Electrostatic discharge device
    1.
    发明授权

    公开(公告)号:US11380673B2

    公开(公告)日:2022-07-05

    申请号:US17107694

    申请日:2020-11-30

    Abstract: An Electro-Static Discharge (ESD) includes a first well having a first conductivity type on a substrate. The device further includes a second well within the first well. The second well has a second conductivity type. The device further includes a third well within the first well. The third well has the second conductivity type. The device further includes a first gate device disposed over the first well, a plurality of active regions between the first gate device and the dummy gate, and a dummy gate disposed within a space between the active regions. The dummy gate is positioned over a space between the second and third wells.

    Electrostatic discharge device
    2.
    发明授权

    公开(公告)号:US10854595B2

    公开(公告)日:2020-12-01

    申请号:US16219747

    申请日:2018-12-13

    Abstract: An Electro-Static Discharge (ESD) includes a first well having a first conductivity type on a substrate. The device further includes a second well within the first well. The second well has a second conductivity type. The device further includes a third well within the first well. The third well has the second conductivity type. The device further includes a first gate device disposed over the first well, a plurality of active regions between the first gate device and the dummy gate, and a dummy gate disposed within a space between the active regions. The dummy gate is positioned over a space between the second and third wells.

    Embedded Semiconductor Region for Latch-Up Susceptibility Improvement

    公开(公告)号:US20220352159A1

    公开(公告)日:2022-11-03

    申请号:US17867453

    申请日:2022-07-18

    Abstract: The present disclosure describes a metal-oxide-semiconductor field-effect transistor (MOSFET) device. The MOSFET device includes a first-type substrate, a deep-second-type well in the first-type substrate, a first-type well over the deep-second-type well, and a second-type well over the deep-second-type well. The second-type well and the deep-second-type well form an enclosed space that includes the first-type well. The MOSFET also includes an embedded semiconductor region (ESR) in a vicinity of the enclosed space. The ESR includes a dopant concentration lower than at least one of a dopant concentration of the first-type well, a dopant concentration of the second-type well, and a dopant concentration of the deep-second-type well.

    Capacitor cell and structure thereof

    公开(公告)号:US10971495B2

    公开(公告)日:2021-04-06

    申请号:US16591064

    申请日:2019-10-02

    Abstract: A capacitor cell is provided. A first PMOS transistor is coupled between a power supply and a first node, and has a gate connected to a second node. A first NMOS transistor is coupled between a ground and the second node, and has a gate connected to the first node. A second PMOS transistor is coupled between the second node and the first node, and has a gate connected to the second node. A second NMOS transistor has a drain connected to the first node, a gate connected to the first node, and a source connected to the ground or the second node. The first and second PMOS transistors and the first and second NMOS transistors are arranged in the same row. The second PMOS transistor is disposed between the first PMOS transistor and the first and second NMOS transistors.

    EMBEDDED SEMICONDUCTOR REGION FOR LATCH-UP SUSCEPTIBILITY IMPROVEMENT

    公开(公告)号:US20190096886A1

    公开(公告)日:2019-03-28

    申请号:US15881215

    申请日:2018-01-26

    Abstract: The present disclosure describes a metal-oxide-semiconductor field-effect transistor (MOSFET) device. The MOSFET device includes a first-type substrate, a deep-second-type well in the first-type substrate, a first-type well over the deep-second-type well, and a second-type well over the deep-second-type well. The second-type well and the deep-second-type well form an enclosed space that includes the first-type well. The MOSFET also includes an embedded semiconductor region (ESR) in a vicinity of the enclosed space. The ESR includes a dopant concentration lower than at least one of a dopant concentration of the first-type well, a dopant concentration of the second-type well, and a dopant concentration of the deep-second-type well.

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