公开(公告)号：US07250368B2

公开(公告)日：2007-07-31

申请号：US10512637

申请日：2003-04-24

申请人： Takahiro Kida ,  Seiichi Miyazaki ,  Kazuhiko Nishimura ,  Nobuyuki Hayashi ,  Katsunori Arai

发明人： Takahiro Kida ,  Seiichi Miyazaki ,  Kazuhiko Nishimura ,  Nobuyuki Hayashi ,  Katsunori Arai

IPC分类号： H01L21/304

CPC分类号： H01L21/02008 ,  B24B9/065 ,  B24B37/042 ,  H01L21/02052 ,  H01L21/30604 ,  Y10S438/928

摘要： The present invention provides a method for manufacturing a semiconductor wafer capable of manufacturing a wafer without ring-like sag in an outer peripheral portion thereof when polishing an alkali etched wafer, and a wafer without the ring-like sag in an outer peripheral portion thereof. The present invention comprises: a back surface part polishing and edge polishing step for performing back surface part polishing and edge polishing such that mirror polishing is performed on a chamfered portion and an inner part extending inward from a boundary between the chamfered portion and a back surface of a starting wafer; and a front surface polishing step for mirror polishing a front surface of the wafer subjected to the back surface part polishing and edge polishing step holding the wafer by the back surface thereof.

摘要翻译： 本发明提供了一种制造半导体晶片的方法，该半导体晶片在其外周部分研磨碱蚀刻晶片时，并且在其外周部分中没有环状凹陷的晶片，能够在其外周部分制造没有环状凹陷的晶片。 本发明包括：背面部分抛光和边缘抛光步骤，用于进行背面部分抛光和边缘抛光，使得在倒角部分和从倒角部分和背面之间的边界向内延伸的内部部分进行镜面抛光 的起始晶圆; 以及前表面抛光步骤，用于对经过后表面抛光的晶片的前表面进行镜面抛光和通过其后表面保持晶片的边缘抛光步骤。

公开(公告)号：US20050142882A1

公开(公告)日：2005-06-30

申请号：US10512637

申请日：2003-04-24

申请人： Takahiro Kida ,  Seiichi Miyazaki ,  Kazuhiko Nishimura ,  Nobuyuki Hayashi ,  Katsunori Arai

发明人： Takahiro Kida ,  Seiichi Miyazaki ,  Kazuhiko Nishimura ,  Nobuyuki Hayashi ,  Katsunori Arai

IPC分类号： B24B9/00 ,  B24B9/06 ,  B24B37/04 ,  H01L21/302 ,  H01L21/304 ,  H01L21/306 ,  H01L21/461

CPC分类号： H01L21/02008 ,  B24B9/065 ,  B24B37/042 ,  H01L21/02052 ,  H01L21/30604 ,  Y10S438/928

摘要： The present invention provides a method for manufacturing a semiconductor wafer capable of manufacturing a wafer without ring-like sag in an outer peripheral portion thereof when polishing an alkali etched wafer, and a wafer without the ring-like sag in an outer peripheral portion thereof. The present invention comprises: a back surface part polishing and edge polishing step for performing back surface part polishing and edge polishing such that mirror polishing is performed on a chamfered portion and an inner part extending inward from a boundary between the chamfered portion and a back surface of a starting wafer; and a front surface polishing step for mirror polishing a front surface of the wafer subjected to the back surface part polishing and edge polishing step holding the wafer by the back surface thereof.

