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公开(公告)号：US20090310277A1
公开(公告)日：2009-12-17
申请号：US12469799
申请日：2009-05-21
申请人： Takayuki Kayatani , Akihiro Motoki
发明人： Takayuki Kayatani , Akihiro Motoki
IPC分类号： H01G4/228
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes a ceramic body including a plurality of ceramic layers, the ceramic body having a first main surface and a second main surface and a plurality of side surfaces that connect the first main surface to the second main surface, an internal conductor including nickel, the internal conductor being disposed in the ceramic body and having an exposed portion exposed at least one of the side surfaces, and an external terminal electrode disposed on at least one of the side surfaces of the ceramic body, the external terminal electrode being electrically connected to the internal conductor. The external terminal electrode includes a first conductive layer including a Sn—Cu—Ni intermetallic compound, the first conductive layer covering the exposed portion of the internal conductor at least one of the side surfaces of the ceramic body.
摘要翻译： 多层陶瓷电子部件包括陶瓷体，陶瓷体包括多个陶瓷层，陶瓷体具有第一主表面和第二主表面以及将第一主表面连接到第二主表面的多个侧表面，内部导体 包括镍，所述内部导体设置在所述陶瓷体中，并具有露出至少一个所述侧面的露出部分，以及设置在所述陶瓷体的至少一个侧面上的外部端子电极，所述外部端子电极为 电连接到内部导体。 外部端子电极包括包含Sn-Cu-Ni金属间化合物的第一导电层，第一导电层覆盖陶瓷体的至少一个侧表面的内部导体的暴露部分。
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公开(公告)号：US07570477B2
公开(公告)日：2009-08-04
申请号：US12261144
申请日：2008-10-30
申请人： Takayuki Kayatani
发明人： Takayuki Kayatani
CPC分类号： H01G13/006 , H01G4/2325 , H01G4/252 , H01G4/30
摘要： In a ceramic electronic component, an electrically conductive resin layer is arranged to cover a thick film layer and to extend beyond the end of the thick film layer by at least about 100 μm and a plating layer is arranged to cover the electrically conductive resin layer except a region having a dimension of at least about 50 μm and extending along the end of the electrically conductive resin layer. Consequently, the concentration of the stress is reduced.
摘要翻译： 在陶瓷电子部件中，导电性树脂层被设置为覆盖厚膜层并且延伸超过厚膜层的端部至少约100μm，并且布置覆盖导电树脂层的镀层，除了 具有至少约50μm的尺寸并且沿着导电树脂层的端部延伸的区域。 因此，应力的浓度降低。
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公开(公告)号：US06614641B2
公开(公告)日：2003-09-02
申请号：US10117276
申请日：2002-04-08
IPC分类号： H01G412
CPC分类号： H01G4/228 , H01C1/144 , H01L23/4827 , H01L41/0477 , H01L2224/4847 , H01L2224/4918
摘要： A ceramic electronic component includes a ceramic body; terminal electrodes formed on the ceramic body; and lead terminals joined to the terminal electrodes with solder containing Sn. Each terminal electrode includes a first electrode layer formed on the ceramic body and a second electrode layer formed on the first electrode layer. The second electrode layer contains a conductive constituent containing at least Zn, Ag and/or Cu, and Sn. The Zn content in the second electrode layer is about 4% by weight or more in relation to 100% by weight of the conductive constituent and is within the solubility limit not forming AgZn and/or CuZn intermetallic compounds.
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公开(公告)号：US09111690B2
公开(公告)日：2015-08-18
申请号：US12543549
申请日：2009-08-19
CPC分类号： H01G4/2325 , H01C1/148 , H01C7/18 , H01G4/30 , Y10T29/435
摘要： A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 μm by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.
