公开(公告)号：US08063652B2

公开(公告)日：2011-11-22

申请号：US11542759

申请日：2006-10-02

申请人： Takashi Amemiya ,  Syuichi Tsukada

发明人： Takashi Amemiya ,  Syuichi Tsukada

IPC分类号： G01R31/20

CPC分类号： G01R1/07371

摘要： The present invention stably maintains contact between probe pins and a wafer. Screws are provided at a plurality of positions in an outer circumferential portion of a printed circuit board. On a lower surface side of the outer circumferential portion of the printed circuit board, a retainer plate is provided, and a bottom end surface of each of the screws is held down with the retainer plate. Turning each of the screws in a state where the bottom end surface of the each of the screws is held down with the retainer plate causes the outer circumferential portion of the printed circuit board to be moved up and down. Adjusting a height of the outer circumferential portion of the printed circuit board by turning each of the screws located at the plurality of positions enables parallelism of the entire probe card with respect to the wafer to be adjusted.

摘要翻译： 本发明稳定地保持探针和晶片之间的接触。 螺钉设置在印刷电路板的外周部的多个位置。 在印刷电路板的外周部的下表面侧设置有保持板，并且每个螺钉的底端面用保持板保持。 在每个螺钉的底端表面用保持板压住的状态下转动每个螺钉使得印刷电路板的外周部分上下移动。 通过转动位于多个位置的每个螺钉来调节印刷电路板的外周部分的高度使得能够平行整个探针卡相对于待调整的晶片。

公开(公告)号：US07679385B2

公开(公告)日：2010-03-16

申请号：US11822577

申请日：2007-07-09

申请人： Takashi Amemiya ,  Syuichi Tsukada

发明人： Takashi Amemiya ,  Syuichi Tsukada

IPC分类号： G01R31/02

CPC分类号： G01R1/07314 ,  G01R1/06716 ,  G01R31/2831 ,  G01R31/31905

摘要： In the present invention, an inspection contact structure is attached to a lower surface side of a circuit board of a probe card. The inspection contact structure has a silicon substrate, and sheets attached to upper and lower surfaces of the silicon substrate. Each of the sheets is elastic and has conductive portions in a projecting shape. The silicon substrate is formed with current-carrying paths passing through the substrate in a vertical direction so that the conductive portions of the sheets and the current-carrying paths of the silicon substrate are in contact with each other. The upper and lower sheets are fixed to the silicon substrate, and the sheet on the upper surface is fixed to a circuit board.

摘要翻译： 在本发明中，检查接点结构安装在探针卡的电路板的下表面侧。 检查接触结构具有硅衬底，以及附着到硅衬底的上表面和下表面的片。 每个片是弹性的并且具有突出形状的导电部分。 硅衬底形成有沿垂直方向穿过衬底的载流路径，使得片的导电部分和硅衬底的通电路径彼此接触。 上下板固定在硅基板上，上表面的片固定在电路板上。

公开(公告)号：US20080048698A1

公开(公告)日：2008-02-28

申请号：US11630004

申请日：2005-06-29

申请人： Takashi Amemiya ,  Hisatomi Hosaka ,  Toshihiro Yonezawa ,  Syuichi Tsukada

发明人： Takashi Amemiya ,  Hisatomi Hosaka ,  Toshihiro Yonezawa ,  Syuichi Tsukada

IPC分类号： G01R1/073 ,  H01L21/66

CPC分类号： G01R1/07342 ,  G01R1/07357 ,  G01R1/07371

摘要： It is an object of the present invention to conduct highly reliable inspection by adjusting a contactor of a probe card and an inspection object in a prober to a parallel state even if the contactor and the inspection object become not parallel to each other. The present invention is a probe card mounted in a prober via a holder, the probe card including: a contactor; a circuit board electrically connected to the contactor; a reinforcing member reinforcing the circuit board; and a parallelism adjustment mechanism adjusting a degree of parallelism between the contactor and an inspection object disposed in the prober.

