Vacuum processing apparatus
    1.
    发明申请
    Vacuum processing apparatus 审中-公开
    真空加工设备

    公开(公告)号:US20070068628A1

    公开(公告)日:2007-03-29

    申请号:US11362868

    申请日:2006-02-28

    IPC分类号: H01L21/306 C23C16/00

    摘要: A vacuum processing apparatus having an improved wafer processing efficiency and an improved working efficiency is provided. The vacuum processing apparatus includes a vacuum container in which a specimen is processed with plasma generated from a processing gas supplied to the vacuum container; a transfer container through which the specimen processed in the vacuum container is transferred, the transfer container being coupled to the vacuum container under ambient pressure; a blower for generating an ambient gas flow in the transfer container and an outlet disposed on the transfer container; a storage container for storing the specimen processed in the vacuum container, the storage container being disposed in the ambient gas flow in the transfer container; and an exhauster for exhausting a gas in the storage container.

    摘要翻译: 提供了一种具有改进的晶片处理效率和提高的工作效率的真空处理设备。 真空处理装置包括:真空容器,其中用从供给到真空容器的处理气体产生的等离子体处理试样; 在真空容器中处理的试样被转移通过的转移容器,转印容器在环境压力下连接到真空容器; 用于在所述转移容器中产生环境气流的鼓风机和设置在所述转移容器上的出口; 储存容器,用于储存处理在真空容器中的试样,该储存容器设置在转移容器中的环境气流中; 以及用于排出储存容器中的气体的排气装置。

    Vacuum processing apparatus
    2.
    发明申请
    Vacuum processing apparatus 失效
    真空加工设备

    公开(公告)号:US20070068626A1

    公开(公告)日:2007-03-29

    申请号:US11512309

    申请日:2006-08-30

    IPC分类号: C23F1/00 H01L21/306

    摘要: A plasma processing apparatus which contributes to reducing required time for maintenance and thereby to enhancing the efficiency of processing and that of apparatus operation is to be provided. A vacuum processing apparatus comprises a vacuum vessel in which a substrate-shaped sample is arranged in an internally arranged processing chamber in which the pressure is reduced; a transfer chamber to which the vacuum vessel is linked and through whose inside reduced in pressure the sample is transferred; a passage which establishes communication between the transfer chamber and the vacuum vessel in a state in which the transfer chamber and the processing chamber are linked to each other and through whose inside the sample not yet processed or already processed is transferred; and a covering member which is removably coupled to cover the internal wall face of the passage, wherein the sample is processed within the processing chamber with a plasma formed in the processing chamber.

    摘要翻译: 提供一种等离子体处理装置,其有助于减少维护所需的时间,从而提高处理效率和装置操作的效率。 真空处理装置包括真空容器,其中基板形样品布置在其中压力降低的内部布置的处理室中; 传送室,真空容器连接到该传送室,并且其内部的压力降低,样品被传送; 在传送室和处理室彼此连接并且样品尚未处理或已经被处理的内部的状态下传送在传送室和真空容器之间建立连通的通道; 以及覆盖部件,其可移除地联接以覆盖通道的内壁面,其中,在处理室内用处理室中形成的等离子体处理样品。

    Vacuum processing apparatus
    3.
    发明授权
    Vacuum processing apparatus 失效
    真空加工设备

    公开(公告)号:US08048259B2

    公开(公告)日:2011-11-01

    申请号:US11512309

    申请日:2006-08-30

    IPC分类号: C23F1/00 C23C16/00 C23C14/00

    摘要: A plasma processing apparatus which contributes to reducing required time for maintenance and thereby to enhancing the efficiency of processing and that of apparatus operation is to be provided. A vacuum processing apparatus comprises a vacuum vessel in which a substrate-shaped sample is arranged in an internally arranged processing chamber in which the pressure is reduced; a transfer chamber to which the vacuum vessel is linked and through whose inside reduced in pressure the sample is transferred; a passage which establishes communication between the transfer chamber and the vacuum vessel in a state in which the transfer chamber and the processing chamber are linked to each other and through whose inside the sample not yet processed or already processed is transferred; and a covering member which is removably coupled to cover the internal wall face of the passage, wherein the sample is processed within the processing chamber with a plasma formed in the processing chamber.