摘要翻译： 一种方法用于制造包括多层复合材料的多层电子部件，所述多层复合材料包括具有在所述多层复合材料的预定表面露出的端部的内部电极。 在该方法中，内部电极的露出端涂覆有主要由选自Pd，Au，Pt和Ag的至少一种金属的金属膜，并且具有至少约0.1μm的厚度，通过将 在含有金属离子或金属络合物的液体中的多层复合材料。 然后，通过在暴露于多层复合材料的预定表面的内部电极的端部上沉积电镀金属，随后使电镀金属的沉积物彼此连接而形成连续镀层。 因此，内部电极的露出端彼此电连接。
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5.发明授权公开(公告)号：US08587919B2
公开(公告)日：2013-11-19
申请号：US13208393
申请日：2011-08-12
IPC分类号： H01G4/30
摘要： In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni—P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating.
摘要翻译： 在层叠型陶瓷电子部件中，当通过电镀直接形成在组件主体的表面上的层叠陶瓷电容器的外部电极时，直接镀膜的膜相对于部件主体可具有低的固定强度 。 作为外部电极，首先形成由P含量为约9重量％以上的Ni-P镀膜构成的第一镀层，以使各个内部电极的露出端作为起点沉积的电镀沉积为 在组件主体的至少一个端面上生长。 然后，在第一镀层上形成由基本上不含P的Ni镀膜构成的第二镀层。 优选地，通过无电镀形成第一镀层，而通过电解电镀形成第二镀层。
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公开(公告)号：US08014123B2
公开(公告)日：2011-09-06
申请号：US12469799
申请日：2009-05-21
申请人： Takayuki Kayatani , Akihiro Motoki
发明人： Takayuki Kayatani , Akihiro Motoki
IPC分类号： H01G4/228
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes a ceramic body including a plurality of ceramic layers, the ceramic body having a first main surface and a second main surface and a plurality of side surfaces that connect the first main surface to the second main surface, an internal conductor including nickel, the internal conductor being disposed in the ceramic body and having an exposed portion exposed at least one of the side surfaces, and an external terminal electrode disposed on at least one of the side surfaces of the ceramic body, the external terminal electrode being electrically connected to the internal conductor. The external terminal electrode includes a first conductive layer including a Sn—Cu—Ni intermetallic compound, the first conductive layer covering the exposed portion of the internal conductor at least one of the side surfaces of the ceramic body.
摘要翻译： 多层陶瓷电子部件包括陶瓷体，陶瓷体包括多个陶瓷层，陶瓷体具有第一主表面和第二主表面以及将第一主表面连接到第二主表面的多个侧表面，内部导体 包括镍，所述内部导体设置在所述陶瓷体中，并具有露出至少一个所述侧面的露出部分，以及设置在所述陶瓷体的至少一个侧面上的外部端子电极，所述外部端子电极为 电连接到内部导体。 外部端子电极包括包含Sn-Cu-Ni金属间化合物的第一导电层，第一导电层覆盖陶瓷体的至少一个侧表面的内部导体的暴露部分。
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7.发明授权公开(公告)号：US08503160B2
公开(公告)日：2013-08-06
申请号：US13208416
申请日：2011-08-12
CPC分类号： H01G4/005 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.
摘要翻译： 在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度 。 为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积 组件主体的端面。 然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。 优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。
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8.发明授权Multilayer ceramic electronic component and mounting structure and method for the same 有权多层陶瓷电子元件及其安装结构及方法相同公开(公告)号：US06903919B2
公开(公告)日：2005-06-07
申请号：US10830721
申请日：2004-04-23
CPC分类号： H01G2/103 , H05K3/3442 , H05K2201/0129 , H05K2201/10636 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , Y10T29/43 , Y10T29/435
摘要： A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer flows to expose external electrodes of the electronic component. The exposed external electrodes are soldered to electrodes of the substrate. In the resultant mounting structure, the thermoplastic resin layer covers substantially the entire surface except for the soldered portion of the electronic component and a portion of the solder.
摘要翻译： 通过用通过焊接安装在基板上的热塑性树脂层覆盖电容器元件来制备多层陶瓷电子部件。 由于焊接所需的热量，热塑性树脂层熔融。 熔融树脂层流动以暴露电子部件的外部电极。 暴露的外部电极焊接到基板的电极。 在所得到的安装结构中，除了电子部件的焊接部分和焊料的一部分之外，热塑性树脂层基本上覆盖整个表面。
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