公开(公告)号：US20100181105A1

公开(公告)日：2010-07-22

申请号：US12690223

申请日：2010-01-20

申请人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

发明人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

IPC分类号： H05K1/11

CPC分类号： H05K1/0206 ,  H01L21/481 ,  H01L23/053 ,  H01L23/15 ,  H01L23/3677 ,  H01L33/483 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/09709 ,  H05K2201/10106 ,  H01L2924/00

摘要： A package for an electron element comprises: a base substrate made of ceramic; a frame body made of ceramic arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the electron element; a via formed in the base substrate below the cavity, penetrating the base substrate from the top surface to a bottom surface thereof and filled with a thermally-conductive material; and a projecting part formed on an inner wall of the via and projecting toward a center of the via. The projecting part has a length along a direction perpendicular to a penetration direction of the via not less than a thickness along the penetration direction. An electronic component comprises the package and the electron element mounted thereon. The electron element is accommodated in the cavity defined inside the frame body of the package and arranged above the via.

摘要翻译： 一种用于电子元件的封装包括：由陶瓷制成的基底; 布置在所述基底基板的顶表面上的由陶瓷制成的框体，并在其中设置有用于容纳所述电子元件的空腔; 通孔，其形成在所述空腔下方的所述基底基板中，从所述基底基板从所述顶表面向其底表面穿透并填充有导热材料; 以及形成在所述通孔的内壁上并朝向所述通孔的中心突出的突出部。 突出部具有沿与贯通方向的贯通方向垂直的方向的长度不小于沿着贯通方向的厚度。 电子部件包括安装在其上的封装和电子元件。 电子元件容纳在限定在封装的框体内部的空腔中，并布置在通孔的上方。

公开(公告)号：US20100246135A1

公开(公告)日：2010-09-30

申请号：US12731827

申请日：2010-03-25

申请人： Masanori Hongo ,  Takuma Hitomi ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

发明人： Masanori Hongo ,  Takuma Hitomi ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L23/12 ,  H01L23/49805 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device of the present invention includes: a base made of a ceramic material; an electronic device element arranged in a central area of the upper surface of the base, in a way that the electronic device element is placed on a first heat transfer layer; a first heat dissipation layer formed in a central area of the lower surface of the base; a plurality of thermal vias arranged in the base, and which connects the first heat transfer layer and the first heat dissipation layer; and a second heat transfer layer buried in the base, the second heat transfer layer crossing the plurality of thermal vias, while extending from a position above a central area of the lower surface of the base to a position above a peripheral area of the lower surface of the base.

摘要翻译： 本发明的电子设备包括：由陶瓷材料制成的基座; 电子器件元件，其布置在所述基座的上表面的中心区域中，以使得所述电子器件元件被放置在第一传热层上; 第一散热层，形成在所述基部的下表面的中心区域; 多个热通孔，其布置在所述基座中，并且连接所述第一传热层和所述第一散热层; 以及第二传热层，所述第二传热层与所述多个热通孔交叉，同时从所述基部的下表面的中心区域上方的位置延伸到所述下表面的周边区域的上​​方 的基地。

公开(公告)号：US20100213811A1

公开(公告)日：2010-08-26

申请号：US12708868

申请日：2010-02-19

申请人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

发明人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

IPC分类号： H01J1/88 ,  C03B29/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： The package for a light emitting element according to the present invention comprises a base substrate made of ceramic including glass, and a frame body made of ceramic. The frame body is arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the light emitting element. A part of the glass included in the base substrate is precipitated in an area of the top surface of the base substrate, which is a bottom surface of the cavity, and a crystallinity degree of the precipitated glass is greater than 3%. In the manufacturing method of the package according to the present invention, a ceramic body which is to be the package is fired at a temperature of 840 degrees C. or higher and lower than 950 degrees C.

