公开(公告)号：US5173841A

公开(公告)日：1992-12-22

申请号：US674167

申请日：1991-03-25

申请人： Takeshi Uenaka ,  Jun Ohbuchi ,  Hajime Maeda ,  Toru Tachikawa ,  Shigeo Onoda

发明人： Takeshi Uenaka ,  Jun Ohbuchi ,  Hajime Maeda ,  Toru Tachikawa ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  B42D15/00 ,  G06K19/077 ,  H05K5/02 ,  H05K7/14

CPC分类号： H05K7/1417 ,  H05K5/0256 ,  Y10S439/946

摘要： A semiconductor device card and a method of manufacturing the card. A frame includes an integral spacer which fills a dead space on a circuit board to eliminate the need for positioning a separate spacer in the dead space on the circuit board and fixing the spacer in place with a bonding sheet or the like. In a semiconductor device card in which a spacer for filling a dead space on the circuit board is bonded to a corresponding panel, a recess is formed on the surface of the spacer bonded to the obverse or reverse panel to reduce undulations occurring in the panel surface.

摘要翻译： 半导体器件卡和制造该卡的方法。 框架包括一个整体间隔件，其填充电路板上的死空间，以消除将电路板上的死空间中的单独间隔件定位并且用隔离片等固定隔离件的需要。 在将用于填充电路板上的死空间的间隔物接合到相应面板的半导体器件卡中，在与正面或反面板接合的间隔物的表面上形成凹部，以减少在面板表面中发生的起伏 。

公开(公告)号：US5661636A

公开(公告)日：1997-08-26

申请号：US542165

申请日：1995-10-12

申请人： Shigeo Onoda ,  Jun Ohbuchi ,  Makoto Omori ,  Takeshi Uenaka ,  Tomomi Morii

发明人： Shigeo Onoda ,  Jun Ohbuchi ,  Makoto Omori ,  Takeshi Uenaka ,  Tomomi Morii

IPC分类号： G06K19/077 ,  G11B33/12 ,  G11B33/14 ,  G06F1/16 ,  H05K7/10

CPC分类号： G11B33/121 ,  G11B33/1493

摘要： An IC card with an on-board hard disk unit comprising a frame; a circuit board inside the frame; and a hard disk unit mounted on the circuit board. The IC card also has a metal front panel supported by the frame, and covering the entire IC card, including the hard disk unit. Thus, the outer surface of the IC card is made stronger, and the hard disk is protected from static electricity. The metal front panel includes a first portion where the IC card is relatively thin and a second, bulging portion where the IC card is relatively thick. The bulging portion accommodates the hard disk unit. The front panel may include a vent or mesh.

摘要翻译： 一种具有板载硬盘单元的IC卡，包括框架; 框架内的电路板; 以及安装在电路板上的硬盘单元。 IC卡还具有由框架支撑的金属前面板，并且覆盖包括硬盘单元的整个IC卡。 因此，IC卡的外表面变得更强，并且保护硬盘免受静电。 金属前面板包括IC卡相对较薄的第一部分和IC卡相对较厚的第二凸起部分。 凸出部容纳硬盘单元。 前面板可以包括排气孔或网孔。

公开(公告)号：US5313364A

公开(公告)日：1994-05-17

申请号：US985152

申请日：1992-12-03

申请人： Makoto Omori ,  Jun Ohbuchi ,  Hajime Maeda ,  Hiroshi Miura ,  Tomomi Hamada ,  Takeshi Uenaka

发明人： Makoto Omori ,  Jun Ohbuchi ,  Hajime Maeda ,  Hiroshi Miura ,  Tomomi Hamada ,  Takeshi Uenaka

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01R13/73 ,  H05K7/14 ,  H05K1/14

CPC分类号： G06K19/07743 ,  H05K7/1461 ,  Y10S439/946

摘要： An IC card arranged so that a connector cannot come off a frame during an assembly process in which the connector and a circuit board are accommodated in the frame and panels are thereafter attached to obverse and reverse surfaces of the frame. Projections on sides of the connector and resilient engaging/fixing hooks with oblique surfaces on the frame are engaged. As the connector is forced into the frame, the projections of the connector are brought into engagement with and temporarily deflect the engaging/fixing hooks of the frame. The connector is thereby fixed firmly on the frame.

