公开(公告)号：US5106462A

公开(公告)日：1992-04-21

申请号：US432811

申请日：1989-11-07

申请人： Takamasa Kawakami ,  Rieko Nakano ,  Kazuhiro Ando ,  Ryuji Fujiura

发明人： Takamasa Kawakami ,  Rieko Nakano ,  Kazuhiro Ando ,  Ryuji Fujiura

IPC分类号： C23C18/08 ,  C25D5/56 ,  H05K3/10

CPC分类号： C23C18/08 ,  C25D5/56 ,  H05K3/105 ,  Y10S205/927

摘要： Process for producing a copper plated resin article by forming a uniform copper coating having excellent adhesive strength on a fiber-reinforced or unreinforced thermoplastic or thermosetting resin article having a heat deformation temperature higher than 165.degree. C. The resin article is heated along with a source of copper formate under a reduced pressure or in a non-oxidative atmosphere to a temperature in the range above 165.degree. C. but lower than the heat deformation temperature of the resin article. The process makes it possible to produce a resin article having formed thereon a copper layer having an excellent adhesive strength by a very simple manner, and the resin article thus obtained can be used in various industrial fields.

公开(公告)号：US5093510A

公开(公告)日：1992-03-03

申请号：US622681

申请日：1990-12-05

申请人： Takamasa Kawakami ,  Ryuji Fujiura ,  Kazuhiro Ando ,  Rieko Nakano

发明人： Takamasa Kawakami ,  Ryuji Fujiura ,  Kazuhiro Ando ,  Rieko Nakano

IPC分类号： C07C51/09 ,  C07C51/41 ,  C07C53/06

CPC分类号： C07C51/412

摘要： A process for producing copper formate, which comprises subjecting methyl formate to a liquid-phase hydrolysis reaction at a temperature from 60 to 85.degree. C. in the presence of copper carbonate.

公开(公告)号：US5094686A

公开(公告)日：1992-03-10

申请号：US580675

申请日：1990-09-11

申请人： Takamasa Kawakami ,  Satoru Makinose ,  Kazuhiro Ando ,  Rieko Nakano

发明人： Takamasa Kawakami ,  Satoru Makinose ,  Kazuhiro Ando ,  Rieko Nakano

IPC分类号： B22F9/30 ,  C22B5/02 ,  C22B9/14

CPC分类号： B22F9/30 ,  C22B5/02 ,  C22B9/14

摘要： A process for producing a copper fine powder, which comprises thermally decomposing anhydrous copper formate in a solid phase in a non-oxidizing atmosphere at a temperature in the range of from 150.degree. to 300.degree. C., thereby yielding a copper fine powder having a primary particle diameter of from 0.2 to 1 .mu.m, a specific surface area of from 5 to 0.5 m.sup.2 /g and small agglomerating properties, said anhydrous copper formate being an anhydrous copper formate powder 90 wt % or more of which undergoes thermal decomposition within a temperature range of from 160.degree. to 200.degree. C. when the anhydrous copper formate powder is heated in a nitrogen or hydrogen gas atmosphere at a heating rate of 3.degree. C./min.

公开(公告)号：US4613490A

公开(公告)日：1986-09-23

申请号：US729751

申请日：1985-05-02

申请人： Takashi Suzuki ,  Takamasa Kawakami ,  Rieko Nakano ,  Takeshi Koyama ,  Kansei Izaki ,  Akira Mori ,  Masami Orisaku

发明人： Takashi Suzuki ,  Takamasa Kawakami ,  Rieko Nakano ,  Takeshi Koyama ,  Kansei Izaki ,  Akira Mori ,  Masami Orisaku

IPC分类号： C01B21/068 ,  C01B31/36 ,  C04B35/565 ,  C04B35/589 ,  C01B33/06

CPC分类号： C01B21/068 ,  C01B31/36 ,  C04B35/565 ,  C04B35/589 ,  C01P2004/32 ,  C01P2004/52 ,  C01P2004/62 ,  C01P2006/80

摘要： Fine silicon nitride powders, fine silicon carbide powders, or fine powdery mixture of silicon nitride and silicon carbide are prepared by vapor phase reaction of an aminosilane compound, a cyanosilane compound, a silazane compound, an alkoxysilane compound or a siloxane compound and heat treatment of the resulting fine powders in a non-oxidizing gas atmosphere.