摘要翻译： 根据本发明的用于发光元件的封装包括由包括玻璃的陶瓷制成的基底基板和由陶瓷制成的框体。 框架主体布置在基底基板的顶表面上并且在其中设置有用于容纳发光元件的空腔。 包括在基底中的玻璃的一部分在作为空腔底面的基底基板的上表面的区域中析出，析出玻璃的结晶度大于3％。 在根据本发明的包装的制造方法中，作为包装的陶瓷体在840℃以上且低于950℃的温度下烧成。

公开(公告)号：US20100182791A1

公开(公告)日：2010-07-22

申请号：US12688227

申请日：2010-01-15

申请人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

发明人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

IPC分类号： F21V7/00 ,  F21V19/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/48227

摘要： In a package for a light emitting element according to the present invention, a light reflecting plate is buried in a base substrate at a position below a cavity with a light reflecting surface thereof facing upward, a part of the ceramic forming the base substrate is interposed between the light reflecting surface of the light reflecting plate and a top surface of the base substrate, and at least the part is light-transmitting. A light emitting device comprises the package, and the light emitting element accommodated in the cavity of the package. In another light emitting device, a first reflector which is made of a metal material and reflects a light emitted from the light emitting element is buried in a frame body.

摘要翻译： 在根据本发明的发光元件的封装中，将光反射板埋在基板的位于空腔下方的位置，其光反射面朝上，形成基板的陶瓷的一部分插入 在所述光反射板的光反射表面和所述基底基板的顶表面之间，并且至少所述部分是透光的。 发光器件包括封装，并且发光元件容纳在封装的空腔中。 在另一发光器件中，由金属材料制成并将从发光元件发出的光反射的第一反射器被埋入框架体中。

公开(公告)号：US07378728B2

公开(公告)日：2008-05-27

申请号：US11389330

申请日：2006-03-27

申请人： Hideki Ito ,  Masanori Hongo ,  Masami Fukuyama ,  Hiroyuki Taguchi ,  Hideki Takagi

发明人： Hideki Ito ,  Masanori Hongo ,  Masami Fukuyama ,  Hiroyuki Taguchi ,  Hideki Takagi

IPC分类号： H01L23/48

CPC分类号： H05K3/3442 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49805 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.

摘要翻译： 本发明的封装具有多个陶瓷层的叠层结构，并且包括用于容纳发光元件的空腔。 安装表面限定在与空腔的深度方向平行的侧表面上。 在安装面和与安装面垂直的两个侧面的交点形成的两个角处，在层叠方向的整个长度上形成有一对包含带电电极部分和涂覆电极部分的外部电极。 当安装封装时，将一对充电电极部分和一对涂覆的电极部分焊接到基板的表面。

公开(公告)号：US20060220233A1

公开(公告)日：2006-10-05

申请号：US11389330

申请日：2006-03-27

申请人： Hideki Ito ,  Masanori Hongo ,  Masami Fukuyama ,  Hiroyuki Taguchi ,  Hideki Takagi

发明人： Hideki Ito ,  Masanori Hongo ,  Masami Fukuyama ,  Hiroyuki Taguchi ,  Hideki Takagi

IPC分类号： H01L23/34

CPC分类号： H05K3/3442 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49805 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.

摘要翻译： 本发明的封装具有多个陶瓷层的叠层结构，并且包括用于容纳发光元件的空腔。 安装表面限定在与空腔的深度方向平行的侧表面上。 在安装面和与安装面垂直的两个侧面的交点形成的两个角处，在层叠方向的整个长度上形成有一对包含带电电极部分和涂覆电极部分的外部电极。 当安装封装时，将一对充电电极部分和一对涂覆的电极部分焊接到基板的表面。

公开(公告)号：US20050116789A1

公开(公告)日：2005-06-02

申请号：US10992642

申请日：2004-11-22

申请人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

发明人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

IPC分类号： H03H9/72 ,  H01P1/213 ,  H03H9/25

CPC分类号： H01P1/213

摘要： The present invention provides an antenna duplexer comprising a transmitting filter and a receiving filter which are mounted on a package, a transmitting signal input pad and a transmitting signal output pad which are connected to input and output ends of the transmitting filter, a receiving signal input pad and a receiving signal output pad which are connected to input and output ends of the receiving filter, and at least one grounding pad. The pads are arranged, on a surface of the package, along at least two sides of four sides of a quadrangle. The transmitting signal input pad and the receiving signal output pad are disposed at diagonal positions of the quadrangle and are furthest away from one another.

