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1.发明申请PARTICLE PRODUCTION APPARATUS, PARTICLE PRODUCTION METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR ENCAPSULATING RESIN COMPOSITION 有权颗粒生产装置，颗粒生产方法和生产半导体包封树脂组合物的方法公开(公告)号：US20120322915A1
公开(公告)日：2012-12-20
申请号：US13581923
申请日：2011-02-23
CPC分类号： C01B33/18 , B01J2/006 , C01P2004/61 , H01L21/565 , H01L23/295 , H01L2924/0002 , H01L2924/00
摘要： A particle production apparatus 1 includes a processing section 3 in which a processing liquid is allowed to adhere to a surface of each of inorganic particles contained in a powder material, a chamber 4 connected to the processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the powder material, a powder material supply device 50 having a supply portion 5 and a supply unit 6 for supplying the powder material and the like into the processing section 3, and a processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, a high-pressure gas (air) generating unit 11 and the like. The processing liquid spraying device 70 is configured to spray the processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.
摘要翻译： 颗粒生产设备1包括处理部分3，其中处理液体被粘附到包含在粉末材料中的每个无机颗粒的表面上，在下游侧连接到处理部分3的室4， 粉末材料与携带粉末材料的气体分离，粉末材料供给装置50具有供应部分5和用于将粉末材料等供应到处理部分3中的供应单元6以及具有 喷嘴7，泵8，用于供给处理液的供给单元9，高压气体（空气）生成单元11等。 处理液喷射装置70被配置为在粉末材料被供给到处理部分3之后将作为液滴的处理液体喷射到粉末材料上。优选地，处理部分3的体积小于室4的体积 。
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2.发明授权Agitating and mixing device and method for producing semiconductor sealing resin composition 有权搅拌混合装置及半导体密封树脂组合物的制造方法公开(公告)号：US09006309B2
公开(公告)日：2015-04-14
申请号：US13574800
申请日：2011-02-02
CPC分类号： B01F11/0002 , B01F7/00083 , B01F7/26 , B01F11/0017 , B01F11/0068 , B01F11/008 , B29B7/08
摘要： An agitating and mixing device 1 of the present invention includes a container 2 for storing the composition, an agitating member 3 for agitating the composition, which is inserted in the container 2, and a driving device 4 for vibrating the container 2. The agitating member 3 has a rod-like portion 32 having one end portion and another end portion, a plate-like portion 31 provided on the one end portion of the rod-like portion 32 and the grip portion 33 provided on the other end portion of the rod-like portion 33. The plate-like portion 31 is perpendicular to the rod-like portion 32. The agitating member 3 is configured to agitate the composition by spacing the plate-like portion 31 apart from the bottom surface of the container 2.
摘要翻译： 本发明的搅拌混合装置1包括容纳组合物的容器2，用于搅拌组合物的搅拌部件3，其插入容器2中，以及用于使容器2振动的驱动装置4.搅拌部件 3具有杆状部分32，其具有一个端部和另一个端部，设置在杆状部分32的一个端部上的板状部分31和设置在杆状部分32的另一个端部上的把手部分33 板状部分31垂直于棒状部分32.搅拌构件3构造成通过将板状部分31与容器2的底面分开间隔来搅拌组合物。
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3.发明申请METHOD FOR PRODUCING SEMICONDUCTOR ENCAPSULATING RESIN COMPOSITION AND PULVERIZING APPARATUS 有权生产半导体封装树脂组合物和粉碎装置的方法公开(公告)号：US20130012624A1
公开(公告)日：2013-01-10
申请号：US13636610
申请日：2011-03-02
CPC分类号： H01L23/3107 , B02C19/061 , C08G59/621 , C08J3/12 , C08J3/122 , C08J2463/00 , C08K3/013 , C08L63/00 , H01L21/56 , H01L2924/0002 , H01L2924/00
摘要： A pulverizing apparatus is a gas stream type pulverizing apparatus. The pulverizing apparatus has a pulverizing unit for pulverizing a composition, a cooling device, a high-pressure air generating device and a collecting unit for receiving the pulverized composition. The chamber has a bottom portion, an outlet formed in the bottom portion for discharging the pulverized first composition therethrough and a wall portion formed in the bottom portion so as to surround the outlet. A plurality of first nozzles and a second nozzle are provided on a side portion of the chamber and a tubular supply unit is provided on an upper portion of the second nozzle. The gas pressure supplied into the chamber is 0.3 MPa or more, the gas temperature is 20° C. or less, and the humidity of the gas is 40% RH or less.
