公开(公告)号：US20100252938A1

公开(公告)日：2010-10-07

申请号：US12751296

申请日：2010-03-31

申请人： Takashi OZAWA ,  Seiji Sato ,  Kazuyuki Izumi

发明人： Takashi OZAWA ,  Seiji Sato ,  Kazuyuki Izumi

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L24/16 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06582 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes: a semiconductor element mounted on a one-sided plane of a wiring board; an underfill agent dropped so as to be filled between the semiconductor element and the wiring board; and a pad group constituted by a plurality of pads which are formed in the vicinity of a circumference of the wiring board and along the circumference, the pad group being formed on a bottom plane of a groove portion formed in a solder resist which covers the one-sided plane of the wiring board, wherein a corner edge of the groove portion located in the vicinity of a dropping starting portion to which dropping of the underfill agent is started is formed at an obtuse angle or in an arc shape in order to avoid the dropped underfill agent from entering into an inner portion of the groove portion.

摘要翻译： 半导体封装包括：安装在布线板的单面平面上的半导体元件; 底部填充剂下降以便填充在半导体元件和布线板之间; 以及由多个焊盘构成的焊盘组，所述焊盘组形成在所述布线板的周边附近并且沿着所述周边，所述焊盘组形成在形成在阻焊剂中的沟槽部的底面上，所述阻焊层覆盖所述一个 其中位于底部填充剂下落的下落起始部分附近的槽部的角部边缘以钝角或弧形形成，以避免 落下的底部填充剂进入凹槽部分的内部。

公开(公告)号：US20110216047A1

公开(公告)日：2011-09-08

申请号：US13033044

申请日：2011-02-23

申请人： Takashi OZAWA

发明人： Takashi OZAWA

IPC分类号： G09G5/00

CPC分类号： G09G5/00

摘要： In a projector, if an image signal other than the currently selected image signal is input, the image signal is switched to the other image signal according to the position of a shutter.

摘要翻译： 在投影仪中，如果输入了当前选择的图像信号以外的图像信号，则根据快门的位置将图像信号切换到另一图像信号。

公开(公告)号：US20110164192A1

公开(公告)日：2011-07-07

申请号：US12978894

申请日：2010-12-27

申请人： Takashi OZAWA

发明人： Takashi OZAWA

IPC分类号： H04N9/31

CPC分类号： G03B21/14 ,  G03B21/53 ,  H04N9/3185

摘要： A projector includes: an image projection unit that projects a projection image generated based on input image data onto a projection surface; a projection distance measurement unit that measures a projection distance from the projector to the projection surface; and an adjusting unit that adjusts the project ion image in accordance with the projection distance so that the projection image is projected onto the projection surface under a predetermined projection condition.

摘要翻译： 投影机包括：图像投影单元，其将基于输入图像数据生成的投影图像投影到投影面上; 投影距离测量单元，其测量从投影仪到投影表面的投影距离; 以及调整单元，其根据投影距离调整投影离子图像，使得投影图像在预定投影条件下投影到投影表面上。

公开(公告)号：US20110149175A1

公开(公告)日：2011-06-23

申请号：US12969937

申请日：2010-12-16

申请人： Takashi OZAWA ,  Mitsuhiko IGARASHI

发明人： Takashi OZAWA ,  Mitsuhiko IGARASHI

IPC分类号： H04N9/31

CPC分类号： H04N9/3185

摘要： A projector includes: an image projecting section that projects an image; a ruled line storage section that stores ruled line data of a ruled line; a ruled line reading unit that reads the ruled line data of the ruled line from the ruled line storage section so as to make the image projecting section project the ruled line corresponding to the ruled line data; a ruled line editing unit that performs editing for changing the structure of the projected ruled line; and a storage processing unit that makes the ruled line storage section store the edited ruled line data corresponding to the ruled line changed by the ruled line editing unit.

摘要翻译： 投影仪包括：投影图像的图像投影部; 划线线路存储部，其存储划线的划线数据; 划线读取单元，从划线存储部读取划线的划线数据，使图像投影部投影与格线数据对应的划线; 用于改变投影划线的结构的编辑线; 以及存储处理单元，其使所述划线存储部存储与由所述划线编辑单元改变的所述划线对应的编辑的划线数据。

公开(公告)号：US20110316150A1

公开(公告)日：2011-12-29

申请号：US13168039

申请日：2011-06-24

申请人： Takashi OZAWA

发明人： Takashi OZAWA

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L23/49816 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor package includes a first board, a semiconductor chip having a first face and a second face at an opposite side to the first face, the semiconductor chip being mounted on the first board with the first face facing the first board, an insulating film provided on the second face of the semiconductor chip, and a second board stacked on the first board. A bump provided on a face of the second board facing the first board is connected to a pad provided on a face of the first board facing the second board and a gap is formed between the first board and the second board. The semiconductor chip and the insulating film are provided in the gap.

