC: H05K5/02 ,  B32B5/28 ,  B29B7/90 ,  B29B9/06 ,  B29B9/14 ,  B29C45/14 ,  B32B5/02 ,  B32B27/12 ,  B32B27/20 ,  B29K63/00 ,  B29L31/34

CPC classification number: H05K5/0217 ,  B29B7/90 ,  B29B9/06 ,  B29B9/14 ,  B29C45/14336 ,  B32B5/022 ,  B32B5/28 ,  B32B27/12 ,  B32B27/20 ,  B29K2063/00 ,  B29K2713/00 ,  B29L2031/34 ,  B32B2457/00

Abstract: The invention aims to provide an electronic device housing that can maintain the antenna performance without deteriorating the radio communication performance, ensures uniform characteristics as one molded electronic device housing in spite of consisting of a plurality of members, and show excellent features in terms of the degree of warpage and dimensional accuracy as well as small deformation in high temperature environments and high mass productivity. The electronic device housing consists mainly of a fiber reinforcing member (a) and a fiber reinforcing member (b), the fiber reinforcing member (a) containing a resin (a1) and a fiber (a2), the fiber reinforcing member (b) containing a resin (b1) and a fiber (b2), the fiber reinforcing member (a) and the fiber reinforcing member (b) being joined directly without the existence of another layer at the joining face between the fiber reinforcing member (a) and the fiber reinforcing member (b), and the fiber reinforcing member (a) and the fiber reinforcing member (b) fulfilling a specific relation in terms of linear expansion coefficient and/or bending elastic modulus.

公开(公告)号：US20210009783A1

公开(公告)日：2021-01-14

申请号：US16980634

申请日：2019-03-28

Applicant: Toray Industries, Inc.

Inventor： Takashi Fujioka ,  Kotaro Shinohara ,  Masato Honma

IPC: C08J9/36 ,  C08J5/04 ,  B29C44/06

Abstract: Provided is a method for producing a molded article having a thin film layer (B) formed on a surface of a porous body (A). The method includes a process (I) and a process (II) described below in this order:
process (I): forming the thin film layer (B) on a surface of a precursor (a) of the porous body (A) to obtain a preform, and
process (II): expanding and molding the precursor (a) to the porous body (A).

公开(公告)号：US10882224B2

公开(公告)日：2021-01-05

申请号：US16065621

申请日：2016-12-09

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takashi Fujioka ,  Yoshiki Takebe ,  Masato Honma

IPC: B29C39/38 ,  B29C39/18 ,  B29C43/18 ,  B29C43/52 ,  B29C70/28 ,  B32B27/12 ,  C08J5/04 ,  B29C70/46 ,  B29K101/10 ,  B29K101/12 ,  B29K105/06 ,  B29K105/04

Abstract: A method for manufacturing a structure material is a method for manufacturing a structure material that includes a thermoplastic resin, reinforced fibers, and voids. The method includes: a first process for arranging a structure precursor comprising the thermoplastic resin and the reinforced fibers in a mold with a surface temperature of 80° C. or less; a second process for raising the surface temperature of the mold up to a temperature at which a storage elastic modulus (G′) of the structure precursor is less than 1.2×108 Pa; a third process for lowering the surface temperature of the mold down to a temperature at which the storage elastic modulus (G′) of the structure precursor is 1.2×108 Pa or more; and a fourth process for removing a structure material obtained after end of the third process from the mold.

公开(公告)号：US20220212426A1

公开(公告)日：2022-07-07

申请号：US17604489

申请日：2020-05-15

Applicant: Toray Industries, Inc.

Inventor： Takashi Fujioka ,  Naokichi Imai ,  Masato Honma ,  Yoshiki Takebe ,  Kotaro Shinohara

IPC: B29C70/88 ,  B29C70/20

Abstract: A fiber-reinforced plastic substrate is described in which a plurality of resins having different properties are firmly compounded and that includes components [A], [B], and [C]: [A] reinforcing fibers; [B] thermoplastic resin (b); and [C] thermoplastic resin (c), wherein the component [A] is arranged in one direction, in the fiber-reinforced plastic substrate, a resin area including the component [B] and a resin area including the component [C] are present, the resin area including the component [B] is present on a surface of one side of the fiber-reinforced plastic substrate, and a distance Ra(bc) between Hansen solubility parameters of the component [B] and the component [C] satisfies formula (1): Ra(bc)={4(δDB−δDC)2+(δPB−δPC)2+(δHB−δHC)2}1/2≥8 wherein Ra(bc), δDB, δDC, δPB, δPC, δHB and δHC are as defined.

