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    Electronic device, interposer and method of manufacturing electronic device
    4.
    发明授权
    Electronic device, interposer and method of manufacturing electronic device 有权
    电子设备，插件和电子设备的制造方法

    公开(公告)号：US08964402B2

    公开(公告)日：2015-02-24

    申请号：US13331105

    申请日：2011-12-20

    申请人： Teru Nakanishi ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

    发明人： Teru Nakanishi ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

    IPC分类号： H05K7/00 ,  H05K1/11 ,  H01L23/498 ,  H05K3/34

    CPC分类号： H01L23/49827 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/09136 ,  H05K2201/10378 ,  H05K2201/10992 ,  Y02P70/613

    摘要： An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

    摘要翻译： 一种电子设备，包括：第一电极和第二电极的布线板;安装在所述布线板上的半导体器件，包括第一端子和第二端子，所述插入器设置在所述布线板和所述半导体器件之间，所述插入器包括： 所述导电焊盘和支撑所述导电焊盘的片材，所述导电焊盘具有在所述布线板的一侧上的第一表面和所述半导体器件的一侧上的第二表面;第一焊料，其将位于其中的所述第一电极的位于 所述插入件与所述第一端子位于所述区域的外侧，所述第二焊料将位于所述区域内的所述第二电极与所述导电焊盘的所述第一表面连接;以及第三焊料，其将位于所述区域内的所述第二端子与 导电垫的第二表面。

    ELECTRONIC DEVICE, INTERPOSER AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
    6.
    发明申请
    ELECTRONIC DEVICE, INTERPOSER AND METHOD OF MANUFACTURING ELECTRONIC DEVICE 有权
    电子设备，插接器和制造电子器件的方法

    公开(公告)号：US20120176759A1

    公开(公告)日：2012-07-12

    申请号：US13331105

    申请日：2011-12-20

    申请人： Teru NAKANISHI ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

    发明人： Teru NAKANISHI ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

    IPC分类号： H05K7/06 ,  H05K1/03 ,  B23K31/02 ,  H05K1/11

    CPC分类号： H01L23/49827 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/09136 ,  H05K2201/10378 ,  H05K2201/10992 ,  Y02P70/613

    摘要： An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

    摘要翻译： 一种电子设备，包括：第一电极和第二电极的布线板;安装在所述布线板上的半导体器件，包括第一端子和第二端子，所述插入器设置在所述布线板和所述半导体器件之间，所述插入器包括： 所述导电焊盘和支撑所述导电焊盘的片材，所述导电焊盘具有在所述布线板的一侧上的第一表面和所述半导体器件的一侧上的第二表面;第一焊料，其将位于其中的所述第一电极的位于 所述插入件与所述第一端子位于所述区域的外侧，所述第二焊料将位于所述区域内的所述第二电极与所述导电焊盘的所述第一表面连接;以及第三焊料，其将位于所述区域内的所述第二端子与 导电垫的第二表面。

    Heat shield plate for substrate annealing apparatus
    8.
    发明授权
    Heat shield plate for substrate annealing apparatus 有权
    基板退火装置用隔热板

    公开(公告)号：US08118591B2

    公开(公告)日：2012-02-21

    申请号：US12280811

    申请日：2007-03-15

    申请人： Terumasa Ishihara ,  Takaharu Hashimoto ,  Masayuki Mizuno ,  Masaru Morita

    发明人： Terumasa Ishihara ,  Takaharu Hashimoto ,  Masayuki Mizuno ,  Masaru Morita

    IPC分类号： F27D5/00

    CPC分类号： H01L21/324 ,  H01L21/67103

    摘要： A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.

    摘要翻译： 用于基板退火装置的隔热板设置有水平支撑的平板状基板1，位于基板上方的加热器5，以用辐射热加热基板的上表面，并且隔热板10水平移动 在基板被屏蔽的屏蔽位置和屏蔽位置之间的打开位置之间。 隔热板10由由遮蔽位置的温度差异而几何变形的低热膨胀性材料（碳复合材料）构成的结构体12，覆盖上述表面的绝热构件14 结构件并将表面保持在允许的温度或更低的温度。

    Laser annealing method and laser annealing apparatus
    9.
    发明授权
    Laser annealing method and laser annealing apparatus 有权
    激光退火方法和激光退火装置