    摘要翻译: 提供一种等离子体处理装置,其有助于减少维护所需的时间,从而提高处理效率和装置操作的效率。 真空处理装置包括真空容器,其中基板形样品布置在其中压力降低的内部布置的处理室中; 传送室,真空容器连接到该传送室,并且其内部的压力降低,样品被传送; 在传送室和处理室彼此连接并且样品尚未处理或已经被处理的内部的状态下传送在传送室和真空容器之间建立连通的通道; 以及覆盖部件,其可移除地联接以覆盖通道的内壁面,其中,在处理室内用处理室中形成的等离子体处理样品。

    VACUUM PROCESSING APPARAUTS
    4.
    发明申请
    VACUUM PROCESSING APPARAUTS 审中-公开
    真空加工设备

    公开(公告)号:US20090078372A1

    公开(公告)日:2009-03-26

    申请号:US12277184

    申请日:2008-11-24

    IPC分类号: C23F1/08

    摘要: A vacuum processing apparatus having an improved wafer processing efficiency and an improved working efficiency is provided. The vacuum processing apparatus includes a vacuum container in which a specimen is processed with plasma generated from a processing gas supplied to the vacuum container; a transfer container through which the specimen processed in the vacuum container is transferred, the transfer container being coupled to the vacuum container under ambient pressure; a blower for generating an ambient gas flow in the transfer container and an outlet disposed on the transfer container; a storage container for storing the specimen processed in the vacuum container, the storage container being disposed in the ambient gas flow in the transfer container; and an exhauster for exhausting a gas in the storage container.

    摘要翻译: 提供了一种具有改进的晶片处理效率和提高的工作效率的真空处理设备。 真空处理装置包括:真空容器,其中用从供给到真空容器的处理气体产生的等离子体处理试样; 在真空容器中处理的试样被转移通过的转移容器,转印容器在环境压力下连接到真空容器; 用于在所述转移容器中产生环境气流的鼓风机和设置在所述转移容器上的出口; 储存容器,用于储存处理在真空容器中的试样,该储存容器设置在转移容器中的环境气流中; 以及用于排出储存容器中的气体的排气装置。

    Vacuum chamber
    5.
    发明授权
    Vacuum chamber 失效
    真空室

    公开(公告)号:US08532818B2

    公开(公告)日:2013-09-10

    申请号:US12712861

    申请日:2010-02-25

    IPC分类号: G06F7/00

    CPC分类号: H01L21/67766 H01L21/67778

    摘要: A vacuum chamber includes: a vacuum vessel arranged at the backward side, where a wafer of a processing subject is processed inside an internal processing chamber; a transfer chamber arranged at the forward side, where said wafer is transferred at the inside thereof under atmospheric pressure; a cassette stage arranged at the forward of this transfer chamber, where a cassette storing said wafer is mounted; a lock chamber connected with said transfer chamber at the backward of said transfer chamber; a robot arranged inside said transfer chamber, where said wafer is transferred between said cassette and said lock chamber; and an aligning machine for making position of said wafer fit with the predetermined position, wherein the wafer is transferred to said lock chamber, after performing alignment of said wafer on said aligning machine, in the case where displacement amount of position of this wafer is larger than the predetermined value.

    摘要翻译: 真空室包括:设置在后方的真空容器,处理对象的晶片在内部处理室内处理; 传送室,其布置在前侧,其中所述晶片在其大气压下在其内部传送; 设置在该传送室前方的盒级,其中安装有存储所述晶片的盒; 在所述传送室的后方与所述传送室连接的锁定室; 布置在所述传送室内部的机器,其中所述晶片在所述盒和所述锁定室之间传送; 以及用于使所述晶片的位置与所述预定位置配合的对准机,其中在所述晶片位于所述对准机器的位置的位移量较大的情况下,在将所述晶片对准所述对准机器之后,将所述晶片转移到所述锁定室 超过预定值。

    Plasma processing apparatus
    6.
    发明申请
    Plasma processing apparatus 审中-公开
    等离子体处理装置

    公开(公告)号:US20100186672A1

    公开(公告)日:2010-07-29

    申请号:US12379643

    申请日:2009-02-26

    IPC分类号: C23C16/00

    摘要: A plasma processing apparatus composed of a processing chamber in a vacuum vessel to which a gas is fed to form a plasma, a sample stage in which a channel for a heat exchange medium is formed, beams for supporting the sample stage in the horizontal direction, a cylindrical space at atmospheric pressure formed below the channel in the sample stage, coupling paths for communicating the inner wall of the cylindrical space with the exterior of the vacuum vessel, a piping conduit for medium formed in the coupling path, a drive mechanism to drive pins for a wafer, and metal blocks covering junctions between the piping conduits for medium and the sample stage, whereby a gas at high temperature is supplied to between the metal blocks and is exhausted through the coupling path.