公开(公告)号：US11312825B2

公开(公告)日：2022-04-26

申请号：US16471782

申请日：2017-12-20

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yoshiki Takebe ,  Takashi Fujioka ,  Masato Honma

IPC: C08J5/00 ,  C08J5/04

Abstract: Provided is a structure having excellent flexibility represented by elastic restoring from compression or tensile elongation at break, and excellent lightness. A structure according to the present invention includes reinforced fibers, first plastic, and second plastic that exhibits rubber elasticity at room temperature, the reinforced fibers being discontinuous fibers, and the first plastic and/or the second plastic coating a crossing point between the reinforced fibers in contact with each other.

公开(公告)号：US11072098B2

公开(公告)日：2021-07-27

申请号：US16471228

申请日：2017-12-20

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takashi Fujioka ,  Yoshiki Takebe ,  Masato Honma

IPC: B29C39/10 ,  B29C39/24 ,  B29C43/00 ,  B29C70/68 ,  B29C44/12 ,  B29C44/04 ,  B29C44/14

Abstract: A method for manufacturing a composite structure in which a first member and a structure material as a second member are integrated, the method including: an arrangement step of arranging a structure precursor including a resin and reinforced fibers in a mold made of the first member; a heating step of heating the structure precursor to equal to or higher than a temperature at which a storage elastic modulus (G′) of the structure precursor is less than 1.2×108 Pa; a shaping step of expanding the structure precursor by heating to form a structure material as a second member, and bringing the structure material into close contact with the first member to obtain a composite structure; and a cooling step of cooling the composite structure.

公开(公告)号：US20170326820A1

公开(公告)日：2017-11-16

申请号：US15527196

申请日：2015-11-10

Applicant: Toray Industries, Inc.

Inventor： Takashi Fujioka ,  Masato Honma

IPC: B29C70/46 ,  B29C45/14 ,  B29C43/18 ,  B32B5/26 ,  B29B11/12

CPC classification number: B29C70/46 ,  B29B11/12 ,  B29C43/18 ,  B29C43/20 ,  B29C45/14 ,  B29C45/14811 ,  B29C2043/186 ,  B29C2043/188 ,  B29C2043/189 ,  B29K2713/00 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B5/28 ,  B32B7/12 ,  B32B27/08 ,  B32B27/12 ,  B32B27/20 ,  B32B27/22 ,  B32B27/26 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B27/42 ,  B32B33/00 ,  B32B2255/02 ,  B32B2255/205 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0269 ,  B32B2262/04 ,  B32B2262/065 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2262/103 ,  B32B2262/105 ,  B32B2262/106 ,  B32B2262/14 ,  B32B2307/72 ,  B32B2307/724 ,  B32B2419/00 ,  B32B2419/06 ,  B32B2457/00 ,  B32B2605/00 ,  B32B2605/08 ,  B32B2605/18

Abstract: A laminate includes reinforcing fibers, thermosetting resin (B) or thermoplastic resin (D), wherein adhesion with other members, particularly in high-temperature atmospheres, is outstanding. The laminate includes: a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermosetting resin (B), or a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermoplastic resin (D); wherein the porous substrate (C) has a gap part continuous in the thickness direction of the laminate, and the melting point or softening point is higher than 180° C., and at least 10% of the surface area of one surface of the porous substrate (C) is exposed on one side of the laminate.

公开(公告)号：US11589472B2

公开(公告)日：2023-02-21

申请号：US16309345

申请日：2017-06-20

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takashi Fujioka ,  Masato Honma

IPC: H05K5/03 ,  H05K1/18 ,  H05K3/30 ,  H05K9/00 ,  H05K7/06 ,  H05K1/02 ,  H05K5/02

Abstract: A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.