摘要翻译： 本发明提供了一种制造半导体晶片的方法，该半导体晶片在其外周部分研磨碱蚀刻晶片时，并且在其外周部分中没有环状凹陷的晶片，能够在其外周部分制造没有环状凹陷的晶片。 本发明包括：背面部分抛光和边缘抛光步骤，用于进行背面部分抛光和边缘抛光，使得在倒角部分和从倒角部分和背面之间的边界向内延伸的内部部分进行镜面抛光 的起始晶圆; 以及前表面抛光步骤，用于对经过后表面抛光的晶片的前表面进行镜面抛光和通过其后表面保持晶片的边缘抛光步骤。

公开(公告)号：US08964402B2

公开(公告)日：2015-02-24

申请号：US13331105

申请日：2011-12-20

申请人： Teru Nakanishi ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

发明人： Teru Nakanishi ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

IPC分类号： H05K7/00 ,  H05K1/11 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L23/49827 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/09136 ,  H05K2201/10378 ,  H05K2201/10992 ,  Y02P70/613

摘要： An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

摘要翻译： 一种电子设备，包括：第一电极和第二电极的布线板;安装在所述布线板上的半导体器件，包括第一端子和第二端子，所述插入器设置在所述布线板和所述半导体器件之间，所述插入器包括： 所述导电焊盘和支撑所述导电焊盘的片材，所述导电焊盘具有在所述布线板的一侧上的第一表面和所述半导体器件的一侧上的第二表面;第一焊料，其将位于其中的所述第一电极的位于 所述插入件与所述第一端子位于所述区域的外侧，所述第二焊料将位于所述区域内的所述第二电极与所述导电焊盘的所述第一表面连接;以及第三焊料，其将位于所述区域内的所述第二端子与 导电垫的第二表面。

公开(公告)号：US20100024237A1

公开(公告)日：2010-02-04

申请号：US12511735

申请日：2009-07-29

申请人： Shuji Hayashida ,  Nobuyuki Hayashi ,  Shozaburo Tsuji ,  Yasuhiro Tsujimoto ,  Masahiko Tachikake ,  Yuji Fujikawa ,  Takashi Komori ,  Junji Masui

发明人： Shuji Hayashida ,  Nobuyuki Hayashi ,  Shozaburo Tsuji ,  Yasuhiro Tsujimoto ,  Masahiko Tachikake ,  Yuji Fujikawa ,  Takashi Komori ,  Junji Masui

IPC分类号： G01B3/18

CPC分类号： G01B3/18

摘要： A digital displacement measuring instrument includes a spindle screwed into a body to be axially advanced and retracted relative to the body; and an encoder that detects a displacement of the spindle. The encoder includes a rotor and a stator. The rotor is supported by a rotor bushing. The rotor bushing includes an engaging key engageable with a key groove axially provided on the outer circumference of the spindle, and is displaceable in the axial direction of the spindle via a position adjusting screw. The stator is fixed to the body via a stator bushing in the vicinity of the spindle so as not to be displaceable in the axial direction of the spindle.

摘要翻译： 数字位移测量仪器包括旋转到主体中以相对于主体轴向前进和后退的主轴; 以及检测主轴的位移的编码器。 编码器包括转子和定子。 转子由转子衬套支撑。 转子衬套包括可与主轴的外圆周上轴向设置的键槽接合的接合键，并通过位置调节螺钉在主轴的轴向方向上移动。 定子通过主轴附近的定子衬套固定到主体，以便不能在主轴的轴向方向上移动。

公开(公告)号：US20050274034A1

公开(公告)日：2005-12-15

申请号：US10520942

申请日：2004-06-09

申请人： Suuji Hayashida ,  Yuji Fujikawa ,  Yuichi Ichikawa ,  Osamu Saito ,  Nobuyuki Hayashi ,  Takahiro Nakamura ,  Yuuzou Hashimoto ,  Tomio Omori

发明人： Suuji Hayashida ,  Yuji Fujikawa ,  Yuichi Ichikawa ,  Osamu Saito ,  Nobuyuki Hayashi ,  Takahiro Nakamura ,  Yuuzou Hashimoto ,  Tomio Omori

IPC分类号： G01B3/18

CPC分类号： G01B3/18

摘要： A measuring instrument that includes a tube 21 having a female thread 211 and a spindle 3 having a lead screw 31 screwing with the female thread 211 and capable of being advanced and retracted in an axial direction along with rotation around the axial center, and measures dimensions etc. of a workpiece according to displacement in an axial direction of the spindle 3 based on a rotation amount of the spindle 3. According to this measuring instrument, a pitch P of the lead screw 31 is twice as large or more than the difference between an external diameter R and a core diameter r thereof, and the difference between the external diameter R and the core diameter r is one-fifth or less of the external diameter R. Because of the lead screw 31 with the large pitch, the spindle 3 can be moved at high speed, thus enhancing operational performance of the measuring instrument.

