公开(公告)号：US5089353A

公开(公告)日：1992-02-18

申请号：US413997

申请日：1989-09-28

申请人： Taichi Negi ,  Akira Mochizuki ,  Shiro Nagata ,  Komei Yamasaki ,  Keisuke Funaki ,  Takashi Sumitomo

发明人： Taichi Negi ,  Akira Mochizuki ,  Shiro Nagata ,  Komei Yamasaki ,  Keisuke Funaki ,  Takashi Sumitomo

IPC分类号： B32B27/08 ,  C08L23/28 ,  C08L25/06 ,  C08L29/04

CPC分类号： C08L25/06 ,  B32B27/08 ,  C08L29/04 ,  C08L23/28 ,  Y10S264/33 ,  Y10S428/91 ,  Y10T428/1341 ,  Y10T428/1383 ,  Y10T428/31507 ,  Y10T428/3175 ,  Y10T428/31757 ,  Y10T428/31797 ,  Y10T428/3192

摘要： A multi-layer material with a layer (A) of a saponified product of an ethylene-vinyl acetate copolymer having an ethylene content of 20 to 60 mol % and a degree of saponification of at least 90% and a layer (B) of a styrene-based polymer having mainly syndiotactic configuration, or a resin composition comprising 5 to 95 parts by weight of a saponified product of an ethylene-vinyl acetate copolymer (A) having an ethylene content of 20 to 60 mol % and a degreee of saponification of at least 90% and 95 to 5 parts by weight of a styrene-based polymer (B) having mainly syndiotactic configuration has gas barrier properties and markedly improved heat resistance.In a molding comprising the resin composition or the multi-layer material, contents (food) can be stored for a long period of time at ambient temperature. Moreover, after retort sterilization, the container can be heated by boiling, or in a microwave oven or a grill oven (at 220 to 240.degree. C.) in the condition that the contents (food) are placed in the container.

公开(公告)号：US5346950A

公开(公告)日：1994-09-13

申请号：US140886

申请日：1993-10-25

申请人： Taichi Negi ,  Akira Mochizuki ,  Shiro Nagata ,  Komei Yamasaki ,  Keisuke Funaki ,  Takashi Sumitomo

发明人： Taichi Negi ,  Akira Mochizuki ,  Shiro Nagata ,  Komei Yamasaki ,  Keisuke Funaki ,  Takashi Sumitomo

IPC分类号： B32B27/08 ,  C08L23/28 ,  C08L25/06 ,  C08L29/04 ,  C08L29/02 ,  C08L25/04

CPC分类号： C08L25/06 ,  B32B27/08 ,  C08L29/04 ,  C08L23/28 ,  Y10S264/33 ,  Y10S428/91 ,  Y10T428/1341 ,  Y10T428/1383 ,  Y10T428/31507 ,  Y10T428/3175 ,  Y10T428/31757 ,  Y10T428/31797 ,  Y10T428/3192

摘要： A resin composition comprising 5 to 95 parts by weight of a saponified product of an ethylene-vinyl acetate copolymer (A) having an ethylene content of 20 to 60 mol % and a degree of saponification of at least 90% and 95 to 5 parts by weight of a styrene-based polymer (B) having mainly syndiotactic configuration. The resin composition has gas barrier properties and a markedly improved heat resistance.

摘要翻译： 一种树脂组合物，其包含5至95重量份的乙烯 - 乙酸乙烯酯共聚物（A）的皂化产物，其乙烯含量为20至60摩尔％，皂化度为至少90％和95至5重量份 重量的主要是间同构型的苯乙烯基聚合物（B）。 树脂组合物具有阻气性和显着改善的耐热性。

公开(公告)号：US5270353A

公开(公告)日：1993-12-14

申请号：US782746

申请日：1991-10-18

申请人： Akikazu Nakano ,  Takashi Sumitomo ,  Komei Yamasaki ,  Keisuke Funaki

发明人： Akikazu Nakano ,  Takashi Sumitomo ,  Komei Yamasaki ,  Keisuke Funaki

IPC分类号： C08K9/04 ,  C08L25/04 ,  C08L25/06 ,  C08L25/08 ,  C08L35/06 ,  C08L51/00 ,  C08L77/00 ,  C08L101/02 ,  C08K9/06

CPC分类号： C08L77/00 ,  C08K9/04 ,  C08L101/02 ,  C08L25/04 ,  C08L25/06 ,  C08L2205/02 ,  C08L25/08 ,  C08L35/06 ,  C08L51/003

