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公开(公告)号：US20230366857A1
公开(公告)日：2023-11-16
申请号：US18354786
申请日：2023-07-19
发明人： Jun-Hao Deng , Kuan-Wen Lin , Sheng-Chi Chin , Yu-Ching Lee
IPC分类号： G01N29/44 , H01L21/288 , H01L21/02 , G01B21/16 , G01B17/00 , B08B3/04 , G01B17/02 , H01L21/66 , B08B13/00 , B08B5/02 , H01L21/67
CPC分类号： G01N29/44 , H01L21/288 , H01L21/02623 , G01B21/16 , G01B17/00 , B08B3/04 , H01L21/02041 , G01B17/025 , H01L21/02282 , H01L22/10 , B08B13/00 , B08B5/02 , G01B17/02 , H01L21/67253 , G01N2291/044
摘要： Methods and systems disclosed herein use acoustic energy to determine a gap between a wafer and an integrated circuit (IC) processing system and/or determine a thickness of a material layer of the wafer during IC processing implemented by the IC processing system. An exemplary method includes emitting acoustic energy through a substrate and a material layer disposed thereover. The substrate is positioned within an IC processing system. The method further includes receiving reflected acoustic energy from a surface of the substrate and a surface of the material layer disposed thereover and converting the reflected acoustic energy into electrical signals. The electrical signals indicate a thickness of the material layer.
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公开(公告)号：US20170139322A1
公开(公告)日：2017-05-18
申请号：US14942633
申请日：2015-11-16
发明人： Ching-Wei Shen , Chi-Lun Lu , Kuan-Wen Lin
CPC分类号： G03F1/86 , B08B3/08 , B08B3/10 , B08B7/0035 , G03F1/22 , G03F1/72 , G03F1/82 , G03F1/84 , G03F7/2004 , G03F7/32
摘要： The present disclosure provides a method of repairing a mask. The method includes inspecting a mask to identify a defect on the mask; performing a cleaning process to the mask using a non-thermal chemical solution to the mask; and repairing the mask to remove the defect from the mask. The non-thermal chemical solution is cooled by a cooling module to a working temperature below room temperature.
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公开(公告)号：US20170003585A1
公开(公告)日：2017-01-05
申请号：US14754902
申请日：2015-06-30
发明人： Kuan-Wen Lin , Sheng-Chi Chin , Ting-Hao Hsu , Tzu-Ting Chou , Shu-Hsien Wu
IPC分类号： G03F1/64
CPC分类号： G03F1/64 , G03B27/62 , G03B27/6242 , G03B27/625 , G03F1/62
摘要： A pellicle mask assembly includes a mask, a pellicle frame, and a pellicle membrane. The pellicle frame has a bottom side attached to the mask, and a top side covered by the pellicle membrane. The pellicle frame includes a coating on its inner surface and the coating is configured to monitor a change of environment inside the pellicle mask assembly. In embodiments, the change of environment includes increased humidity and/or increased chemical ion density inside the pellicle mask assembly. Methods of making and using the pellicle mask assembly are also disclosed.
摘要翻译： 防护薄膜组件包括掩模，防护薄膜框架和防护薄膜。 防护膜框架具有附接到掩模的底侧和由防护薄膜覆盖的顶侧。 防护薄膜框架在其内表面上包括涂层，并且涂层被配置为监测防护薄膜组件中的环境变化。 在实施方案中，环境变化包括防护薄膜组件中的增加的湿度和/或增加的化学离子密度。 还公开了制造和使用防护薄膜组件的方法。
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公开(公告)号：US12085866B2
公开(公告)日：2024-09-10
申请号：US18200951
申请日：2023-05-23
发明人： Chen-Yang Lin , Da-Wei Yu , Li-Hsin Wang , Kuan-Wen Lin , Chia-Jen Chen , Hsin-Chang Lee
CPC分类号： G03F7/70925 , G03F1/22 , G03F1/82
摘要： A photolithographic apparatus includes a particle removing cassette, a pump and a compressor. The particle removing cassette includes a first slit that includes an array of parallel wind blade nozzles arranged along a length of the first slit, protruding from the first slit, and configured to eject and direct pressurized cleaning material to a patterning surface of a mask to remove debris particles on the patterning surface. The pump and the compressor are controlled by a controller to adjust a flow rate and a pressure of the pressurized cleaning material based on an amount of debris particles on the patterning surface of the mask.
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公开(公告)号：US12032302B2
公开(公告)日：2024-07-09
申请号：US17367835
申请日：2021-07-06
发明人： Chung-Hsuan Liu , Chen-Yang Lin , Ku-Hsiang Sung , Da-Wei Yu , Kuan-Wen Lin , Chia-Jen Chen , Hsin-Chang Lee
CPC分类号： G03F7/70925 , B08B7/0035 , B08B13/00 , H01L21/02057 , H01L22/12 , H05H1/01
摘要： In a method of manufacturing a semiconductor device a semiconductor wafer is retrieved from a load port. The semiconductor wafer is transferred to a treatment device. In the treatment device, the surface of the semiconductor wafer is exposed to a directional stream of plasma wind to clean a particle from the surface of the semiconductor wafer. The stream of plasma wind is generated by an ambient plasma generator and is directed at an oblique angle with respect to a perpendicular plane to the surface of the semiconductor wafer for a predetermined plasma exposure time. After the cleaning, a photo resist layer is disposed on the semiconductor wafer.