    摘要翻译: 一种等离子体处理装置,由真空容器内的供给气体而形成等离子体的处理室,形成有热交换介质用通道的样品台,水平方向支撑样品台的光束, 大气压下形成的圆柱形空间,形成在样品台的通道下方,用于将圆柱形空间的内壁与真空容器的外部连通的连接路径,形成在联接路径中的介质的管道导管,驱动机构 用于晶片的引脚和覆盖用于介质和样品台的管道导管之间的接合处的金属块,由此将高温气体供应到金属块之间并通过耦合路径排出。

    Plasma processing apparatus capable of adjusting pressure within processing chamber
    7.
    发明申请
    Plasma processing apparatus capable of adjusting pressure within processing chamber 审中-公开
    能够调节处理室内的压力的等离子体处理装置

    公开(公告)号:US20080066859A1

    公开(公告)日:2008-03-20

    申请号:US11512124

    申请日:2006-08-30

    IPC分类号: H01L21/306

    CPC分类号: H01J37/3244 H01J37/32834

    摘要: A vacuum pump exhausts gas within the processing chamber from a lower portion of a sample so as to reduce pressure within a processing chamber. The vacuum pump includes a rotary vane and a fixed vane which are arranged within a case of the vacuum pump and have a plurality of impeller blades in a coaxial manner; an exhausting port for exhausting the gas exhausted from the rotary vane outside the case; and a conducting port arranged along a lower direction of the rotary vane, into which inert gas is conducted, which are provided on a circumference thereof. An MFC (flow rate adjusting device) is arranged between a gas storage unit of the inert gas and the conducting port, for adjusting an amount of the inert gas.

    摘要翻译: 真空泵从样品的下部排出处理室内的气体,以减少处理室内的压力。 所述真空泵包括旋转叶片和固定叶片,所述旋转叶片和固定叶片布置在所述真空泵的壳体内并具有同轴的多个叶轮叶片; 用于将从旋转叶片排出的气体排出外壳的排气口; 以及沿其旋转叶片的下方向布置的导电口,惰性气体被引导入其周围。 在惰性气体的气体存储单元和导电口之间设置MFC(流量调节装置),用于调节惰性气体的量。

    Vacuum processing apparatus
    8.
    发明申请
    Vacuum processing apparatus 审中-公开
    真空加工设备

    公开(公告)号:US20100163185A1

    公开(公告)日:2010-07-01

    申请号:US12379642

    申请日:2009-02-26

    IPC分类号: H01L21/3065

    CPC分类号: H01L21/67196

    摘要: A vacuum processing apparatus which includes a vacuum vessel having a processing chamber provided therein into which a processing gas is supplied to form a plasma and which processes a wafer located in the processing chamber, and a vacuum transfer vessel having a vacuumed transfer chamber coupled with the vacuum vessel provided therein into which the wafer is transferred. A resin-made film having a plasma resistance is bonded onto a surface of a lid of the vacuum transfer vessel on the side of the transfer chamber.

    摘要翻译: 一种真空处理装置,其特征在于,具备:设置有处理室的真空容器,在所述真空容器内设置处理气体,形成等离子体,处理位于所述处理室内的晶片;以及真空转移容器, 其中设置有晶片被转移到其中的真空容器。 将具有耐等离子体电阻的树脂膜粘合到转印室一侧的真空转印容器的盖的表面上。

    VACUUM CHAMBER
    9.
    发明申请
    VACUUM CHAMBER 失效
    真空室

    公开(公告)号:US20110137454A1

    公开(公告)日:2011-06-09

    申请号:US12712861

    申请日:2010-02-25

    IPC分类号: H01L21/677 H01L21/68

    CPC分类号: H01L21/67766 H01L21/67778

    摘要: A vacuum chamber includes: a vacuum vessel arranged at the backward side, where a wafer of a processing subject is processed inside an internal processing chamber; a transfer chamber arranged at the forward side, where said wafer is transferred at the inside thereof under atmospheric pressure; a cassette stage arranged at the forward of this transfer chamber, where a cassette storing said wafer is mounted; a lock chamber connected with said transfer chamber at the backward of said transfer chamber; a robot arranged inside said transfer chamber, where said wafer is transferred between said cassette and said lock chamber; and an aligning machine for making position of said wafer fit with the predetermined position, wherein the wafer is transferred to said lock chamber, after performing alignment of said wafer on said aligning machine, in the case where displacement amount of position of this wafer is larger than the predetermined value.

    摘要翻译: 真空室包括:设置在后方的真空容器,处理对象的晶片在内部处理室内处理; 传送室,其布置在前侧,其中所述晶片在其大气压下在其内部传送; 设置在该传送室前方的盒级,其中安装有存储所述晶片的盒; 在所述传送室的后方与所述传送室连接的锁定室; 布置在所述传送室内部的机器,其中所述晶片在所述盒和所述锁定室之间传送; 以及用于使所述晶片的位置与所述预定位置相配合的对准机,其中在所述晶片位于所述对准机器的位置量较大的情况下,在将所述晶片对准所述对准机之后,将所述晶片转移到所述锁定室 超过预定值。