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公开(公告)号:US06774490B2
公开(公告)日:2004-08-10
申请号:US10395231
申请日:2003-03-25
申请人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
发明人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
IPC分类号: H01L2848
CPC分类号: H01L24/32 , B23K35/262 , B23K2101/36 , H01L24/33 , H01L24/73 , H01L24/81 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/131 , H01L2224/13144 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/16152 , H01L2924/181 , H01L2924/20106 , H05K3/3463 , Y10T428/12528 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199
摘要: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.
摘要翻译: 电子设备能够改善电子设备中的抗冲击性或抗冲击性,并且提高半导体器件芯片接合Si芯片等中引起大变形的热冲击作用的焊点的可靠性,凸块安装 的BGA,CSP,WPP,倒装芯片等,功率模块作用大的应力等等。 电子设备具有电路板和电连接到电路板的电极的电子部件。 电路板的电极和电子部件的电极通过使用由Cu:0-2.0质量%,In:0.1-10质量%和Sn:剩余量组成的无铅焊料进行焊接而连接。
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公开(公告)号:US06555052B2
公开(公告)日:2003-04-29
申请号:US09799486
申请日:2001-03-07
申请人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
发明人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
IPC分类号: C22C1302
CPC分类号: H01L24/32 , B23K35/262 , B23K2101/36 , H01L24/33 , H01L24/73 , H01L24/81 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/131 , H01L2224/13144 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/16152 , H01L2924/181 , H01L2924/20106 , H05K3/3463 , Y10T428/12528 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199
摘要: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.
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