公开(公告)号：US07151319B2

公开(公告)日：2006-12-19

申请号：US10876462

申请日：2004-06-28

申请人： Takashi Iida ,  Tatsuya Nagata ,  Seiji Miyamoto ,  Toshihiro Matsunaga

发明人： Takashi Iida ,  Tatsuya Nagata ,  Seiji Miyamoto ,  Toshihiro Matsunaga

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/50 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/3011

摘要： A BGA semiconductor device for high-speed operation and high pin counts has a base which is constituted by a core layer formed of wiring boards and surface layers provided on both sides of the core layer, and a semiconductor element mounted on the base. Through holes in a signal region of the core layer are disposed in an optimum through hole pattern in which power through holes and ground through holes are disposed adjacent to signal through holes.

摘要翻译： 用于高速操作和高引脚数的BGA半导体器件具有由布线板形成的芯层和设置在芯层两侧的表面层构成的基底和安装在基底上的半导体元件。 核心层的信号区域中的通孔设置在与信号通孔相邻的电源通孔和接地通孔中的最佳通孔图案中。

公开(公告)号：US20050017357A1

公开(公告)日：2005-01-27

申请号：US10876462

申请日：2004-06-28

申请人： Takashi Iida ,  Tatsuya Nagata ,  Seiji Miyamoto ,  Toshihiro Matsunaga

发明人： Takashi Iida ,  Tatsuya Nagata ,  Seiji Miyamoto ,  Toshihiro Matsunaga

IPC分类号： H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  E21B21/00 ,  H01L29/40

CPC分类号： H01L23/50 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/3011

摘要： A BGA semiconductor device for high-speed operation and high pin counts has a base which is constituted by a core layer formed of wiring boards and surface layers provided on both sides of the core layer, and a semiconductor element mounted on the base. Through holes in a signal region of the core layer are disposed in an optimum through hole pattern in which power through holes and ground through holes are disposed adjacent to signal through holes.

摘要翻译： 用于高速操作和高引脚数的BGA半导体器件具有由布线板形成的芯层和设置在芯层两侧的表面层构成的基底和安装在基底上的半导体元件。 芯层的信号区域中的通孔设置在最佳通孔图案中，其中电源通孔和接地通孔邻近信号通孔设置。

公开(公告)号：US07035081B2

公开(公告)日：2006-04-25

申请号：US10478800

申请日：2002-05-28

申请人： Tatsuya Nagata ,  Seiji Miyamoto ,  Hideko Ando

发明人： Tatsuya Nagata ,  Seiji Miyamoto ,  Hideko Ando

IPC分类号： H01G4/228

CPC分类号： H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/10674

摘要： The invention eliminates a need to increase a size of a semiconductor device and reduces occurrence of noise. A semiconductor device of the invention includes: a base (5) having front layers (9, 11) provided on respective sides of a core layer (7) formed by a printed circuit board, and a semiconductor chip (1) mounted on the base (5), wherein the semiconductor chip (1) is joined to one (9) of the front layers by using a joining member (3), and the other front layer (11) has a plurality of external terminals (55) arranged thereon, and the core layer (7) has a plurality of through-holes (41, 43, 45, 75, 77) formed therein to electrically connect the semiconductor chip (1) to the plurality of external terminals (55) together, and the plurality of through-holes (41, 43, 45, 75, 77) include a plurality of arrayed through-holes (41, 43, 45) arranged correspondingly to the arrangement of the plurality of external terminals (55) and one or more additional through-holes (75, 77) formed between the plurality of arrayed through-holes (41, 43, 45).

摘要翻译： 本发明不需要增加半导体器件的尺寸并减少噪声的发生。 本发明的半导体器件包括：基底（5），其具有设置在由印刷电路板形成的芯层（7）的相应侧上的前层（9,11）和安装在基底上的半导体芯片（1） （5），其中所述半导体芯片（1）通过使用接合部件（3）接合到所述前层中的一个（9），并且所述另一个前层（11）具有布置在其上的多个外部端子（55） ，芯层（7）具有形成在其中的多个通孔（41,43,45,75,77），以将半导体芯片（1）与多个外部端子（55）电连接在一起，并且 多个通孔（41,43,45,75,77）包括与多个外部端子（55）的布置相对应布置的多个排列的通孔（41,43,45）和一个或多个附加的 形成在多个排列的通孔（41,43,45）之间的通孔（75,77）。

公开(公告)号：US07415323B2

公开(公告)日：2008-08-19

申请号：US10734285

申请日：2003-12-15

申请人： Seiji Miyamoto ,  Hiroyuki Ihara

发明人： Seiji Miyamoto ,  Hiroyuki Ihara

IPC分类号： G06F9/54 ,  G06F9/44

CPC分类号： G06F9/545 ,  G06F8/10 ,  G06F9/541

摘要： A vehicle control apparatus comprises: a computer operable to execute a control program, a first memory storing the control program, and a second memory storing the produced data. The control program includes: a platform program for inputting data from a hardware device and storing inputted data as first data in a first section of the second memory, an application program for processing for a vehicle control in accordance with an AP interface, and a coupling processing program. The coupling processing program performs mediation in the processing using the application program by converting the first data provided from the processing using the platform program to second data in accordance with the PF interface so that the second data is adapted to the AP interface. The application program executes vehicle control by using the second data. The platform program performs an operation at different predetermined intervals than the coupling program.