摘要翻译： 粉碎装置是气流式粉碎装置。 粉碎装置具有用于粉碎组合物的粉碎单元，冷却装置，高压空气产生装置和用于接收粉碎的组合物的收集单元。 所述室具有底部，在底部形成的出口，用于将经粉碎的第一组合物排出，以及形成在底部中以围绕出口的壁部。 多个第一喷嘴和第二喷嘴设置在室的侧部，并且管状供应单元设置在第二喷嘴的上部。 供给到室内的气体压力为0.3MPa以上，气体温度为20℃以下，气体的湿度为40％RH以下。
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4.发明申请AGITATING AND MIXING DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR SEALING RESIN COMPOSITION 有权制备和混合装置及其制备半导体密封树脂组合物的方法公开(公告)号：US20120289623A1
公开(公告)日：2012-11-15
申请号：US13574800
申请日：2011-02-02
CPC分类号： B01F11/0002 , B01F7/00083 , B01F7/26 , B01F11/0017 , B01F11/0068 , B01F11/008 , B29B7/08
摘要： An agitating and mixing device 1 of the present invention includes a container 2 for storing the composition, an agitating member 3 for agitating the composition, which is inserted in the container 2, and a driving device 4 for vibrating the container 2. The agitating member 3 has a rod-like portion 32 having one end portion and another end portion, a plate-like portion 31 provided on the one end portion of the rod-like portion 32 and the grip portion 33 provided on the other end portion of the rod-like portion 33. The plate-like portion 31 is perpendicular to the rod-like portion 32. The agitating member 3 is configured to agitate the composition by spacing the plate-like portion 31 apart from the bottom surface of the container 2.
摘要翻译： 本发明的搅拌混合装置1包括容纳组合物的容器2，用于搅拌组合物的搅拌部件3，其插入容器2中，以及用于使容器2振动的驱动装置4.搅拌部件 3具有杆状部分32，其具有一个端部和另一个端部，设置在杆状部分32的一个端部上的板状部分31和设置在杆状部分32的另一个端部上的把手部分33 板状部分31垂直于棒状部分32.搅拌构件3构造成通过将板状部分31与容器2的底面分开间隔来搅拌组合物。
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公开(公告)号：US09828252B2
公开(公告)日：2017-11-28
申请号：US13581923
申请日：2011-02-23
CPC分类号： C01B33/18 , B01J2/006 , C01P2004/61 , H01L21/565 , H01L23/295 , H01L2924/0002 , H01L2924/00
摘要： A particle production apparatus 1 includes a processing section 3 in which a processing liquid is allowed to adhere to a surface of each of inorganic particles contained in a powder material, a chamber 4 connected to the processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the powder material, a powder material supply device 50 having a supply portion 5 and a supply unit 6 for supplying the powder material and the like into the processing section 3, and a processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, a high-pressure gas (air) generating unit 11 and the like. The processing liquid spraying device 70 is configured to spray the processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.
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6.发明授权Method for producing semiconductor encapsulating resin composition and pulverizing apparatus 有权半导体封装树脂组合物和粉碎装置的制造方法公开(公告)号：US09153515B2
公开(公告)日：2015-10-06
申请号：US13636610
申请日：2011-03-02
CPC分类号： H01L23/3107 , B02C19/061 , C08G59/621 , C08J3/12 , C08J3/122 , C08J2463/00 , C08K3/013 , C08L63/00 , H01L21/56 , H01L2924/0002 , H01L2924/00
摘要： A pulverizing apparatus is a gas stream type pulverizing apparatus. The pulverizing apparatus has a pulverizing unit for pulverizing a composition, a cooling device, a high-pressure air generating device and a collecting unit for receiving the pulverized composition. The chamber has a bottom portion, an outlet formed in the bottom portion for discharging the pulverized first composition therethrough and a wall portion formed in the bottom portion so as to surround the outlet. A plurality of first nozzles and a second nozzle are provided on a side portion of the chamber and a tubular supply unit is provided on an upper portion of the second nozzle. The gas pressure supplied into the chamber is 0.3 MPa or more, the gas temperature is 20° C. or less, and the humidity of the gas is 40% RH or less.