摘要翻译： 本发明的目的是即使接触器和检查对象彼此不平行，也可以通过将探针卡和探测器中的检查对象的接触器调节到平行状态来进行高度可靠的检查。 本发明是一种通过支架安装在探测器中的探针卡，探针卡包括：接触器; 电连接到所述接触器的电路板; 增强电路板的加强构件; 以及平行度调节机构，其调节接触器和设置在探测器中的检查对象之间的平行度。

公开(公告)号：US20070108996A1

公开(公告)日：2007-05-17

申请号：US11542759

申请日：2006-10-02

申请人： Takashi Amemiya ,  Syuichi Tsukada

发明人： Takashi Amemiya ,  Syuichi Tsukada

IPC分类号： G01R31/02

CPC分类号： G01R1/07371

摘要： The present invention stably maintains contact between probe pins and a wafer. Screws are provided at a plurality of positions in an outer circumferential portion of a printed circuit board. On a lower surface side of the outer circumferential portion of the printed circuit board, a retainer plate is provided, and a bottom end surface of each of the screws is held down with the retainer plate. Turning each of the screws in a state where the bottom end surface of the each of the screws is held down with the retainer plate causes the outer circumferential portion of the printed circuit board to be moved up and down. Adjusting a height of the outer circumferential portion of the printed circuit board by turning each of the screws located at the plurality of positions enables parallelism of the entire probe card with respect to the wafer to be adjusted.

摘要翻译： 本发明稳定地保持探针和晶片之间的接触。 螺钉设置在印刷电路板的外周部的多个位置。 在印刷电路板的外周部的下表面侧设置有保持板，并且每个螺钉的底端面用保持板保持。 在每个螺钉的底端表面用保持板压住的状态下转动每个螺钉使得印刷电路板的外周部分上下移动。 通过转动位于多个位置的每个螺钉来调节印刷电路板的外周部分的高度使得能够平行整个探针卡相对于待调整的晶片。

公开(公告)号：US20090015281A1

公开(公告)日：2009-01-15

申请号：US12170746

申请日：2008-07-10

申请人： Mutsuhiko Yoshioka ,  Akira Matsuura ,  Masaya Naoi ,  Takashi Amemiya ,  Syuichi Tsukada ,  Tomohisa Hoshino

发明人： Mutsuhiko Yoshioka ,  Akira Matsuura ,  Masaya Naoi ,  Takashi Amemiya ,  Syuichi Tsukada ,  Tomohisa Hoshino

IPC分类号： G01R31/28

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2808 ,  H05K1/0269 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/09918 ,  H05K2201/10378 ,  H05K2203/166 ,  Y02P70/613

摘要： The method is a method for positioning a three-layered rectangular frame-like anisotropic conductive connector in order to inspect the electrical properties of an object for inspection. The positioning is carried out in the following manner. The three-layered anisotropic conductive sheet is composed of a first anisotropic conductive sheet, a center substrate and a second anisotropic conductive sheet. Markings and through-holes are formed on the center substrate, and semi-transparent protrusions and through-holes are formed on each of the first anisotropic conductive sheet and the second anisotropic conductive sheet. The markings are identified through the semi-transparent protrusions by detecting means disposed on the side of the first anisotropic conductive sheet and the second anisotropic conductive sheet and thereby the positioning of the semi-transparent protrusions to the markings is carried out, whereby performing the positioning of the first anisotropic conductive sheet, the center substrate and the second anisotropic conductive sheet.