摘要翻译： 车辆控制装置包括：可操作以执行控制程序的计算机，存储控制程序的第一存储器和存储产生的数据的第二存储器。 控制程序包括：用于从硬件设备输入数据并将输入数据作为第一数据存储在第二存储器的第一部分中的平台程序，用于根据AP接口进行车辆控制处理的应用程序，以及耦合 处理程序。 耦合处理程序在使用应用程序的处理中执行中介，通过根据PF接口将从使用平台程序的处理提供的第一数据转换为第二数据，使得第二数据适应于AP接口。 应用程序通过使用第二数据执行车辆控制。 平台程序以与耦合程序不同的预定间隔执行操作。

公开(公告)号：US07940689B2

公开(公告)日：2011-05-10

申请号：US11882290

申请日：2007-07-31

申请人： Ryusuke Fukui ,  Seiji Miyamoto ,  Takahiro Shidai ,  Waka Noda

发明人： Ryusuke Fukui ,  Seiji Miyamoto ,  Takahiro Shidai ,  Waka Noda

IPC分类号： H04L12/26 ,  H04B1/44 ,  G05D1/00

CPC分类号： H04L12/66 ,  G06F9/546 ,  G06F9/547 ,  H04L67/12 ,  H04L2001/0094

摘要： An apparatus is provided for managing communication among a plurality of process means respectively operating on given control programs realizing functions necessary for a vehicle. The plural process means includes a first process means issuing requesting messages for requesting a function and a second process means receiving the requesting message, performing a process requested by each requesting massage, and sending back a response indicating results of the process to the first process means. In the apparatus, storage means stores therein, of the requesting massages issued, only response-waiting messages issued by the first process means and received by the second process means. A measuring component measures an elapse of time from a time when the request stored in the storage is received by the second process means. A determining component determines whether or not the elapse of time measured by the measuring component reaches a preset value.

摘要翻译： 提供了一种用于管理分别对实现车辆所需功能的给定控制程序进行操作的多个处理装置之间的通信的装置。 多个处理装置包括发出请求消息以请求功能的第一处理装置和接收请求消息的第二处理装置，执行由每个请求按摩请求的处理，并且向第一处理装置发送指示处理结果的响应 。 在装置中，存储装置存储发出的请求按摩按钮，仅存储由第一处理装置发出并由第二处理装置接收的响应等待消息。 测量部件测量从存储在存储器中的请求由第二处理装置接收的时间的经过。 确定部件确定由测量部件测量的时间的经过是否达到预设值。

公开(公告)号：US20080027588A1

公开(公告)日：2008-01-31

申请号：US11882290

申请日：2007-07-31

申请人： Ryusuke Fukui ,  Seiji Miyamoto ,  Takahiro Shidai ,  Waka Noda

发明人： Ryusuke Fukui ,  Seiji Miyamoto ,  Takahiro Shidai ,  Waka Noda

IPC分类号： G06F7/00

CPC分类号： H04L12/66 ,  G06F9/546 ,  G06F9/547 ,  H04L67/12 ,  H04L2001/0094

摘要： An apparatus is provided for managing communication among a plurality of process means respectively operating on given control programs realizing functions necessary for a vehicle. The plural process means includes a first process means issuing requesting messages for requesting a function and a second process means receiving the requesting message, performing a process requested by each requesting massage, and sending back a response indicating results of the process to the first process means. In the apparatus, storage means stores therein, of the requesting massages issued, only response-waiting messages issued by the first process means and received by the second process means. A measuring component measures an elapse of time from a time when the request stored in the storage is received by the second process means. A determining component determines whether or not the elapse of time measured by the measuring component reaches a preset value.

摘要翻译： 提供了一种用于管理分别对实现车辆所需功能的给定控制程序进行操作的多个处理装置之间的通信的装置。 多个处理装置包括发出请求消息以请求功能的第一处理装置和接收请求消息的第二处理装置，执行由每个请求按摩请求的处理，并且向第一处理装置发送指示处理结果的响应 。 在装置中，存储装置存储发出的请求按摩按钮，仅存储由第一处理装置发出并由第二处理装置接收的响应等待消息。 测量部件测量从存储在存储器中的请求由第二处理装置接收的时间的经过。 确定部件确定由测量部件测量的时间的经过是否达到预设值。

公开(公告)号：US08010257B2

公开(公告)日：2011-08-30

申请号：US11717179

申请日：2007-03-13

申请人： Takahiro Shidai ,  Seiji Miyamoto ,  Waka Noda ,  Ryo Ito ,  Hiroyuki Hirano

发明人： Takahiro Shidai ,  Seiji Miyamoto ,  Waka Noda ,  Ryo Ito ,  Hiroyuki Hirano

