Method for heating part in processing chamber of semiconductor manufacturing apparatus and semiconductor manufacturing apparatus
    1.
    发明授权
    Method for heating part in processing chamber of semiconductor manufacturing apparatus and semiconductor manufacturing apparatus 有权
    半导体制造装置和半导体制造装置的处理室中的加热部件的方法

    公开(公告)号:US08824875B2

    公开(公告)日:2014-09-02

    申请号:US13034858

    申请日:2011-02-25

    IPC分类号: A21B2/00 F26B19/00

    摘要: There is provided a method for heating a part within a processing chamber of a semiconductor manufacturing apparatus having a substrate in the processing chamber and performing a process on the substrate. The heating method includes generating heating lights which is generated by a heating light source provided outside the processing chamber and has a wavelength band capable of passing through a first part in the processing chamber and being absorbed into a second part in the processing chamber made of a material different from that of the first part, and heating the second part in the processing chamber by passing the heating lights through the first part in the processing chamber and irradiating the heating lights to the second part in the processing chamber.

    摘要翻译: 提供了一种用于加热在处理室中具有基板的半导体制造装置的处理室内的部件并在基板上进行处理的方法。 该加热方法包括产生由设置在处理室外部的加热光源产生的加热灯,并且具有能够通过处理室中的第一部分并被吸收到处理室中的第二部分中的波长带 与第一部分不同的材料,并且通过使加热灯通过处理室中的第一部分并且将加热灯照射到处理室中的第二部分来加热处理室中的第二部分。

    Temperature measuring apparatus and temperature measuring method
    2.
    发明授权
    Temperature measuring apparatus and temperature measuring method 有权
    温度测量仪和温度测量方法

    公开(公告)号:US08777483B2

    公开(公告)日:2014-07-15

    申请号:US13231027

    申请日:2011-09-13

    IPC分类号: G01K1/00 G01J5/00

    CPC分类号: G01K11/12

    摘要: The temperature measuring apparatus includes: a light source; a first wavelength-dividing unit which wavelength-divides a light from the light source into m lights whose wavelength bands are different from one another; m first dividing units which divides each of the m lights from the first wavelength-dividing unit into n lights; a transmitting unit which transmits lights from the m first dividing unit to measurement points of an object to be measured; a light receiving unit which receives a light reflected by each of the measurement points; and a temperature calculating unit which calculates a temperature of each of the measurement points based on a waveform of the light received by the light receiving unit.

    摘要翻译: 温度测量装置包括:光源; 将来自光源的光波长分割成波长彼此不同的m个光的第一波长分割单元; m个第一分割单元,其将每个m个光从第一波长分割单元分成n个灯; 发射单元,其将来自第m分割单元的光传输到被测量物体的测量点; 光接收单元,其接收由每个测量点反射的光; 以及温度计算单元,其基于由光接收单元接收的光的波形来计算每个测量点的温度。

    Temperature measuring apparatus and temperature measuring method
    3.
    发明授权
    Temperature measuring apparatus and temperature measuring method 有权
    温度测量仪和温度测量方法

    公开(公告)号:US08764288B2

    公开(公告)日:2014-07-01

    申请号:US13476264

    申请日:2012-05-21

    IPC分类号: G01J5/00 G01B9/02

    CPC分类号: G01J5/02 G01K1/026 G01K11/125

    摘要: A temperature measuring apparatus includes a light source, a first splitter, a second splitter, a reference beam reflector, an optical path length adjuster, a reference beam transmitting member, a first to an nth measuring beam transmitting member and a photodetector. The temperature measuring apparatus further includes an attenuator that attenuates the reference beam reflected from the reference beam reflector to thereby make an intensity thereof closer to an intensity of the measurement beam reflected from the temperature measurement object.

    摘要翻译: 温度测量装置包括光源,第一分离器,第二分离器,参考光束反射器,光程长度调节器,参考光束传输部件,第一至第N测量光束传输部件和光电检测器。 温度测量装置还包括衰减器,衰减从参考光束反射器反射的参考光束,从而使其强度更接近于从温度测量对象反射的测量光束的强度。

    Temperature measuring apparatus and temperature measuring method
    4.
    发明授权
    Temperature measuring apparatus and temperature measuring method 有权
    温度测量仪和温度测量方法

    公开(公告)号:US07952717B2

    公开(公告)日:2011-05-31

    申请号:US12043406

    申请日:2008-03-06

    IPC分类号: G01B9/02

    CPC分类号: G01K11/125

    摘要: A temperature measuring apparatus includes a light source, a first splitter, a second splitter, a reference beam reflector, an optical path length adjuster, a reference beam transmitting member, a first to an nth measuring beam transmitting member and a photodetector. The temperature measuring apparatus further includes a controller that stores, as initial peak position data, positions of interference peaks respectively measured in advance by irradiating the first to the nth measuring beam onto the first to the nth measurement point of the temperature measurement object, and compares the initial peak position data to positions of interference peaks respectively measured during a temperature measurement to thereby estimate a temperature at each of the first to the nth measurement point.

