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公开(公告)号：US20190036308A1
公开(公告)日：2019-01-31
申请号：US16045633
申请日：2018-07-25
Applicant: TRILUMINA CORP.
Inventor： Richard F. CARSON , Nein-Yi LI , Mial E. WARREN
Abstract: Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.
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公开(公告)号：US20200144791A1
公开(公告)日：2020-05-07
申请号：US16733901
申请日：2020-01-03
Applicant: TRILUMINA CORP.
Inventor： Richard F. CARSON , Nein-Yi LI , Mial E. WARREN
Abstract: Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.
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Patent Agency Ranking
公开(公告)号：US20160164261A1
公开(公告)日：2016-06-09
申请号：US15040975
申请日：2016-02-10
Applicant: TRILUMINA CORP.
Inventor： Mial E. WARREN
CPC classification number: H04N5/2354 , H01S5/0014 , H01S5/005 , H01S5/0224 , H01S5/02272 , H01S5/02276 , H01S5/02469 , H01S5/026 , H01S5/0425 , H01S5/06226 , H01S5/18311 , H01S5/18347 , H01S5/18388 , H01S5/423 , H01S2301/176 , H04N5/2256 , H04N5/332
Abstract: Methods, devices and systems are described for selectively illuminating different zones of a field of view by a multi-zone illumination device. In one aspect, a multi-zone illuminator may include a plurality of vertical cavity surface emitting lasers (VCSELs), and a plurality of micro-optical devices aligned with apertures of individual or groups of VCSELs, which are configured to be individually activated to provide adjustable illumination to different zones of a field of view of an image sensor. In another aspect, a method of selective illumination may include receiving information specifying a field of view of a camera, and controlling at least two sub arrays or individual illuminators of an illuminating array to output light at independently adjustable illumination powers, wherein each of the at least two sub arrays are independently configurable to illuminate at least one of a plurality of separate zones corresponding to the field of view of the camera.
Abstract translation: 描述了用于通过多区域照明装置选择性地照射视场的不同区域的方法，装置和系统。 在一个方面，多区域照明器可以包括多个垂直空腔表面发射激光器（VCSEL），以及多个微型光学设备，其与VCSEL的单个或多组孔径对准，其被配置为被单独激活以提供 可调节照明到图像传感器的视场的不同区域。 在另一方面，选择性照明的方法可以包括接收指定照相机的视场的信息，以及控制照明阵列的至少两个子阵列或各个照明器以独立调节的照明功率输出光，其中， 至少两个子阵列可独立地配置为照亮与相机的视野对应的多个分离区域中的至少一个。
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公开(公告)号：US20200335942A1
公开(公告)日：2020-10-22
申请号：US16917785
申请日：2020-06-30
Applicant: TRILUMINA CORP.
Inventor： Richard F. CARSON , Nein-Yi LI , Mial E. WARREN
Abstract: Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.
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公开(公告)号：US20200169065A1
公开(公告)日：2020-05-28
申请号：US16627958
申请日：2018-08-13
Applicant: TRILUMINA CORP.
Inventor： Richard F. CARSON , Nein-Yi LI , Mial E. WARREN
Abstract: A VCSELNECSEL array design is disclosed that results in arrays that can be directly soldered to a PCB using conventional surface-mount assembly and soldering techniques for mass production. The completed VCSEL array does not need a separate package and no precision sub-mount and flip-chip bonding processes are required. The design allows for on-wafer probing of the completed arrays prior to singulation of the die from the wafer. Embodiments relate to semiconductor devices, and more particularly to multibeam arrays of semiconductor lasers for high power and high frequency applications and methods of making and using the same.
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公开(公告)号：US20180172885A1
公开(公告)日：2018-06-21
申请号：US15898048
申请日：2018-02-15
Applicant: TRILUMINA CORP.
Inventor： Richard F. CARSON , John R. JOSEPH , Mial E. WARREN , Thomas A. WILCOX
CPC classification number: G02B3/0012 , B01J8/00 , B01J2208/00008 , G02B1/14 , G02B3/0018 , G02B3/0025 , G02B3/0037 , G02B3/0043 , G02B3/0056 , G02B7/005 , H01J37/32009 , H01J2237/10 , H01J2237/334 , H01S5/005 , H01S5/423
Abstract: Embodiments comprise a system created through fabricating a lens array through which lasers are emitted. The lens array may be fabricated in the semiconductor substrate used for fabricating the lasers or may be a separate substrate of other transparent material that would be aligned to the lasers. In some embodiments, more lenses may be produced than will eventually be used by the lasers. The inner portion of the substrate may be formed with the lenses that will be used for emitting lasers, and the outer portion of the substrate may be formed with lenses that will not be used for emitting lasers—rather, through etching these additional lenses, the inner lenses may be created with a higher quality.
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公开(公告)号：US20170299781A1
公开(公告)日：2017-10-19
申请号：US15133094
申请日：2016-04-19
Applicant: TRILUMINA CORP.
Inventor： Richard F. CARSON , John R. JOSEPH , Mial E. WARREN , Thomas A. WILCOX
CPC classification number: G02B3/0012 , B01J8/00 , B01J2208/00008 , G02B1/14 , G02B3/0018 , G02B3/0025 , G02B3/0037 , G02B3/0043 , G02B3/0056 , G02B7/005 , H01J37/32009 , H01J2237/10 , H01J2237/334 , H01S5/005 , H01S5/423
Abstract: Embodiments comprise a system created through fabricating a lens array through which lasers are emitted. The lens array may be fabricated in the semiconductor substrate used for fabricating the lasers or may be a separate substrate of other transparent material that would be aligned to the lasers. In some embodiments, more lenses may be produced than will eventually be used by the lasers. The inner portion of the substrate may be formed with the lenses that will be used for emitting lasers, and the outer portion of the substrate may be formed with lenses that will not be used for emitting lasers—rather, through etching these additional lenses, the inner lenses may be created with a higher quality.
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