摘要： Disclosed is a resin composition which comprises (a) 5 to 95% by weight of a styrene-based polymer having a syndiotactic configuration, (b) 95 to 9% by weight of a thermoplastic resin having at least one polar group selected from a carboxyl group, a hydroxyl group and an amino group at the terminal; and (c) 0.01 to 15 parts by weight of a styrene-based copolymer obtained by copolymerizing a styrene compound with a vinyl compound having an epoxy group or a styrene-based copolymer obtained by copolymerizing a styrene compound with an .alpha.,.beta.-unsaturated carboxylic acid anhydride based on 100 parts by weight of the aobve components (a) and (b). The composition exhibits no laminar peeling and has an excellent appearance because affinity and dispersibility of the styrene-based polymer and the thermoplastic resin are improved, and a polystyrene-based resin composition improved in mechanical strength can also be obtained without using a complicated process.

摘要翻译： 公开了一种树脂组合物，其包含（a）5至95重量％的具有间同立构构型的苯乙烯基聚合物，（b）95至9重量％的具有至少一个选自羧基的极性基团的热塑性树脂 基团，末端的羟基和氨基; 和（c）通过将苯乙烯化合物与具有环氧基的乙烯基化合物或苯乙烯基共聚物共聚获得的苯乙烯基共聚物0.01至15重量份，所述共聚物通过将苯乙烯化合物与α，β-不饱和羧酸 基于100重量份的aob成分（a）和（b）的酸酐。 由于苯乙烯类聚合物和热塑性树脂的亲和性和分散性提高，所以组合物不会发生层状剥离，外观好，能够在不使用复杂的工序的情况下得到改善机械强度的聚苯乙烯类树脂组合物。

公开(公告)号：US5109068A

公开(公告)日：1992-04-28

申请号：US389258

申请日：1989-08-02

申请人： Komei Yamasaki ,  Keisuke Funaki ,  Akikazu Nakano ,  Takashi Sumitomo

发明人： Komei Yamasaki ,  Keisuke Funaki ,  Akikazu Nakano ,  Takashi Sumitomo

IPC分类号： B29C55/00 ,  C08J5/18 ,  C08K5/00 ,  C08L25/06 ,  C08L71/00 ,  C08L71/12 ,  C08L75/00 ,  C08L81/00 ,  C08L83/04 ,  C08L85/02

CPC分类号： C08L25/06 ,  B29C55/005 ,  C08J5/18 ,  C08K5/0066 ,  C08L71/123 ,  B29K2025/00 ,  B29K2071/12 ,  B29K2105/0026 ,  C08J2325/06 ,  C08L71/00 ,  C08L75/00 ,  C08L81/00 ,  C08L83/04 ,  C08L85/02 ,  Y10S525/905

摘要： There is disclosed a styrene-based polymer composition which comprises(A) 10 to 98% by weight of a styrene-based polymer having syndiotactic configuration with a racemic pentad of 30% or more and(B) 90 to 2% by weight of polyphenylene ether having an inrinsic viscosity of 0.28 dl/g or more at 30.degree. C. in chloroform.Also, a flame retarder, a flame-retardant aid, a rubber-like elastomer or an inorganic filler may optionally be added to the composition.Further, also disclosed is a stretched molding comprising stretching the above composition.