IPC分类号： G06F11/30

CPC分类号： B60R16/0231 ,  H04J3/0682 ,  H04J3/14 ,  H04L67/12

摘要： An electronic control unit is incorporated as one of a plurality of electronic controllers composing a system for controlling in-vehicle devices on a distributed and mutually-synchronized control manner in a vehicle. The plurality of electronic control units are communicably connected with each other via an in-vehicle network to communicate information including the time-dependent data among the electronic control units. Each electronic control unit comprises a control member, an elapsed-time calculation component, and a validity determination component. The control member performs the control on the basis of time-dependent data acquired in time series relating to the vehicle. The elapsed-time calculation component is configured to calculate an elapsed time elapsing from acquisition of the time-dependent data. The validity determination component is configured to use the calculated elapsed time to determine whether or not the time-dependent data is valid or not for the control in terms of freshness of the time-dependent data.

摘要翻译： 电子控制单元被结合为构成用于在车辆中以分布式和相互同步的控制方式控制车载设备的系统的多个电子控制器之一。 多个电子控制单元经由车载网络彼此可通信地连接，以在电子控制单元之间传送包括时间相关数据的信息。 每个电子控制单元包括控制构件，经过时间计算部件和有效性确定部件。 控制构件基于与车辆相关的时间序列获取的时间相关数据来执行控制。 经过时间计算部件被配置为计算从获取时间依赖数据所经过的经过时间。 有效性确定组件被配置为使用所计算的经过时间来确定时间相关数据对于控制的时间依赖数据的新鲜度是否有效。

公开(公告)号：US20110062593A1

公开(公告)日：2011-03-17

申请号：US12838447

申请日：2010-07-17

申请人： Tatsunobu ABE ,  Seiji Miyamoto

发明人： Tatsunobu ABE ,  Seiji Miyamoto

IPC分类号： H01L23/538 ,  H01L23/52

CPC分类号： H01L23/481 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor packaging substrate with a plurality of pads arranged in a square grid pattern thereon, in which among the pads, two pads obliquely adjacent to each other are connected with through-holes respectively and another through-hole is provided between the through-holes connected with the two pads obliquely adjacent to each other.

摘要翻译： 一种半导体封装基板，其上具有以方格栅格图案排列的多个焊盘，其中在焊盘中彼此相邻倾斜的两个焊盘分别连接有通孔，并且在连接的通孔之间设置另一个通孔 两个垫彼此倾斜相邻。

公开(公告)号：US20060147441A1

公开(公告)日：2006-07-06

申请号：US11378647

申请日：2006-03-20

申请人： Wataru Morikawa ,  Seiji Miyamoto

发明人： Wataru Morikawa ,  Seiji Miyamoto

IPC分类号： A61K38/46

CPC分类号： A61K38/484

摘要： The present invention provides a plasminogen fragment with the activity to inhibit tumor metastasis and growth, a process for preparing said fragment and an agent for inhibiting tumor metastasis and growth comprising said fragment as an active ingredient. The plasminogen fragment of the present invention is prepared from a elastase lysate of Lys-Plasminogen, which is produced by treating a natural plasminogen with plasmin, and preferably exhibits a strong heparin binding activity. The agent for inhibiting tumor metastasis and growth comprising the plasminogen fragment as an active ingredient of the present invention is useful for clinically treating solid cancers such as lung cancer or colon cancer.

公开(公告)号：US06747356B2

公开(公告)日：2004-06-08

申请号：US10386441

申请日：2003-03-13

申请人： Hideko Ando ,  Seiji Miyamoto

发明人： Hideko Ando ,  Seiji Miyamoto

IPC分类号： H01L2348

CPC分类号： H01L23/66 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/0298 ,  H05K3/4602 ,  H05K2201/0191

摘要： Control of the characteristic impedance of wirings is performed with high accuracy. Relative to a first wiring of a second wiring layer arranged above a through hole of a core layer in a package board, the thickness of a first insulating layer between a first wiring layer on the surface of the core layer and the second wiring layer is made large, and the thickness of a second insulating layer between a third wiring layer that is a plane layer on the side of opposite thereto and the second wiring layer is made small, thereby allowing for: reducing the impedance coupling between the power plane of the first wiring layer on the surface of the core layer and the first and second wirings; reinforcing the impedance coupling between the power plane of the third wiring layer on the side opposite thereto and the first and second wirings; and achieving the reduction of the difference in the characteristic impedance between the first wiring arranged just above the through hole and the second wiring arranged away from just above the through hole.

摘要翻译： 高精度地进行布线特性阻抗的控制。 相对于在封装基板中配置在芯层的通孔上方的第二布线层的第一布线，使得在芯层表面上的第一布线层和第二布线层之间的第一绝缘层的厚度 并且在与其相对侧的平面层的第三布线层和第二布线层之间的第二绝缘层的厚度变小，从而允许：降低第一布线层的第一布线层与第二布线层之间的阻抗耦合。 芯层表面上的布线层和第一和第二布线; 加强第三布线层的与其相反的一侧的电源面与第一和第二布线之间的阻抗耦合; 并且实现了布置在通孔正上方的第一布线与远离通孔正上方布置的第二布线之间的特性阻抗差的减小。