摘要翻译： 通过氨基硅烷化合物，氰硅烷化合物，硅氮烷化合物，烷氧基硅烷化合物或硅氧烷化合物的气相反应制备微细的氮化硅粉末，细碳化硅粉末或氮化硅和碳化硅的细粉状混合物， 得到的细粉末在非氧化性气体气氛中。

公开(公告)号：US4594330A

公开(公告)日：1986-06-10

申请号：US712036

申请日：1985-03-15

申请人： Takashi Suzuki ,  Takamasa Kawakami ,  Takeshi Koyama ,  Masami Orisaku ,  Kansei Izaki ,  Rieko Nakano ,  Akira Mori

发明人： Takashi Suzuki ,  Takamasa Kawakami ,  Takeshi Koyama ,  Masami Orisaku ,  Kansei Izaki ,  Rieko Nakano ,  Akira Mori

IPC分类号： C01B21/068 ,  C01B21/087 ,  C01B31/36 ,  C04B35/565 ,  C04B35/589 ,  C04B35/52

CPC分类号： C01B31/36 ,  C01B21/068 ,  C01B21/087 ,  C04B35/565 ,  C04B35/589 ,  C01P2002/02 ,  C01P2002/72 ,  C01P2002/82 ,  C01P2004/03 ,  C01P2004/61 ,  C01P2006/80

摘要： Fine spherical amorphous powder represented by the general formula:SiCxNyHzwherein 0.1

摘要翻译： 通过气相氧化基本上不含卤素原子和氧原子的有机硅化合物制备由通式：SiC x N y H y表示的细球状无定形粉末，其中0.1

公开(公告)号：US5252355A

公开(公告)日：1993-10-12

申请号：US738013

申请日：1991-07-30

申请人： Kazuhiro Ando ,  Takamasa Kawakami ,  Yasuhiro Shouji ,  Yasuo Tanaka ,  Takeo Kanaoka ,  Norio Sayama

发明人： Kazuhiro Ando ,  Takamasa Kawakami ,  Yasuhiro Shouji ,  Yasuo Tanaka ,  Takeo Kanaoka ,  Norio Sayama

IPC分类号： H05K3/38 ,  H05K3/46 ,  C23C26/00

CPC分类号： H05K3/385 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K3/4611

摘要： A process for producing a multilayered printed circuit board which comprises using, as an intermediate layer, an inner-layer board obtained by chemically oxidizing the surface of a copper foil constituting an outermost layer of an inner-layer board having a printed circuit formed in the copper foil, thereby to form on the surface a finely roughened layer constituted by a copper oxide of a brown to black color, and then reducing the copper oxide constituting the finely roughened layer in an atmosphere in which a reducing gas is present.

公开(公告)号：US4913938A

公开(公告)日：1990-04-03

申请号：US288928

申请日：1988-12-23

申请人： Takamasa Kawakami ,  Kazuhiro Ando ,  Ryuji Fujira

发明人： Takamasa Kawakami ,  Kazuhiro Ando ,  Ryuji Fujira

IPC分类号： C23C18/08 ,  H05K3/10

CPC分类号： C23C18/08 ,  H05K3/105

摘要： A method for producing a copper film-formed molding is disclosed, comprising a coating a mixed solution containing at least one copper compound selected from copper hydroxide and organic acid copper salts and a polyhydric alcohol as essential components on the desired area of an article having a heat deflection temperature of at least 165.degree. C., and heating to a temperature of from 165.degree. C. to the heat deflection temperature of the article and maintaining at this temperature in a non-oxidizing atmosphere.

