摘要:
Subbanks are arranged in four regions of a DRAM macro having a rectangular shape, bank control circuits are arranged in a prescribed region between these subbanks, and internal read/write data buses are arranged in a region different from the region where the bank control circuits are arranged. Since there is no crossing of the bank control circuits and the internal read/write data buses, the bank control circuits can be efficiently arranged to reduce the layout area. Accordingly, a semiconductor integrated circuit device including multi-bank memories which operates stably at high speed can be provided without increase of an area occupied by a chip.
摘要:
A first internal power supply circuit receiving an external power supply voltage for generating a first internal power supply voltage and a second internal power supply circuit receiving the external power supply voltage for generating a second internal power supply voltage are provided within a DRAM. A sense amplifier operates by the first internal power supply voltage. A write driver and a GIO line precharge circuit operate by the second internal power supply voltage. A peripheral circuit operates by the external power supply voltage. As a result, the sense amplifier and the peripheral circuit will not be affected by the operation of the write driver and the GIO line precharge circuit.
摘要:
Columns included in a sub-block are divided into first and second groups. If a defective memory cell column is present in the first group, an address comparison circuit activates a signal to select a redundant memory cell column, then selection prohibiting signal attains an "L" level based on information programmed in a programming circuit, a selection of a column in the first group is prohibited, and a redundant memory cell column selection signal is activated. Meanwhile, a normal selecting operation is performed to the second column group.
摘要:
A semiconductor integrated circuit device includes a logic circuit and a synchronous dynamic random access memory including a core unit, integrated on a single semiconductor chip. The semiconductor integrated circuit device includes a synchronous dynamic random access memory control circuit which receives external control signals for the synchronous dynamic random access memory from the logic circuit, and outputs internal control signals to the core unit of the synchronous dynamic random access memory. For testing of semiconductor integrated circuit device, external test signals are provided through external terminals. The external test signals are selected by a selector and are provided to the core unit of the synchronous dynamic random access memory for testing.
摘要:
A semiconductor integrated circuit device includes a logic circuit and a synchronous dynamic random access memory including a core unit, integrated on a single semiconductor chip. The semiconductor integrated circuit device includes a synchronous dynamic random access memory control circuit which receives external control signals for the synchronous dynamic random access memory from the logic circuit, and outputs internal control signals to the core unit of the synchronous dynamic random access memory. For testing of semiconductor integrated circuit device, external test signals are provided through external terminals. The external test signals are selected by a selector, and are provided to the core unit of the synchronous dynamic random access memory for testing.
摘要:
A memory module is provided with switch groups (SD0a to SD7a) in corresponding relation to data lines (DQ0 to DQ63) connected to memory devices (MD0 to MD7). The switch groups (SD0a to SD7a) connect all of the data lines (DQ0 to DQ63) to a portion external to the memory module (MMa) in a memory operation, and connect all of the data lines (DQ0 to DQ63) to inputs of an exclusive NOR circuit (EXa) after common 1-bit data is written into the memory devices (MD0 to MD7) in a testing operation. A malfunction of the memory devices (MD0 to MD7) is detected using an output signal (TMSa) from the exclusive NOR circuit (EXa). The memory module is accomplished which allows an inexpensive tester to conduct an electrical assembly check and a simple data write and read operation test upon the memory devices, which includes a small number of I/O pins for the check and test, and which does not deteriorate data input/output characteristics of the memory devices.
摘要:
A memory cell array of a dynamic semiconductor memory device is divided into a plurality of memory cell blocks. A block selecting circuit selects and refreshes larger number of memory cell blocks in refreshing mode than the number of those selected during normal mode. Sense amplifiers in the memory cell blocks selected by the block selecting circuit are selectively driven with smaller driving force in refreshing mode than that in normal mode. More preferably the driving force is changed during the amplifying operation so as to achieve both the high sensitivity and the suppression of the peak value of the operational current.
摘要:
A boosting circuit is provided applicable in various semiconductor integrated circuits such as a word line boosting circuit in a semiconductor memory. Because a backgate electrode of a PMOS transistor connected between power supply potential and an output node is connected to the output node, the output node is precharged to the Vcc level during a boosting term. Therefore, the boosting condition by a MOS capacitor is alleviated in comparison with a conventional boosting circuit. Proper boosting operation can be carried out even at a lower level of a supplied power supply voltage. Therefore, operable margin of power supply voltage is enlarged.
摘要:
In a test mode, bit information of the same logic is written into a corresponding memory cell of each of subarray 5a-5d. Bit information written in respective memory cells is simultaneously read and supplied to exclusive-OR gates 12a-12d. Each of exclusive-OR gates logics of read bit information and an expected value data supplied as an input to an external input pin D.sub.IN to supply the test determination result as an output. The outputs of respective exclusive-OR gates 12a-12d are serially supplied, through transistors 18a-18d which are sequentially and selectively turned on by a shift register 15, to an external output pin D.sub.OUT.
摘要:
A semiconductor memory device comprises a plurality or CAM cells. In a refreshing operation, data of "1" is applied to all of bit lines and inversion bit lines. In the CAM cells storing the data "1", writing of the data "1" onto the bit lines and the inversion bit lines is performed. Then, the data of "0" is applied to all of the bit lines and the inversion bit lines. In the CAM cells storing the data "0", writing of the data "0" onto the bit lines and the inversion bit lines is performed. In a partial writing operation, in the CAM cells to which writing is performed, a first control node is activated, thereby making it possible to write the CAM cells. In the rest of the CAM cells, the first control node is inactivated, thereby making it impossible to write the CAM cells.