摘要翻译： 该方法是用于定位三层矩形框状的各向异性导电连接器以便检查被检查物体的电气特性的方法。 定位如下进行。 三层各向异性导电片由第一各向异性导电片，中心基片和第二各向异性导电片构成。 在中心基板上形成标记和通孔，并且在第一各向异性导电片和第二各向异性导电片之间形成半透明突起和通孔。 通过设置在第一各向异性导电片和第二各向异性导电片侧的检测装置通过半透明突起来识别标记，由此执行半透明突起到标记的定位，由此执行定位 的第一各向异性导电片，中心基片和第二各向异性导电片。

公开(公告)号：US20080007280A1

公开(公告)日：2008-01-10

申请号：US11822577

申请日：2007-07-09

申请人： Takashi Amemiya ,  Syuichi Tsukada

发明人： Takashi Amemiya ,  Syuichi Tsukada

IPC分类号： G01R31/02

CPC分类号： G01R1/07314 ,  G01R1/06716 ,  G01R31/2831 ,  G01R31/31905

摘要： In the present invention, an inspection contact structure is attached to a lower surface side of a circuit board of a probe card. The inspection contact structure has a silicon substrate, and sheets attached to upper and lower surfaces of the silicon substrate. Each of the sheets is elastic and has conductive portions in a projecting shape. The silicon substrate is formed with current-carrying paths passing through the substrate in a vertical direction so that the conductive portions of the sheets and the current-carrying paths of the silicon substrate are in contact with each other. The upper and lower sheets are fixed to the silicon substrate, and the sheet on the upper surface is fixed to a circuit board.

摘要翻译： 在本发明中，检查接点结构安装在探针卡的电路板的下表面侧。 检查接触结构具有硅衬底，以及附着到硅衬底的上表面和下表面的片。 每个片是弹性的并且具有突出形状的导电部分。 硅衬底形成有沿垂直方向穿过衬底的载流路径，使得片的导电部分和硅衬底的通电路径彼此接触。 上下板固定在硅基板上，上表面的片固定在电路板上。

公开(公告)号：US20090284272A1

公开(公告)日：2009-11-19

申请号：US12064167

申请日：2006-08-23

申请人： Toshihiro Yonezawa ,  Syuichi Tsukada

发明人： Toshihiro Yonezawa ,  Syuichi Tsukada

IPC分类号： G01R1/067 ,  G01R31/02

CPC分类号： G01R31/2891

摘要： Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe card 2 has a contactor 11 for supporting a probe 10, a printed wiring board 13 electrically connected to the contactor 11, and a reinforcement member 14. On the upper surface side of the probe card 2 is provided a top plate 70 connected to the reinforcement member 14 by a connection member 80. A groove 90 is formed in the upper surface of the top plate 70, and a strain gauge 91 is attached at the groove 90. When a wafer W and the probe 10 are in contact with each other, an upward load acts on the probe card 2 by pressure caused by the contact, and the load causes strain in the top plate 70. The amount of the strain in the top plate 70 is measured, and contact pressure between the wafer W and the probe 10 is regulated and set based on the amount of the strain.

摘要翻译： 晶片和探头之间的接触压力保持在适当的水平。 探针卡2具有用于支撑探针10的接触器11，与接触器11电连接的印刷线路板13和加强构件14.在探针卡2的上表面侧设置有与顶板70连接 加强构件14由连接构件80形成。在顶板70的上表面形成有槽90，并且在槽90处安装有应变计91.当晶片W和探头10与每个 另一方面，通过由接触引起的压力，向上的负载作用在探针卡2上，并且负载导致顶板70中的应变。测量顶板70中的应变量，并且测量晶片W与晶片W之间的接触压力 基于应变量来调节和设定探针10。

公开(公告)号：US08723544B2

公开(公告)日：2014-05-13

申请号：US13132370

申请日：2009-10-07

申请人： Shigekazu Komatsu ,  Syuichi Tsukada

发明人： Shigekazu Komatsu ,  Syuichi Tsukada

IPC分类号： G01R31/00

CPC分类号： G01R31/2891 ,  G01R1/07314

摘要： A probe card installed in a probe device includes a supporting plate capable of supporting a contact body and a circuit board installed above a top surface of the supporting plate. A connection member is installed at a top surface of the circuit board and the supporting plate and the connection member are connected to each other by a connection body. Load control members are installed at a top surface of the connection member and capable of maintaining a contact load between the contact body and an object to be inspected at a constant level. Elastic members are installed at a peripheral portion of the connection member and capable of fixing a horizontal position of the supporting plate. An intermediate member is installed between the circuit board and the supporting plate and configured to elastically and electrically connect the circuit board and the supporting plate.