公开(公告)号：US5286762A

公开(公告)日：1994-02-15

申请号：US44096

申请日：1993-03-08

申请人： Keisuke Funaki ,  Komei Yamasaki

发明人： Keisuke Funaki ,  Komei Yamasaki

IPC分类号： B29C35/08 ,  B29C45/00 ,  B29C47/00 ,  B29C49/00 ,  B29C55/00 ,  B29C71/04 ,  C08J3/28 ,  C08L25/06 ,  C08L25/16

CPC分类号： B29C55/005 ,  B29C71/04 ,  B29C2035/0877 ,  B29C45/00 ,  B29C47/00 ,  B29C47/0004 ,  B29C47/0021 ,  B29C47/0057 ,  B29C49/00 ,  B29K2025/00 ,  B29L2007/002 ,  B29L2031/3061 ,  B29L2031/712

摘要： A styrene-based polymer molding is obtained by molding a styrene-based polymer having mainly syndiotactic configuration and then irradiating the molding thus obtained with electron rays. This molding is excellent in heat resistance and further inexpensive. Thus the molding is useful as a material required to have high heat resistance, such as a structural material, a food container material, a food wrapping material or an electric or electronic part material, particularly as an electric or electronic part material, because it is excellent in soldering resistance.

摘要翻译： 通过成型具有间同立构构型的苯乙烯类聚合物，然后用电子射线照射由此获得的模制物，得到苯乙烯类聚合物成型体。 该成型品的耐热性优异，成本低廉。 因此，模制品可用作具有高耐热性的材料，例如结构材料，食品容器材料，食品包装材料或电气或电子部件材料，特别是作为电气或电子部件材料，因为它是 优异的耐焊接性。

公开(公告)号：US5004649A

公开(公告)日：1991-04-02

申请号：US327815

申请日：1989-03-23

申请人： Komei Yamasaki ,  Keisuke Funaki

发明人： Komei Yamasaki ,  Keisuke Funaki

IPC分类号： B32B27/30 ,  G11B5/73 ,  H01G4/18 ,  H01G4/20 ,  H05K1/00 ,  H05K1/03

CPC分类号： H01G4/18 ,  B32B27/30 ,  G11B5/7305 ,  H01G4/20 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  Y10S428/91 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31746 ,  Y10T428/31757 ,  Y10T428/31797

摘要： A resin laminate comprising a layer of styrene-based polymer having mainly syndiotactic configuration and a thermoplastic resin layer, a metallized laminate comprising a layer of the styrene-based polymer described above and a metal layer, and process for producing these laminates are disclosed. In the laminate, the styrene-based polymer layer and the thermoplastic resin layer may be biaxially stretched.The laminates are expected to be utilized for electrostatic capacitors, hot stamping foils, flexible printed circuit board substrates, food wrapping films, and other functional films including magnetic tapes, and ornament films.

公开(公告)号：US5164479A

公开(公告)日：1992-11-17

申请号：US464935

申请日：1990-01-16

申请人： Keisuke Funaki ,  Komei Yamasaki

发明人： Keisuke Funaki ,  Komei Yamasaki

IPC分类号： C08L25/04 ,  B29C47/00 ,  B29K25/00 ,  C08F12/00 ,  C08F12/08 ,  C08L25/00 ,  C08L25/06

CPC分类号： B29C47/0004 ,  C08L25/06 ,  B29C47/0014 ,  B29C47/0021 ,  B29C47/0023 ,  B29K2025/00 ,  Y10T428/2982

摘要： Disclosed are a material for extrusion molding comprising a styrene-based polymer having a high degree of syndiotactic configuration, a melt viscosity of 10.sup.3 to less than 10.sup.6 poise measured at 300.degree. C. and a shearing rate of 10/sec, and a crystallinity of 15% or more, a process for preparation of the said material and a process for preparation of a molding product therefrom.The molding product prepared according to the present invention has excellent properties such as heat resistance and chemical resistance.

公开(公告)号：US5156797A

公开(公告)日：1992-10-20

申请号：US775690

申请日：1991-10-10

申请人： Komei Yamasaki ,  Keisuke Funaki

发明人： Komei Yamasaki ,  Keisuke Funaki

IPC分类号： D01F6/22 ,  D04H1/42

CPC分类号： D01F6/22 ,  D04H1/4291

摘要： Nonwoven fabrics are disclosed, which are produced by molding a material containing as a main component a styrene-based polymer with mainly syndiotactic configuration, in such a manner that a difference between the absolute value of heat of fusion .vertline..DELTA.Hf.vertline. and the absolute value of crystallizing enthalpy on heating .vertline..DELTA.Htcc.vertline. of the molded polymer is at least 1 cal/g. These nonwoven fabrics are excellent in heat-resistant and chemical-resistant characteristics, and are suitable for use as medical fabrics, industrial filters, battery separators and so forth.