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公开(公告)号：US11698592B2
公开(公告)日：2023-07-11
申请号：US17713012
申请日：2022-04-04
发明人： Chen-Yang Lin , Da-Wei Yu , Li-Hsin Wang , Kuan-Wen Lin , Chia-Jen Chen , Hsin-Chang Lee
CPC分类号： G03F7/70925 , G03F1/22 , G03F1/82
摘要： An photolithographic apparatus includes a particle removing cassette selectively extendable from the processing apparatus. The particle removing cassette includes a wind blade slit and an exhausting slit. The wind blade slit is configured to direct pressurized cleaning material to a surface of the mask to remove the debris particles from the surface of the mask. The exhausting slit collects the debris particles separated from the surface of the mask and contaminants through the exhaust line. In some embodiments, the wind blade slit includes an array of wind blade nozzles spaced apart within the wind blade slit. In some embodiments, the exhausting slit includes array of exhaust lines spaced apart within the exhausting slit.
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公开(公告)号：US20180157168A1
公开(公告)日：2018-06-07
申请号：US15888421
申请日：2018-02-05
发明人： Ching-Wei Shen , Chi-Lun Lu , Kuan-Wen Lin
摘要： A method includes directing an acoustically agitated fluid stream at a first surface of a substrate to cause the substrate to vibrate mechanically thereby dislodging contaminant particles on the substrate. The first surface of the substrate is opposite a second surface of the substrate. The second surface of the substrate includes a pattern. An amplitude of the acoustically agitated fluid stream is configured to produce an acoustic response along an entirety of the second surface.
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公开(公告)号：US09740094B2
公开(公告)日：2017-08-22
申请号：US14832099
申请日：2015-08-21
发明人： Kuan-Wen Lin , Chi-Lun Lu , Ching-Wei Shen , Shu-Hsien Wu
CPC分类号： G03F1/82 , B08B3/02 , B08B3/08 , B08B3/10 , C11D3/3947 , C11D7/08 , C11D7/10 , C11D7/265 , C11D7/34 , C11D11/0041 , C11D11/0047 , G03F7/2004
摘要： A method of cleaning a photomask is disclosed. The method includes mixing a first chemical solution with a second chemical solution; and discharging the mixed chemical solution through an outlet of a nozzle to a surface of the photomask on which includes a ruthenium (Ru) layer, wherein the first chemical solution is configured to dislodge contaminant particles from the surface of the photomask and the second chemical solution is configured to provide an electron to the first chemical solution.
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公开(公告)号：US09665000B1
公开(公告)日：2017-05-30
申请号：US14942633
申请日：2015-11-16
发明人： Ching-Wei Shen , Chi-Lun Lu , Kuan-Wen Lin
IPC分类号： G03F1/86 , G03F1/82 , G03F1/22 , G03F7/20 , G03F7/32 , B08B3/08 , B08B3/10 , B08B7/00 , G03F1/72 , G03F1/84
CPC分类号： G03F1/86 , B08B3/08 , B08B3/10 , B08B7/0035 , G03F1/22 , G03F1/72 , G03F1/82 , G03F1/84 , G03F7/2004 , G03F7/32
摘要： The present disclosure provides a method of repairing a mask. The method includes inspecting a mask to identify a defect on the mask; performing a cleaning process to the mask using a non-thermal chemical solution to the mask; and repairing the mask to remove the defect from the mask. The non-thermal chemical solution is cooled by a cooling module to a working temperature below room temperature.
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公开(公告)号：US09418847B2
公开(公告)日：2016-08-16
申请号：US14163287
申请日：2014-01-24
发明人： Ching-Wei Shen , Kuan-Wen Lin , Chi-Lun Lu , Ting-Hao Hsu , Sheng-Chi Chin , Anthony Yen
IPC分类号： G03F1/62 , H01L21/027 , G03F1/48 , G03F7/20
CPC分类号： H01L21/0274 , G03F1/48 , G03F1/62 , G03F7/70283 , G03F7/70916 , G03F7/7095
摘要： The present disclosure provides an apparatus in semiconductor manufacturing. The apparatus includes a mask, a pellicle frame attached to the mask, and a pellicle joined to the pellicle frame thereby forming a sealed enclosure bounded by the pellicle, the pellicle frame, and the mask. The apparatus further includes photo-catalyst particles introduced into the sealed enclosure before the sealed enclosure is formed. The photo-catalyst particles prevent haze formation within the enclosure during lithography exposure processes.
摘要翻译： 本公开提供了半导体制造中的装置。 该装置包括掩模，附着于掩模的防护薄膜组件框架和接合到防护薄膜框架上的防护薄膜组件，从而形成由防护薄膜组件，防护薄膜框架和掩模限定的密封外壳。 该装置还包括在密封外壳形成之前引入到密封外壳中的光催化剂颗粒。 在光刻曝光过程中，光催化剂颗粒防止外壳内的雾化形成。
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