摘要翻译： 一种IC卡，其布置成使得在组装过程中连接器不能脱离框架，其中连接器和电路板容纳在框架中，并且面板然后附接到框架的正面和反面。 连接器的侧面上的突起和在框架上具有倾斜表面的弹性接合/固定钩接合。 当连接器被迫进入框架时，连接器的突起与框架的接合/固定钩接合并暂时偏转。 因此，连接器牢固地固定在框架上。

公开(公告)号：US5327010A

公开(公告)日：1994-07-05

申请号：US553459

申请日：1990-07-17

申请人： Takeshi Uenaka ,  Jun Ohbuchi ,  Shigeo Onoda ,  Makoto Omori ,  Hajime Maeda ,  Toru Tachikawa

发明人： Takeshi Uenaka ,  Jun Ohbuchi ,  Shigeo Onoda ,  Makoto Omori ,  Hajime Maeda ,  Toru Tachikawa

IPC分类号： G06K19/077 ,  H01L23/538 ,  H01L25/10 ,  H05K3/28 ,  H01L23/02 ,  G06K19/00 ,  H01L23/12

CPC分类号： H05K3/284 ,  G06K19/07745 ,  H01L23/5388 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/1627 ,  H01L2924/3511

摘要： An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.

摘要翻译： IC卡包括基板，安装在基板的至少一个主表面上的半导体器件和安装有安装有半导体器件的基板的壳体。 壳体包括框架和通过粘合剂层在框架的相对侧上结合到框架的面板。 防止半导体器件在面向半导体器件的粘合剂层上的位置处经由粘合剂层粘合到面板上。

公开(公告)号：US5038250A

公开(公告)日：1991-08-06

申请号：US563346

申请日：1990-08-07

申请人： Takeshi Uenaka ,  Jun Ohbuchi

发明人： Takeshi Uenaka ,  Jun Ohbuchi

IPC分类号： B42D15/10 ,  G06K19/077

CPC分类号： G06K19/077 ,  Y10S439/946

摘要： An IC card of the present invention comprises a panel having resilient projections and a frame having recesses corresponding to the resilient projections, and the panel is mounted on the frame by engaging the respective resilient projections with the respective recesses. Thus, the panel can be securely attached to the panel.

公开(公告)号：US5299940A

公开(公告)日：1994-04-05

申请号：US913042

申请日：1992-07-14

申请人： Takeshi Uenaka ,  Hajime Maeda ,  Yasumori Ikeda ,  Toru Tachikawa ,  Shigeo Onoda

发明人： Takeshi Uenaka ,  Hajime Maeda ,  Yasumori Ikeda ,  Toru Tachikawa ,  Shigeo Onoda

IPC分类号： G06K19/077 ,  H05K5/02 ,  H01R7/10

CPC分类号： H05K5/0269 ,  G06K19/077

摘要： An IC card is disclosed which would not be deformed, and hence, which maintains its quality reliability. A frame is provided to house a substrate which mounts ICs. Panels for protecting the ICs are fixed to the frame by first adhesive material layers. A connector is disposed, in contact with the substrate, between the panels. The connector is fixed to the frame by a second adhesive material layer. This prohibits that external force which acts on the connector at insertion and detachment of the IC card into and from external equipment from acting on the first adhesive material layers. Hence, insertion and detachment of the IC card do not cause deterioration in adhesion between the panels and the frame. Thus, deformation of the ICs due to the external force is prevented, thereby the quality reliability of the IC card being better maintained.

摘要翻译： 公开了不会变形的IC卡，因此保持其质量可靠性。 提供了一个框架来容纳安装IC的基板。 用于保护IC的面板通过第一粘合材料层固定在框架上。 连接器设置在面板之间与基板接触。 连接器通过第二粘合材料层固定到框架。 这就禁止在将IC卡插入和从外部设备插入和拆卸时作用在连接器上的外力作用在第一粘合材料层上。 因此，IC卡的插入和拆卸不会导致面板和框架之间的粘附性降低。 因此，防止了由于外力引起的IC的变形，从而更好地保持了IC卡的质量可靠性。