摘要翻译： 公开了以下方式制造的无纺布，其以包含主要成分的主要成分为主要间同立构构型的苯乙烯类聚合物，以熔融热绝对值| DELTA Hf|和绝对值 在加热时结晶焓|模塑聚合物的DELTA Htcc|为至少1cal / g。 这些无纺布耐热耐化学特性优异，适用于医用织物，工业过滤器，电池隔板等。

公开(公告)号：US5518817A

公开(公告)日：1996-05-21

申请号：US272627

申请日：1994-07-11

申请人： Komei Yamasaki ,  Keisuke Funaki

发明人： Komei Yamasaki ,  Keisuke Funaki

IPC分类号： B32B27/30 ,  G11B5/73 ,  H01G4/18 ,  H01G4/20 ,  H05K1/00 ,  H05K1/03 ,  B32B15/08 ,  B32B27/34 ,  B32B27/36

CPC分类号： H01G4/18 ,  B32B27/30 ,  G11B5/7305 ,  H01G4/20 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  Y10S428/91 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31746 ,  Y10T428/31757 ,  Y10T428/31797

摘要： A resin laminate comprising layer of styrene-based polymer having mainly syndiotactic configuration and a thermoplastic resin layer, a metallized laminate comprising a layer of the styrene-based polymer described above and a metal layer, and process for producing these laminates are disclosed. In the laminate, the styrene-based polymer layer and the thermoplastic resin layer may be biaxially stretched.The laminates are expected to be utilized for electrostatic capacitors, hot stamping foils, flexible printed circuit board substrates, food wrapping films, and other functional films including magnetic tapes, and ornament films.

摘要翻译： 公开了一种树脂层压体，其包含主要具有间同立构构型的苯乙烯基聚合物层和热塑性树脂层，包含上述苯乙烯基聚合物层的金属化层压体和金属层，以及用于制备这些层压板的方法。 在层压体中，苯乙烯类聚合物层和热塑性树脂层可以双轴拉伸。 层压板预期用于静电电容器，热压箔，柔性印刷电路板基板，食品包装膜以及其它功能膜，包括磁带和装饰膜。

公开(公告)号：US5373031A

公开(公告)日：1994-12-13

申请号：US123227

申请日：1993-09-20

申请人： Keisuke Funaki ,  Komei Yamasaki

发明人： Keisuke Funaki ,  Komei Yamasaki

IPC分类号： B29C35/08 ,  B29C45/00 ,  B29C47/00 ,  B29C49/00 ,  B29C55/00 ,  B29C71/04 ,  C08J3/28 ,  C08F4/34 ,  C08F257/02 ,  C08J5/18

CPC分类号： B29C55/005 ,  B29C71/04 ,  B29C2035/0877 ,  B29C45/00 ,  B29C47/00 ,  B29C47/0004 ,  B29C47/0021 ,  B29C47/0057 ,  B29C49/00 ,  B29K2025/00 ,  B29L2007/002 ,  B29L2031/3061 ,  B29L2031/712

摘要： A styrene-based polymer molding is obtained molding a styrene-based polymer having mainly syndiotactic configuration and then irradiating the molding thus obtained with electron rays. This molding is excellent in heat resistance and further inexpensive. Thus the molding is useful as a material required to have high heat resistance, such as a structural material, a food container material, a food wrapping material or an electric or electronic part material, particularly as an electric or electronic part material, because it is excellent in soldering resistance.

摘要翻译： 得到主要具有间同立构构型的苯乙烯类聚合物，然后用电子射线照射由此获得的模制品的苯乙烯基聚合物模制品。 该成型品的耐热性优异，成本低廉。 因此，模制品可用作具有高耐热性的材料，例如结构材料，食品容器材料，食品包装材料或电气或电子部件材料，特别是作为电气或电子部件材料，因为它是 优异的耐焊接性。