摘要翻译： 一种测量仪器，其包括具有阴螺纹211的管21和具有与内螺纹211螺合的导螺杆31的心轴3，并且能够沿轴向方向前进和后退，同时围绕轴心旋转，并且测量尺寸 根据该主轴3的旋转量，根据该主轴3的轴方向的位移而使工件相等。根据该测量仪器，导螺杆31的间距P是两倍以上 外径R和芯直径r，外径R和芯直径r之差为外径R的五分之一以下。由于螺距大的螺杆31，主轴3 可以高速移动，从而提高测量仪器的运行性能。

公开(公告)号：US20050212822A1

公开(公告)日：2005-09-29

申请号：US10516551

申请日：2003-06-03

申请人： Yoshinori Honma ,  Nobuyuki Hayashi

发明人： Yoshinori Honma ,  Nobuyuki Hayashi

IPC分类号： G09F9/00 ,  G09G3/20 ,  G09G5/00 ,  G09G5/39

CPC分类号： G09G5/005 ,  G09F9/00 ,  G09G5/006 ,  G09G5/39 ,  G09G2310/0229 ,  G09G2310/04 ,  G09G2320/103 ,  G09G2340/0492 ,  G09G2340/125 ,  G09G2360/12 ,  G09G2360/18

摘要： The present invention provides a display apparatus and a display method and an advertisement method using the display apparatus which may realize an innovative image that has never been realized by a hardware structure that is extremely easy and costless and in which an excellent advertisement effect is expected as, for example, a poster advertisement. It is composed of a sequential scanning circuit for signal converting a jump scanning type image signal into a sequential scanning type and a signal turning unit for turning the signal through 90 degrees to make it possible to feed the image signal turned through 90 degrees in real time.

摘要翻译： 本发明提供了一种使用该显示装置的显示装置和显示方法以及广告方法，该显示装置可以实现从未通过非常容易且无成本的硬件结构实现的创新图像，并且其中期望具有优异的广告效果 例如，海报广告。 它由用于将跳跃扫描型图像信号转换为顺序扫描类型的顺序扫描电路和用于将信号转动90度的信号转动单元组成，使得可以实时地将转过90度的图像信号 。

公开(公告)号：US06628115B2

公开(公告)日：2003-09-30

申请号：US10053964

申请日：2002-01-22

申请人： Kouji Sasaki ,  Yoshiaki Shiraishi ,  Nobuyuki Hayashi

发明人： Kouji Sasaki ,  Yoshiaki Shiraishi ,  Nobuyuki Hayashi

IPC分类号： G01B714

CPC分类号： G01B7/003 ,  G01D5/2086 ,  H01F5/003

摘要： A electromagnetic induction-type absolute position transducer according to the present invention has a plurality of scale loops functioning as coils. The scale loop has first and second loop portions and a connecting pattern portion which connects the corresponding first and second loop portions with each other. The first and second loop portions are arranged along the measuring axis at different wavelength intervals. At least part of the pattern widths constituting scale loops are gradually increased as the length of a connecting pattern portion becomes longer.

