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    Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby
    1.
    发明授权
    Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby 有权
    由此获得光电混合板和光电混合板的制造方法

    公开(公告)号：US07747123B2

    公开(公告)日：2010-06-29

    申请号：US12358528

    申请日：2009-01-23

    申请人： Takami Hikita ,  Kazunori Mune ,  Toshiki Naitou ,  Yasunari Ooyabu

    发明人： Takami Hikita ,  Kazunori Mune ,  Toshiki Naitou ,  Yasunari Ooyabu

    IPC分类号： G02B6/12 ,  G02B6/10 ,  B29D11/00

    CPC分类号： G02B6/122 ,  G02B6/10 ,  G02B6/1221 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/048 ,  H05K3/107 ,  H05K3/281 ,  H05K2203/0723

    摘要： A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A resist layer is formed on a core-forming resin layer, and is then formed into a predetermined pattern. Resultant portions of the core-forming resin layer serve as cores (optical interconnect lines) 3. Next, a thin metal film 5 is formed on the under cladding layer 2 so as to cover the resist layer and the cores 3. Thereafter, the resist layer is removed together with portions of the thin metal film 5 lying on the surface of the resist layer. Electroplating is performed on the remaining portions of the thin metal film 5 to fill grooves 6 defined between adjacent ones of the cores 3 with electroplated layers 7a obtained by the electroplating. The electroplated layers 7a serve as electrical interconnect lines 7.

    摘要翻译： 一种制造光电混合基板的方法，其能够减少制造光电混合基板的步骤数量，并且能够实现要制造的光电混合基板的厚度的减小，以及光电 电动混合板。 在芯成型树脂层上形成抗蚀剂层，然后形成预定图案。 芯部形成树脂层的有效部分用作芯（光学互连线）3.接下来，在下敷层2上形成薄膜5，以覆盖抗蚀剂层和芯3.然后，将抗蚀剂 层与位于抗蚀剂层的表面上的薄金属膜5的一部分一起被去除。 对薄金属膜5的剩余部分进行电镀，以通过电镀获得的电镀层7a填充在相邻的芯3之间限定的槽6。 电镀层7a用作电互连线7。

    Printed circuit board and method of manufacturing the same
    4.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US08138427B2

    公开(公告)日：2012-03-20

    申请号：US12611985

    申请日：2009-11-04

    申请人： Jun Ishii ,  Toshiki Naitou ,  Mitsuru Honjo

    发明人： Jun Ishii ,  Toshiki Naitou ,  Mitsuru Honjo

    IPC分类号： H05K1/11

    CPC分类号： H05K3/4685 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0265 ,  H05K1/056 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155

    摘要： A printed circuit board and method of manufacturing the printed circuit board, including a first and second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. Through holes are formed in portions of a cover insulating layer above the connection portions, respectively. First connecting layers made of copper, for example, are formed to fill the through holes of the cover insulating layer. A substantially rectangular second connecting layer made of copper, for example, is formed to integrally cover upper ends of the connecting layers. This causes the first and second lines to be electrically connected to each other through the first and second connecting layers.

    摘要翻译： 印刷电路板和制造印刷电路板的方法，包括第一和第二写入布线图案，第一线的端部和第一写入布线图案的第二条线的末端布置在第三线的两侧 的第二写入布线图案。 圆形连接部设置在第一线和第二线的端部。 分别在连接部分上方的盖绝缘层的部分形成通孔。 例如，由铜制成的第一连接层形成为填充覆盖绝缘层的通孔。 例如，由铜构成的大致矩形的第二连接层形成为一体地覆盖连接层的上端。 这使得第一和第二线通过第一和第二连接层彼此电连接。

    Printed circuit board and method of manufacturing the same
    5.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US08080740B2

    公开(公告)日：2011-12-20

    申请号：US12358671

    申请日：2009-01-23

    申请人： Mitsuru Honjo ,  Toshiki Naitou ,  Katsutoshi Kamei

    发明人： Mitsuru Honjo ,  Toshiki Naitou ,  Katsutoshi Kamei

    IPC分类号： H05K1/11

    CPC分类号： H05K1/0218 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0237 ,  H05K1/056 ,  H05K3/4644 ,  H05K2201/0723 ,  H05K2201/09236

    摘要： A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace.

    摘要翻译： 在悬架体上形成第一绝缘层，在第一绝缘层上形成写入布线。 在第一绝缘层上形成第二绝缘层以覆盖布线迹线。 在第二绝缘层上形成接地层，以便位于布线迹线上方。 此外，在第二绝缘层上形成第三绝缘层以覆盖接地层。 在第三绝缘层上形成读取布线。 在第三绝缘层上形成第四绝缘层以覆盖布线迹线。