公开(公告)号：US10157274B2

公开(公告)日：2018-12-18

申请号：US15903128

申请日：2018-02-23

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hsuan Tai ,  Yu-Jen Cheng ,  Chih-Hua Chen ,  Yu-Feng Chen ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  G06F21/32 ,  G06K9/00 ,  H01L25/00 ,  H01L23/00

Abstract: A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.

公开(公告)号：US09904776B2

公开(公告)日：2018-02-27

申请号：US15200871

申请日：2016-07-01

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hsuan Tai ,  Yu-Jen Cheng ,  Chih-Hua Chen ,  Yu-Feng Chen ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  G06F21/32 ,  G06K9/00

CPC classification number: G06F21/32 ,  G06K9/0002 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92244

Abstract: A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.

公开(公告)号：US20170228529A1

公开(公告)日：2017-08-10

申请号：US15200871

申请日：2016-07-01

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hsuan Tai ,  Yu-Jen Cheng ,  Chih-Hua Chen ,  Yu-Feng Chen ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: G06F21/32 ,  H01L23/31 ,  G06K9/00 ,  H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/538 ,  H01L21/48

CPC classification number: G06F21/32 ,  G06K9/0002 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92244

Abstract: A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.

公开(公告)号：US11727714B2

公开(公告)日：2023-08-15

申请号：US17522610

申请日：2021-11-09

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hua Chen ,  Yu-Jen Cheng ,  Chih-Wei Lin ,  Yu-Feng Chen ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: G06V40/13 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

CPC classification number: G06V40/1329 ,  H01L21/561 ,  H01L23/49827 ,  H01L24/19 ,  H01L21/568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92125 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2224/81 ,  H01L2224/97 ,  H01L2224/85

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

公开(公告)号：US20220067334A1

公开(公告)日：2022-03-03

申请号：US17522610

申请日：2021-11-09

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hua Chen ,  Yu-Jen Cheng ,  Chih-Wei Lin ,  Yu-Feng Chen ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: G06K9/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

公开(公告)号：US20190121952A1

公开(公告)日：2019-04-25

申请号：US16221933

申请日：2018-12-17

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hsuan Tai ,  Yu-Jen Cheng ,  Chih-Hua Chen ,  Yu-Feng Chen ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: G06F21/32 ,  H01L23/31 ,  G06K9/00 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

Abstract: A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.

公开(公告)号：US09898645B2

公开(公告)日：2018-02-20

申请号：US15053357

申请日：2016-02-25

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hua Chen ,  Yu-Jen Cheng ,  Chih-Wei Lin ,  Yu-Feng Chen ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: H01L21/28 ,  G06K9/00 ,  H01L21/56 ,  H01L23/498

CPC classification number: G06K9/00053 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49827 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00014

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

公开(公告)号：US11194990B2

公开(公告)日：2021-12-07

申请号：US16390704

申请日：2019-04-22

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hua Chen ,  Yu-Jen Cheng ,  Chih-Wei Lin ,  Yu-Feng Chen ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: G06K9/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

公开(公告)号：US20190244004A1

公开(公告)日：2019-08-08

申请号：US16390704

申请日：2019-04-22

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chih Huang ,  Chih-Hua Chen ,  Yu-Jen Cheng ,  Chih-Wei Lin ,  Yu-Feng Chen ,  Hao-Yi Tsai ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: G06K9/00 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: G06K9/00053 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92125 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/85

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

公开(公告)号：US10125014B2

公开(公告)日：2018-11-13

申请号：US15843372

申请日：2017-12-15

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Kuo Lung Pan ,  Chung-Shi Liu ,  Hao-Yi Tsai ,  Yu-Feng Chen ,  Yu-Jen Cheng

IPC: H01L23/48 ,  B81C1/00 ,  B81B7/00 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/13 ,  H01L23/538 ,  H01L23/15

Abstract: Integrated circuit packages and methods of forming same are provided. A method includes attaching a first die and a second die to a carrier, the first die having a first contact pad, the second die having a second contact pad, the first contact pad and the second contact pad having different structures. A release layer is formed over the first die and the second die. An encapsulant is injected between the carrier and the release layer. One or more redistribution layers (RDLs) are formed over the first die, the second die and the encapsulant, the first contact pad and the second contact pad being in electrical contact with the one or more RDLs.