    公开(公告)号：US08115137B2

    公开(公告)日：2012-02-14

    申请号：US12997543

    申请日：2008-06-12

    申请人： Norihito Kawaguchi ,  Ryusuke Kawakami ,  Kenichiro Nishida ,  Miyuki Masaki ,  Masaru Morita ,  Atsushi Yoshinouchi

    发明人： Norihito Kawaguchi ,  Ryusuke Kawakami ,  Kenichiro Nishida ,  Miyuki Masaki ,  Masaru Morita ,  Atsushi Yoshinouchi

    IPC分类号： H01L21/00 ,  H01L21/20 ,  H01L21/36

    CPC分类号： B23K26/0732 ,  B23K26/046 ,  B23K26/0665 ,  G02B27/0905 ,  G02B27/0966 ,  G02B27/48 ,  H01L21/02678

    摘要： In laser annealing using a solid state laser, a focus position of a minor axial direction of a rectangular beam is easily corrected depending on positional variation of a laser irradiated portion of a semiconductor film. By using a minor-axis condenser lens 29 condensing incident light in a minor axial direction and a projection lens 30 projecting light, which comes from the minor-axis condenser lens 29, onto a surface of a semiconductor film 3, laser beam 1 is condensed on the surface of the semiconductor film 3 in the minor axial direction of a rectangular beam. The positional variation of a vertical direction of the semiconductor film 3 in a laser irradiated portion of the semiconductor film 3 is detected by a positional variation detector 31, and the minor-axis condenser lens 29 is moved in an optical axis direction based on a value of the detection.

    摘要翻译： 在使用固态激光的激光退火中，根据半导体膜的激光照射部的位置变化容易校正矩形光束的小轴方向的聚焦位置。 通过使用将小轴聚光的次轴聚光透镜29和将来自短轴聚光透镜29的光投射到半导体膜3的表面上的投影透镜30，激光束1被冷凝 在半导体膜3的矩形梁的小轴向的表面上。 半导体膜3的激光照射部分中的半导体膜3的垂直方向的位置变化由位置变化检测器31检测，并且短轴聚光透镜29基于光轴方向在光轴方向上移动 的检测。

    LASER ANNEALING APPARATUS
    10.
    发明申请
    LASER ANNEALING APPARATUS 有权
    激光退火设备

    公开(公告)号：US20110108535A1

    公开(公告)日：2011-05-12

    申请号：US13002010

    申请日：2009-06-17

    申请人： Norihito Kawaguchi ,  Ryusuke Kawakami ,  Kenichiro Nishida ,  Jun Izawa ,  Miyuki Masaki ,  Masaru Morita

    发明人： Norihito Kawaguchi ,  Ryusuke Kawakami ,  Kenichiro Nishida ,  Jun Izawa ,  Miyuki Masaki ,  Masaru Morita

    IPC分类号： B23K26/00

    CPC分类号： H01L21/268 ,  B23K26/0853 ,  B23K26/127 ,  B23K26/128 ,  B23K26/147 ,  B23K26/702 ,  B23K2103/56 ,  H01L21/02532 ,  H01L21/02675 ,  H01L21/67115

    摘要： Provided is a laser annealing apparatus capable of reducing irradiation unevenness of laser light caused by a refraction phenomenon of laser light due to fluctuation in the temperature of inert gas.A laser annealing apparatus 1 includes a gas supply unit 10 for supplying inert gas G to at least a laser irradiation area of a workpiece 7 to be processed, and a gas temperature controller 15 for regulating the temperature of the inert gas G. The gas temperature controller 15 controls the temperature of the inert gas G supplied to the laser irradiation area so as to decrease the temperature difference between the temperature of the inert gas G and the atmospheric temperature of a space (a room R) that is disposed outside the supply area of the inert gas so as to surround the optical path of the laser light.

    摘要翻译： 提供一种激光退火装置，其能够减少由于惰性气体的温度波动引起的激光折射现象引起的激光的照射不均匀性。 激光退火装置1包括用于将惰性气体G供给到待加工的工件7的至少激光照射区域的气体供给单元10和用于调节惰性气体G的温度的气体温度控制器15.气体温度 控制器15控制提供给激光照射区域的惰性气体G的温度，从而降低惰性气体G的温度与设置在供给区域外的空间（室R）的大气温度之间的温差 的惰性气体，以包围激光的光路。