摘要翻译： 半导体封装包括第一板，具有第一面的半导体芯片和与第一面相反一侧的第二面，半导体芯片安装在第一板上，第一面朝向第一板，设置绝缘膜 在半导体芯片的第二面上，以及堆叠在第一板上的第二板。 设置在面向第一板的第二板的表面上的凸块连接到设置在面向第二板的第一板的表面上的焊盘，并且在第一板和第二板之间形成间隙。 半导体芯片和绝缘膜设置在间隙中。

公开(公告)号：US20110181846A1

公开(公告)日：2011-07-28

申请号：US13013267

申请日：2011-01-25

申请人： Takashi OZAWA

发明人： Takashi OZAWA

IPC分类号： G03B21/14

CPC分类号： G03B21/14 ,  H04N9/3185

摘要： A projector includes: an image projection unit that projects an image; a trapezoidal correction unit that performs trapezoidal correction on the image projected by the image projection unit; a nonvolatile storage unit that stores the amount of previous trapezoidal correction and a predetermined acceptable value associated with the amount of previous trapezoidal correction, the amount of previous trapezoidal correction being used immediately before at least one of when the projector is turned off and when signal processing is changed; and an adjustment unit that sets, if the amount of previous trapezoidal correction is greater than the predetermined acceptable value, the amount of trapezoidal correction to be performed by the trapezoidal correction unit at a predetermined standard value or zero after the projector is activated or after the signal processing is changed.

摘要翻译： 投影仪包括：投影图像的图像投影单元; 梯形校正单元，对由图像投影单元投影的图像执行梯形校正; 非易失性存储单元，其存储先前梯形校正量和与先前梯形校正量相关联的预定可接受值，紧接在投影仪关闭时和信号处理之间的至少一个时使用的先前梯形校正量 改变了 以及调整单元，如果先前梯形校正量大于预定可接受值，则在激活投影仪之后或梯形校正单元执行的梯形校正单元在预定标准值或零之后执行的梯形校正量 信号处理改变。

公开(公告)号：US20110110146A1

公开(公告)日：2011-05-12

申请号：US12963118

申请日：2010-12-08

申请人： Takashi OZAWA

发明人： Takashi OZAWA

IPC分类号： G11C11/00

CPC分类号： G11C11/412

摘要： A semiconductor memory maintains securely the stored contents in the memory cells, and it is written with data reliably even in a case where a relatively low supply voltage is applied. A memory cell M00 comprises a pair of inverters cross-coupled with each other, a first switching unit provided between bit line BL and the output terminal of one of the inverters, and a second switching unit provided between bit line XBL and the output terminal of the other inverter. The first switching unit and the second switching unit are controlled to be conductive such that the conductance of the switches be larger for the writing operation than for the reading operation.

摘要翻译： 半导体存储器可靠地维护存储单元中的存储内容，并且即使在施加相对低的电源电压的情况下也可以可靠地写入数据。 存储单元M00包括彼此交叉耦合的一对反相器，第一开关单元，设置在位线BL和反相器之一的输出端子之间，第二开关单元设置在位线XBL和输出端子之间 另一台逆变器。 第一开关单元和第二开关单元被控制为导通，使得开关的电导对于写入操作而言大于读取操作。

公开(公告)号：US20090283317A1

公开(公告)日：2009-11-19

申请号：US12465964

申请日：2009-05-14

申请人： Takashi OZAWA

发明人： Takashi OZAWA

IPC分类号： H05K1/11

CPC分类号： H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K3/305 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2224/05599

摘要： A wiring board between which and a chip to be mounted a resin is filled includes: a substrate body on which a conductor portion to be connected to an electrode terminal of the chip is formed; and an insulating protection film formed on the substrate body and having an opening portion formed therein to expose the conductor portion. The opening portion is formed in such a manner that the edge thereof is positioned along and outside the outer shape of the chip except for a specific corner portion, and that the edge in the specific corner portion is positioned on a side of or inside the outer shape of the chip.

摘要翻译： 填充有树脂的芯片与布线基板之间的布线板包括：形成与芯片的电极端子连接的导体部的基板主体; 以及形成在所述基板主体上并具有形成在其中以使所述导体部分露出的开口部的绝缘保护膜。 开口部形成为除了特定的角部以外，除了特定的角部之外，其边缘位于芯片的外形外侧，并且特定角部的边缘位于外侧的外侧 形状的芯片。