摘要翻译： 本发明提供了一种天线双工器，其包括安装在封装上的发射滤波器和接收滤波器，发射信号输入焊盘和发射信号输出焊盘，其连接到发射滤波器的输入和输出端，接收信号输入 焊盘和接收信号输出焊盘，其连接到接收滤波器的输入和输出端，以及至少一个接地焊盘。 垫片在包装的表面上沿着四边形的四边的至少两侧布置。 发射信号输入焊盘和接收信号输出焊盘设置在四边形的对角位置处并且彼此最远。

公开(公告)号：US07180387B2

公开(公告)日：2007-02-20

申请号：US10992644

申请日：2004-11-22

申请人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

发明人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

IPC分类号： H01P1/213 ,  H03H9/72

CPC分类号： H03H9/0576 ,  H03H9/72 ,  H03H9/725

摘要： The present invention provides an antenna duplexer comprising a package having a plurality of ceramic layers superposed, and a transmitting filter and a receiving filter which are mounted on a surface of the package. A phase-matching strip line is formed on a surface of one ceramic layer. The package has grounding layers formed respectively on surfaces of upper and lower ceramic layers with the phase-matching strip line interposed therebetween. A plurality of via holes are formed around the phase-matching strip line for connecting the two grounding layers to each other.

摘要翻译： 本发明提供了一种天线双工器，其包括叠置有多个陶瓷层的封装，以及安装在封装表面上的发射滤波器和接收滤波器。 在一个陶瓷层的表面上形成相位匹配带状线。 该封装具有分别形成在上部和下部陶瓷层的表面上的接地层，并且相互匹配的带状线插入其间。 在相匹配带状线周围形成多个通孔，用于将两个接地层彼此连接。

公开(公告)号：US20050116790A1

公开(公告)日：2005-06-02

申请号：US10992644

申请日：2004-11-22

申请人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

发明人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

IPC分类号： H03H9/72 ,  H03H9/25

CPC分类号： H03H9/0576 ,  H03H9/72 ,  H03H9/725

摘要： The present invention provides an antenna duplexer comprising a package having a plurality of ceramic layers superposed, and a transmitting filter and a receiving filter which are mounted on a surface of the package. A phase-matching strip line is formed on a surface of one ceramic layer. The package has grounding layers formed respectively on surfaces of upper and lower ceramic layers with the phase-matching strip line interposed therebetween. A plurality of via holes are formed around the phase-matching strip line for connecting the two grounding layers to each other.

摘要翻译： 本发明提供了一种天线双工器，其包括叠置有多个陶瓷层的封装，以及安装在封装表面上的发射滤波器和接收滤波器。 在一个陶瓷层的表面上形成相位匹配带状线。 该封装具有分别形成在上部和下部陶瓷层的表面上的接地层，并且相互匹配的带状线插入其间。 在相匹配带状线周围形成多个通孔，用于将两个接地层彼此连接。

公开(公告)号：US07369012B2

公开(公告)日：2008-05-06

申请号：US10992642

申请日：2004-11-22

申请人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

发明人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

IPC分类号： H01P5/12 ,  H03H9/00

CPC分类号： H01P1/213

摘要： The present invention provides an antenna duplexer comprising a transmitting filter and a receiving filter which are mounted on a package, a transmitting signal input pad and a transmitting signal output pad which are connected to input and output ends of the transmitting filter, a receiving signal input pad and a receiving signal output pad which are connected to input and output ends of the receiving filter, and at least one grounding pad. The pads are arranged, on a surface of the package, along at least two sides of four sides of a quadrangle. The transmitting signal input pad and the receiving signal output pad are disposed at diagonal positions of the quadrangle and are furthest away from one another.

摘要翻译： 本发明提供了一种天线双工器，其包括安装在封装上的发射滤波器和接收滤波器，发射信号输入焊盘和发射信号输出焊盘，其连接到发射滤波器的输入和输出端，接收信号输入 焊盘和接收信号输出焊盘，其连接到接收滤波器的输入和输出端，以及至少一个接地焊盘。 垫片在包装的表面上沿着四边形的四边的至少两侧布置。 发射信号输入焊盘和接收信号输出焊盘设置在四边形的对角位置处并且彼此最远。