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公开(公告)号：US11727714B2
公开(公告)日：2023-08-15
申请号：US17522610
申请日：2021-11-09
Inventor： Yu-Chih Huang , Chih-Hua Chen , Yu-Jen Cheng , Chih-Wei Lin , Yu-Feng Chen , Hao-Yi Tsai , Chung-Shi Liu , Chen-Hua Yu
IPC: G06V40/13 , H01L21/56 , H01L23/498 , H01L23/00
CPC classification number: G06V40/1329 , H01L21/561 , H01L23/49827 , H01L24/19 , H01L21/568 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13111 , H01L2224/16227 , H01L2224/18 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73267 , H01L2224/81005 , H01L2224/81024 , H01L2224/81815 , H01L2224/81911 , H01L2224/83005 , H01L2224/85005 , H01L2224/92125 , H01L2224/92244 , H01L2224/97 , H01L2924/15311 , H01L2224/48091 , H01L2924/00014 , H01L2224/97 , H01L2224/83 , H01L2224/97 , H01L2224/81 , H01L2224/97 , H01L2224/85
Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
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公开(公告)号：US20220067334A1
公开(公告)日：2022-03-03
申请号：US17522610
申请日：2021-11-09
Inventor： Yu-Chih Huang , Chih-Hua Chen , Yu-Jen Cheng , Chih-Wei Lin , Yu-Feng Chen , Hao-Yi Tsai , Chung-Shi Liu , Chen-Hua Yu
IPC: G06K9/00 , H01L21/56 , H01L23/498 , H01L23/00
Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
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公开(公告)号：US11075173B2
公开(公告)日：2021-07-27
申请号：US16598796
申请日：2019-10-10
Inventor： Chih-Hsiang Tseng , Yu-Feng Chen , Cheng Jen Lin , Wen-Hsiung Lu , Ming-Da Cheng , Kuo-Ching Hsu , Hong-Seng Shue , Ming-Hong Cha , Chao-Yi Wang , Mirng-Ji Lii
IPC: H01L23/58 , H01L23/31 , H01L23/532 , H01L21/02 , H01L21/48 , H01L23/522
Abstract: A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.
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公开(公告)号：US10853616B2
公开(公告)日：2020-12-01
申请号：US16710478
申请日：2019-12-11
Inventor： Chen-Hua Yu , Yu-Feng Chen , Chih-Hua Chen , Hao-Yi Tsai , Chung-Shi Liu
IPC: G06K9/00 , H01L25/16 , H01L23/00 , H01L23/498 , H01L23/48 , H01L23/31 , H01L21/768 , H01L21/56
Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
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公开(公告)号：US20200058601A1
公开(公告)日：2020-02-20
申请号：US16661785
申请日：2019-10-23
Inventor： Yu-Feng Chen , Yen-Liang Lin , Tin-Hao Kuo , Sheng-Yu Wu , Chen-Shien Chen
IPC: H01L23/00 , H01L23/31 , H01L21/768 , H01L23/485
Abstract: A system and method for preventing cracks in a passivation layer is provided. In an embodiment a contact pad has a first diameter and an opening through the passivation layer has a second diameter, wherein the first diameter is greater than the second diameter by a first distance of about 10 μm. In another embodiment, an underbump metallization is formed through the opening, and the underbump metallization has a third diameter that is greater than the first diameter by a second distance of about 5 μm. In yet another embodiment, a sum of the first distance and the second distance is greater than about 15 μm. In another embodiment the underbump metallization has a first dimension that is less than a dimension of the contact pad and a second dimension that is greater than a dimension of the contact pad.
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Patent Agency Ranking
公开(公告)号：US20190121952A1
公开(公告)日：2019-04-25
申请号：US16221933
申请日：2018-12-17
Inventor： Yu-Chih Huang , Chih-Hsuan Tai , Yu-Jen Cheng , Chih-Hua Chen , Yu-Feng Chen , Hao-Yi Tsai , Chung-Shi Liu , Chen-Hua Yu
IPC: G06F21/32 , H01L23/31 , G06K9/00 , H01L21/48 , H01L21/56 , H01L25/00 , H01L23/538 , H01L25/065 , H01L23/00
Abstract: A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.
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7.发明授权公开(公告)号：US10128208B2
公开(公告)日：2018-11-13
申请号：US15917962
申请日：2018-03-12
Inventor： Hao-Cheng Hou , Yu-Feng Chen , Jung Wei Cheng , Yu-Min Liang , Tsung-Ding Wang
IPC: H01L21/56 , H01L23/00 , H05K3/34 , H01L23/13 , H01L23/498
Abstract: In some embodiments, a package substrate for a semiconductor device includes a substrate core and a material layer disposed over the substrate core. The package substrate includes a spot-faced aperture disposed in the substrate core and the material layer.
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公开(公告)号：US09935073B2
公开(公告)日：2018-04-03
申请号：US15480883
申请日：2017-04-06
Inventor： Yen-Liang Lin , Mirng-Ji Lii , Tin-Hao Kuo , Chen-Shien Chen , Yu-Feng Chen , Sheng-Yu Wu
IPC: H01L23/00 , H01L23/498
CPC classification number: H01L24/17 , H01L21/486 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/13014 , H01L2224/13017 , H01L2224/13111 , H01L2224/13147 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2224/1705 , H01L2224/81191 , H01L2224/81385 , H01L2224/81815 , H01L2924/13091 , H01L2924/15311 , H01L2924/3511 , H01L2924/3512 , H01L2924/3841 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/01083 , H01L2924/01029 , H01L2924/01047 , H01L2924/014
Abstract: The present disclosure provides a semiconductor package, including a semiconductor die and a substrate having a first surface electrically coupled to the semiconductor die and a second surface opposing to the first surface. The first surface includes a core region having a plurality of landing pads and a periphery region surrounding the core region and having a plurality of landing traces. A pitch of the landing pads is from about 55 μm to about 280 μm. The semiconductor die includes a third surface facing the first surface of the substrate and a fourth surface opposing to the third surface. The third surface includes a plurality of elongated bump positioned correspondingly to the landing pads and the landing traces of the substrate, and the elongated bump includes a long axis and a short axis perpendicular to the long axis on a cross section thereof.
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公开(公告)号：US09898645B2
公开(公告)日：2018-02-20
申请号：US15053357
申请日：2016-02-25
Inventor： Yu-Chih Huang , Chih-Hua Chen , Yu-Jen Cheng , Chih-Wei Lin , Yu-Feng Chen , Hao-Yi Tsai , Chung-Shi Liu , Chen-Hua Yu
IPC: H01L21/28 , G06K9/00 , H01L21/56 , H01L23/498
CPC classification number: G06K9/00053 , H01L21/561 , H01L21/568 , H01L23/49827 , H01L24/19 , H01L2224/04105 , H01L2224/16227 , H01L2224/18 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73267 , H01L2224/92244 , H01L2924/00014
Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
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公开(公告)号：US09721918B2
公开(公告)日：2017-08-01
申请号：US14584748
申请日：2014-12-29
Inventor： Pei-Chun Tsai , Yu-Feng Chen , Tin-Hao Kuo , Chen-Shien Chen
Abstract: A package component includes a dielectric layer and a metal pad over the dielectric layer. A plurality of openings is disposed in the metal pad. The first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region.
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