摘要翻译： 安装在探针装置中的探针卡包括能够支撑接触体的支撑板和安装在支撑板的顶表面上方的电路板。 连接构件安装在电路板的顶表面处，并且支撑板和连接构件通过连接体相互连接。 负载控制构件安装在连接构件的顶表面处，并且能够以一定的水平维持接触体和被检查物体之间的接触负荷。 弹性构件安装在连接构件的周边部分并且能够固定支撑板的水平位置。 中间构件安装在电路板和支撑板之间，并且构造成弹性地和电连接电路板和支撑板。

公开(公告)号：US20110234251A1

公开(公告)日：2011-09-29

申请号：US13132370

申请日：2009-10-07

申请人： Shigekazu Komatsu ,  Syuichi Tsukada

发明人： Shigekazu Komatsu ,  Syuichi Tsukada

IPC分类号： G01R31/00

CPC分类号： G01R31/2891 ,  G01R1/07314

摘要： A probe card installed in a probe device includes a supporting plate capable of supporting a contact body and a circuit board installed above a top surface of the supporting plate. A connection member is installed at a top surface of the circuit board and the supporting plate and the connection member are connected to each other by a connection body. Load control members are installed at a top surface of the connection member and capable of maintaining a contact load between the contact body and an object to be inspected at a constant level. Elastic members are installed at a peripheral portion of the connection member and capable of fixing a horizontal position of the supporting plate. An intermediate member is installed between the circuit board and the supporting plate and configured to elastically and electrically connect the circuit board and the supporting plate.

摘要翻译： 安装在探针装置中的探针卡包括能够支撑接触体的支撑板和安装在支撑板的顶表面上方的电路板。 连接构件安装在电路板的顶表面处，并且支撑板和连接构件通过连接体相互连接。 负载控制构件安装在连接构件的顶表面处，并且能够以一定的水平维持接触体和被检查物体之间的接触负荷。 弹性构件安装在连接构件的周边部分并且能够固定支撑板的水平位置。 中间构件安装在电路板和支撑板之间，并且构造成弹性地和电连接电路板和支撑板。

公开(公告)号：US07847569B2

公开(公告)日：2010-12-07

申请号：US12064167

申请日：2006-08-23

申请人： Toshihiro Yonezawa ,  Syuichi Tsukada

发明人： Toshihiro Yonezawa ,  Syuichi Tsukada

IPC分类号： G01R31/02 ,  G01R31/26

CPC分类号： G01R31/2891

摘要： Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe card 2 has a contactor 11 for supporting a probe 10, a printed wiring board 13 electrically connected to the contactor 11, and a reinforcement member 14. On the upper surface side of the probe card 2 is provided a top plate 70 connected to the reinforcement member 14 by a connection member 80. A groove 90 is formed in the upper surface of the top plate 70, and a strain gauge 91 is attached at the groove 90. When a wafer W and the probe 10 are in contact with each other, an upward load acts on the probe card 2 by pressure caused by the contact, and the load causes strain in the top plate 70. The amount of the strain in the top plate 70 is measured, and contact pressure between the wafer W and the probe 10 is regulated and set based on the amount of the strain.

摘要翻译： 晶片和探头之间的接触压力保持在适当的水平。 探针卡2具有用于支撑探针10的接触器11，与接触器11电连接的印刷线路板13和加强构件14.在探针卡2的上表面侧设置有与顶板70连接 加强构件14由连接构件80形成。在顶板70的上表面形成有槽90，并且在槽90处安装有应变计91.当晶片W和探头10与每个 另一方面，通过由接触引起的压力，向上的负载作用在探针卡2上，并且负载导致顶板70中的应变。测量顶板70中的应变量，并且测量晶片W与晶片W之间的接触压力 基于应变量来调节和设定探针10。