公开(公告)号：US5382333A

公开(公告)日：1995-01-17

申请号：US950757

申请日：1992-09-24

申请人： Kazuhiro Ando ,  Takamasa Kawakami ,  Yasuhiro Shouji ,  Yasuo Tanaka ,  Takeo Kanaoka ,  Norio Sayama

发明人： Kazuhiro Ando ,  Takamasa Kawakami ,  Yasuhiro Shouji ,  Yasuo Tanaka ,  Takeo Kanaoka ,  Norio Sayama

IPC分类号： C23C22/63 ,  C23C22/83 ,  H05K3/38 ,  H05K3/46 ,  C25F5/00

CPC分类号： C23C22/83 ,  C23C22/63 ,  H05K3/385 ,  H05K2201/0355 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K3/4611

摘要： A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.

摘要翻译： 一种使用铜箔制造覆铜层压板的方法，其通过使铜箔的表面进行化学氧化，从而在表面上形成由褐色至黑色的氧化铜构成的微细粗糙度，然后还原 在存在还原气体的气氛中构成微细粗糙度的氧化铜。

公开(公告)号：US4800182A

公开(公告)日：1989-01-24

申请号：US4476

申请日：1987-01-20

申请人： Kansei Izaki ,  Takamasa Kawakami ,  Kouichi Hakkei ,  Kazuhiro Ando

发明人： Kansei Izaki ,  Takamasa Kawakami ,  Kouichi Hakkei ,  Kazuhiro Ando

IPC分类号： C01B21/068 ,  C01B31/36 ,  C04B35/589 ,  C04B35/593 ,  C04B35/56 ,  C04B35/58

CPC分类号： C04B35/589 ,  C01B21/068 ,  C01B31/36 ,  C04B35/593 ,  C04B35/5935 ,  C01P2002/02 ,  C01P2004/03 ,  C01P2004/32 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/10 ,  C01P2006/80 ,  C01P2006/90

摘要： The invention relates to a sintered silicon nitride-silicon carbide composite material excellent in toughness and strength and to a process for producing the same. The present sintered composite material is substantially formed of silicon nitride predominantly in .beta.-phase and about 5 to 35% by weight of silicon carbide predominantly in .beta.-phase, which is characterized by the microstructure such that the silicon nitride is in the form of fine grains comprising elongated grains, 0.2 to 1.0 .mu.m in length of minor axis and 1 to 10 .mu.m in length of major axis, and equiaxed grains, 1 .mu.m or below in average size, and the silicon carbide is in the form of equiaxed grains, 1 .mu.m or below in average size, said silicon carbide grains being uniformly dispersed. Having a three-point flexural strength of at least 95 kg/mm.sup.2 and a fracture toughness (K.sub.IC) of at least 54 MN/m.sup.3/2, the present sintered material is excellent in toughness and strength. The process for producing such a material is disclosed in detail.

公开(公告)号：US4082786A

公开(公告)日：1978-04-04

申请号：US741114

申请日：1976-11-11

申请人： Masao Saito ,  Mamoru Onozawa ,  Kaoru Sasagawa ,  Takamasa Kawakami

发明人： Masao Saito ,  Mamoru Onozawa ,  Kaoru Sasagawa ,  Takamasa Kawakami

IPC分类号： B01J8/34 ,  C07C67/00 ,  C07C253/00 ,  C07C255/49 ,  C07C255/50 ,  C07C255/51 ,  C07C255/52 ,  C07C255/62 ,  C07C120/14

CPC分类号： C07C253/28 ,  B01J8/34

摘要： Aromatic nitriles can be produced at a high conversion and at a high selectivity by filling cylindrical wire netting into a fluidized bed reactor when the aromatic nitriles are produced by subjecting a mixture of an aromatic hydrocarbon, ammonia and molecular oxygen to fluid catalytic reaction in the presence of a fluid catalyst.