Abstract:
An apparatus and method for providing a phase noise built-in self test (BIST) circuit are disclosed herein. In some embodiments, a method and apparatus for forming a multi-stage noise shaping (MASH) type high-order delta sigma (ΔΣ) time-to-digital converter (TDC) are disclosed. In some embodiments, an apparatus includes a plurality of first-order ΔΣ TDCs formed in an integrated circuit (IC) chip, wherein each of the first-order ΔΣ TDCs are connected to one another in a MASH type configuration to provide the MASH type high-order ΔΣ TDC, wherein the MASH type high-order ΔΣ TDC is configured to measure the phase noise of a device under text (DUT).
Abstract:
A die stack comprises a first integrated circuit (IC) die having at least a first device comprising a first source, a first drain and a first gate electrode above a first channel region between the first source and the first drain. A second IC die has at least a second device comprising a second source, a second drain and a second gate electrode above a second channel region between the second source and the second drain. The second gate electrode is connected to the first gate electrode by a path including a first through substrate via (TSV), the second drain connected to the first source by a path including a second TSV.
Abstract:
A die stack comprises a first integrated circuit (IC) die having at least a first device comprising a first source, a first drain and a first gate electrode above a first channel region between the first source and the first drain. A second IC die has at least a second device comprising a second source, a second drain and a second gate electrode above a second channel region between the second source and the second drain. The second gate electrode is connected to the first gate electrode by a path including a first through substrate via (TSV), the second drain connected to the first source by a path including a second TSV.
Abstract:
A realignment ring-cell circuit is disclosed. The circuit includes a single-to-differential unit, an OR gate, an AND gate, a first P-type metal-oxide-semiconductor transistor, and a first N-type metal-oxide-semiconductor transistor. The single-to-differential unit has an input configured to receive a realignment signal, a first output for outputting a first differential output and a second output for outputting a second differential output. The first output for outputting is a first input to the OR gate. The second output for outputting is a first input to the AND gate. A gate of the P-type metal-oxide-semiconductor transistor is electrically connected to an output of the OR gate. A gate of the N-type metal-oxide-semiconductor transistor is electrically connected to an output of the AND gate. A drain of the P-type metal-oxide-semiconductor transistor and a drain of the N-type metal-oxide-semiconductor transistor are electrically connected to each other and are further electrically connected to a second input of the OR gate and a second input of the AND gate.
Abstract:
A circuit having a tracking loop and a realignment loop is disclosed. The circuit includes: a phase frequency detector (PFD) module for comparing a phase difference of a first input signal and a second input signal; a pump module for converting PFD phase error to charge, wherein the pump module further comprises a low pass filter (LPF); an adjustable realignment module for adjusting a realignment strength, the adjustable realignment module receives a first plurality of inputs from the PFD module, the adjustable realignment module transmits a second plurality of outputs to the pump module; and a ring oscillator unit, the ring oscillator unit receives a first input from the pump module and a second input from the adjustable realignment module, and based on the first and second inputs produces a feedback signal.
Abstract:
A die stack comprises a first integrated circuit (IC) die having at least a first device comprising a first source, a first drain and a first gate electrode above a first channel region between the first source and the first drain. A second IC die has at least a second device comprising a second source, a second drain and a second gate electrode above a second channel region between the second source and the second drain. The second gate electrode is connected to the first gate electrode by a path including a first through substrate via (TSV), the second drain connected to the first source by a path including a second TSV.
Abstract:
The present disclosure describes an example method for cell placement in an integrated circuit (IC) layout design. The method includes defining a layout unit for a circuit implementation and arranging multiple layout units into a layout cell. The method also includes editing the layout cell to connect a first set of the layout units to be representative of the circuit implementation and to connect a second set of the layout units to be representative of a non-functional circuit. Further, the method includes inserting one or more dummy fill structures in areas of the layout cell unoccupied by the first and second sets of layout units.
Abstract:
An apparatus and method for providing a phase noise built-in self test (BIST) circuit are disclosed herein. In some embodiments, a method and apparatus for forming a multi-stage noise shaping (MASH) type high-order delta sigma (ΔΣ) time-to-digital converter (TDC) are disclosed. In some embodiments, an apparatus includes a plurality of first-order ΔΣ TDCs formed in an integrated circuit (IC) chip, wherein each of the first-order ΔΣ TDCs are connected to one another in a MASH type configuration to provide the MASH type high-order ΔΣ TDC, wherein the MASH type high-order ΔΣ TDC is configured to measure the phase noise of a device under text (DUT).
Abstract:
A ring oscillator is provided. The ring oscillator includes a pseudo pass-gate inverter, a third transistor, a fourth transistor and a delay chain. The pseudo pass-gate inverter includes a first transistor and a second transistor in series. The third transistor is connected in series with the pseudo pass-gate inverter. The drain of the fourth transistor is connected to an output of the pseudo pass-gate inverter. The gate of the fourth transistor is connected to the gate of the third transistor to receive the realignment signal. The delay chain includes a plurality of delay cells. An input of the delay chain is connected to the output of the pseudo pass-gate inverter. When the realignment signal is in a realignment state, the third transistor is turned off, the fourth transistor is turned on.
Abstract:
A system and method is disclosed for adaptively adjusting a duty cycle of a signal between a first and second chip in a 3D architecture/stack for adaptively calibrating a chip in a 3D architecture/stack. In one embodiment, the system includes a first chip and a second chip located within the 3D chip stack, wherein the first chip generates a calibration signal, the second chip receives the calibration signal and compares it to a reference signal to generate a comparison signal that further compared to a reference duty signal to generate a reference duty comparison signal, that is then provided to the first chip to generate a drive signal that adjusts a duty cycle of the calibration signal.