摘要翻译： 根据本发明的电磁感应型绝对位置传感器具有用作线圈的多个刻度环。 刻度环具有第一和第二环部分以及将相应的第一和第二环部分彼此连接的连接图案部分。 第一和第二环部分沿着测量轴以不同的波长间隔布置。 构成刻度环的图案宽度的至少一部分随着连接图案部分的长度变长而逐渐增加。

公开(公告)号：US06522129B2

公开(公告)日：2003-02-18

申请号：US09803913

申请日：2001-03-13

申请人： Toshiharu Miyata ,  Nobuyuki Hayashi ,  Kouji Sasaki ,  Tetsuro Kiriyama

发明人： Toshiharu Miyata ,  Nobuyuki Hayashi ,  Kouji Sasaki ,  Tetsuro Kiriyama

IPC分类号： G01B702

CPC分类号： G01D5/2053

摘要： An induction type tranducer is formed to be a substrate having a multilayer structure. The substrate has a multilayer structure including six layers, a first layer through sixth layer. An exciting coil is formed at the first layer. Detecting coils are formed at the second layer and the third layer. A wiring layer is formed at the fifth layer at the opposite side of the scale from the core layer. A signal processing IC is formed at the sixth layer. A magnetic shield layer, which insulates magnetic flux from the exciting coil, is formed at the fourth layer between the exciting coil and the signal processing IC.

摘要翻译： 感应式换能器形成为具有多层结构的基板。 衬底具有包括六层的第一层至第六层的多层结构。 在第一层形成励磁线圈。 检测线圈形成在第二层和第三层。 布线层形成在刻度尺与核心层相对的第五层处。 在第六层形成信号处理IC。 在励磁线圈和信号处理IC之间的第四层形成有使来自励磁线圈的磁通绝缘的磁屏蔽层。

公开(公告)号：US06501264B2

公开(公告)日：2002-12-31

申请号：US09802845

申请日：2001-03-12

申请人： Yoshiaki Shiraishi ,  Kouji Sasaki ,  Masamichi Suzuki ,  Nobuyuki Hayashi

发明人： Yoshiaki Shiraishi ,  Kouji Sasaki ,  Masamichi Suzuki ,  Nobuyuki Hayashi

IPC分类号： G01B714

CPC分类号： G01B7/02 ,  G01B3/205

摘要： An induction type transducer is formed at a substrate of a grid assembly which is disposed so as to be opposed to a scale. The surface of the substrate opposed to the scale is made flat, and even if a liquid enters from a gap between the grid and the scale, permeation of the liquid into the substrate is prevented.

摘要翻译： 感应型换能器形成在格栅组件的基板上，该栅格组件设置成与刻度尺相对。 与标尺相对的基板的表面是平坦的，并且即使液体从栅格和标尺之间的间隙进入，也防止了液体渗透到基板中。

公开(公告)号：US06261741B1

公开(公告)日：2001-07-17

申请号：US09199329

申请日：1998-11-25

申请人： Motoaki Tani ,  Nobuyuki Hayashi ,  Hiroyuki Machida

发明人： Motoaki Tani ,  Nobuyuki Hayashi ,  Hiroyuki Machida

IPC分类号： G03F7027

CPC分类号： G03F7/037 ,  H05K3/0023 ,  H05K3/287 ,  H05K3/4602 ,  Y10S430/107

摘要： A photosensitive heat-resistant resin composition contains a polyamideimide resin, an organic solvent for dissolving the polyamideimide, an acrylic monomer or oligomer having at least two polymerizable double bonds, and a photoreaction initiator for initiating polymerization of the acrylic monomer or oligomer by photochemical reaction. The resin composition may be used to make a heat-resistant insulating film which may be patterned by selective irradiation of ultraviolet rays. The insulating film may be interposed between different conductor layers in a build-up multilayer circuit board.

摘要翻译： 感光耐热性树脂组合物含有聚酰胺酰亚胺树脂，用于溶解聚酰胺酰亚胺的有机溶剂，具有至少两个可聚合双键的丙烯酸单体或低聚物，以及通过光化学反应引发丙烯酸单体或低聚物的聚合的光反应引发剂。 树脂组合物可以用于制造可以通过选择性照射紫外线来图案化的耐热绝缘膜。 绝缘膜可以插入在积层多层电路板中的不同导体层之间。