摘要翻译： 粉碎装置是气流式粉碎装置。 粉碎装置具有用于粉碎组合物的粉碎单元，冷却装置，高压空气产生装置和用于接收粉碎的组合物的收集单元。 所述室具有底部，在底部形成的出口，用于将粉碎的第一组合物排出，以及形成在底部中以围绕出口的壁部。 多个第一喷嘴和第二喷嘴设置在室的侧部，并且管状供应单元设置在第二喷嘴的上部。 供给到室内的气体压力为0.3MPa以上，气体温度为20℃以下，气体的湿度为40％RH以下。
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公开(公告)号：US06830825B2
公开(公告)日：2004-12-14
申请号：US10275018
申请日：2002-10-31
申请人： Takafumi Sumiyoshi , Ayako Mizushima , Ken Oota , Yoshio Fujieda , Hiroki Nikaido , Takashi Aihara
发明人： Takafumi Sumiyoshi , Ayako Mizushima , Ken Oota , Yoshio Fujieda , Hiroki Nikaido , Takashi Aihara
IPC分类号： H01L2912
CPC分类号： C08L63/00 , C08K5/5399 , C08L61/06 , C08L85/02 , Y10T428/12528 , C08L2666/16 , C08L2666/14 , C08L2666/22 , C08L85/00
摘要： An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.
摘要翻译： 用于封装半导体的环氧树脂组合物，其基本上不含有具有成型性，阻燃性，高温储存特性，耐湿可靠性和耐焊料龟裂性的卤素类阻燃剂或锑化合物。 用于封装半导体的环氧树脂组合物包含（A）环氧树脂，（B）酚醛树脂，（C）固化促进剂，（D）无机填料和（E）作为必需成分的磷腈化合物， 磷腈化合物中所含的磷酸根离子和亚磷酸根离子不大于500ppm。 此外，环氧树脂组合物可任选地含有阻燃助剂或离子清除剂。
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公开(公告)号：US20120299212A1
公开(公告)日：2012-11-29
申请号：US13574825
申请日：2011-02-21
申请人： Kazuo Noda , Takafumi Sumiyoshi
发明人： Kazuo Noda , Takafumi Sumiyoshi
IPC分类号： B29C43/24
CPC分类号： B29C43/46 , B29C33/04 , B29C33/424 , B29C33/56 , B29C43/222 , B29C47/0019 , B29C47/0021 , B29C47/8845 , B29C47/886 , B29C2043/3433 , B29C2043/468 , B29C2043/5076 , B29K2909/02 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A molding device for molding a resin composition into a sheet shape by pressurizing the resin composition has a pair of rollers arranged parallel to one another. Each of the rollers has a columnar or cylindrical core portion and an outer layer provided on an outer periphery of the core portion. The outer layer is constituted of the ceramic material. A thickness of the outer layer is in the range of 0.2 to 100 nm. Further, an arithmetic mean deviation of a profile Ra of an outer peripheral surface of each of the rollers defined by JIS B 0601 is in the range of 0 to 2 μm.
摘要翻译： 通过加压树脂组合物将树脂组合物模塑成片状的成型装置具有彼此平行布置的一对辊。 每个辊具有柱形或圆柱形芯部分和设置在芯部分的外周上的外层。 外层由陶瓷材料构成。 外层的厚度在0.2〜100nm的范围内。 此外，由JIS B 0601定义的每个辊的外周面的轮廓Ra的算术平均偏差在0〜2μm的范围内。
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公开(公告)号：US09004898B2
公开(公告)日：2015-04-14
申请号：US13574825
申请日：2011-02-21
申请人： Kazuo Noda , Takafumi Sumiyoshi
发明人： Kazuo Noda , Takafumi Sumiyoshi
IPC分类号： B29C43/24 , B29C43/46 , B29C43/22 , B29C47/00 , B29C33/04 , B29C47/88 , B29C43/34 , B29C43/50 , B29C33/42 , B29C33/56
CPC分类号： B29C43/46 , B29C33/04 , B29C33/424 , B29C33/56 , B29C43/222 , B29C47/0019 , B29C47/0021 , B29C47/8845 , B29C47/886 , B29C2043/3433 , B29C2043/468 , B29C2043/5076 , B29K2909/02 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A molding device for molding a resin composition into a sheet shape by pressurizing the resin composition has a pair of rollers arranged parallel to one another. Each of the rollers has a columnar or cylindrical core portion and an outer layer provided on an outer periphery of the core portion. The outer layer is constituted of the ceramic material. A thickness of the outer layer is in the range of 0.2 to 100 nm. Further, an arithmetic mean deviation of a profile Ra of an outer peripheral surface of each of the rollers defined by JIS B 0601 is in the range of 0 to 2 μm.
摘要翻译： 通过加压树脂组合物将树脂组合物模塑成片状的成型装置具有彼此平行布置的一对辊。 每个辊具有柱形或圆柱形芯部分和设置在芯部分的外周上的外层。 外层由陶瓷材料构成。 外层的厚度在0.2〜100nm的范围内。 此外，由JIS B 0601定义的每个辊的外周面的轮廓Ra的算术平均偏差在0〜2μm的范围内。
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