    摘要翻译: 温度测量装置包括光源,第一分离器,第二分离器,参考光束反射器,光程长度调节器,参考光束传输部件,第一至第N测量光束传输部件和光电检测器。 温度测量装置还包括控制器,该控制器通过将第一至第N测量光束照射到温度测量对象的第一至第N测量点上,预先分别测量的干扰峰的位置作为初始峰值位置数据,并将其进行比较 初始峰值位置数据分别在温度测量期间测量的干涉峰位置,从而估计第一至第n测量点中的每一个处的温度。

    PLASMA PROCESSING APPARATUS AND TEMPERATURE MEASURING METHOD AND APPARATUS USED THEREIN
    5.
    发明申请
    PLASMA PROCESSING APPARATUS AND TEMPERATURE MEASURING METHOD AND APPARATUS USED THEREIN 有权
    等离子体加工装置和温度测量方法及其使用的装置

    公开(公告)号:US20100206482A1

    公开(公告)日:2010-08-19

    申请号:US12698616

    申请日:2010-02-02

    摘要: A plasma processing apparatus includes a temperature measuring unit; airtightly sealed temperature measuring windows provided in a mounting table, for optically communicating to transmit a measurement beam through a top surface and a bottom surface of the mounting table; and one or more connection members for connecting the mounting table and a base plate, which is provided in a space between the mounting table and the base plate. In the plasma processing apparatus, a space above the mounting table is set to be maintained under a vacuum atmosphere, and a space between the mounting table and the base plate is set to be maintained under a normal pressure atmosphere, and each collimator is fixed to the base plate at a position corresponding to each temperature measuring window, thereby measuring a temperature of the substrate via the temperature measuring windows by the temperature measuring unit.

    摘要翻译: 一种等离子体处理装置,包括:温度测量单元; 设置在安装台上的气密密封温度测量窗,用于光学连通以将测量光束穿过安装台的顶表面和底表面传播; 以及用于连接安装台和设置在安装台和基板之间的空间中的基板的一个或多个连接构件。 在等离子体处理装置中,将安装台上方的空间设定为保持在真空气氛下,将安装台和基板之间的间隔设定为保持在常压气氛下,将每个准直器固定在 基板在与各温度测量窗对应的位置处,由温度测量单元通过温度测量窗测量基板的温度。

    Temperature control system including sub-chiller
    8.
    发明授权
    Temperature control system including sub-chiller 有权
    温控系统包括冷水机组

    公开(公告)号:US09019505B2

    公开(公告)日:2015-04-28

    申请号:US13240274

    申请日:2011-09-22

    摘要: The temperature control system includes: a susceptor which allows an object to be processed to be held on a top surface thereof and includes a flow path, through which a temperature adjusting medium flows, formed therein; a temperature measuring unit which measures a temperature of the object to be processed held on the top surface of the susceptor; a first temperature adjusting unit which adjusts a temperature of the temperature adjusting medium flowing through the flow path; and a second temperature adjusting unit which is disposed between the susceptor and the first temperature adjusting unit, and adjusts a temperature of the temperature adjusting medium based on a result of the measurement of the temperature measuring unit.

    摘要翻译: 温度控制系统包括:一个允许被处理物体被保持在其顶面上的基座,并且包括在其中形成温度调节介质流过的流路; 温度测量单元,其测量保持在所述基座的顶表面上的被处理物体的温度; 第一温度调节单元,其调节流过所述流路的温度调节介质的温度; 以及第二温度调节单元,其设置在所述基座和所述第一温度调节单元之间,并且基于所述温度测量单元的测量结果来调节所述温度调节介质的温度。

    Temperature measurement apparatus and method
    9.
    发明授权
    Temperature measurement apparatus and method 有权
    温度测量装置及方法

    公开(公告)号:US08585284B2

    公开(公告)日:2013-11-19

    申请号:US13428870

    申请日:2012-03-23

    IPC分类号: G01J5/00 G01B9/02

    CPC分类号: G01K11/00 G01K11/125

    摘要: A temperature measurement apparatus includes a light source; a first splitter that splits a light beam into a measurement beam and a reference beam; a reference beam reflector that reflects the reference beam; an optical path length adjustor; a second splitter that splits the reflected reference beam into a first reflected reference beam and a second reflected reference beam; a first photodetector that measures an interference between the first reflected reference beam and a reflected measurement beam obtained by the measurement beam reflected from a target object; a second photodetector that measures an intensity of the second reflected reference beam; and a temperature calculation unit. The temperature calculation unit calculates a location of the interference by subtracting an output signal of the second photodetector from an output signal of the first photodetector, and calculates a temperature of the target object from the calculated location of the interference.

    摘要翻译: 温度测量装置包括光源; 第一分离器,其将光束分成测量光束和参考光束; 反射参考光束的参考光束反射器; 光路长度调节器; 第二分离器,其将反射的参考光束分成第一反射参考光束和第二反射参考光束; 测量第一反射参考光束与由目标物体反射的测量光束获得的反射测量光束之间的干涉的第一光电检测器; 第二光电检测器,其测量第二反射参考光束的强度; 和温度计算单元。 温度计算单元通过从第一光电检测器的输出信号减去第二光电检测器的输出信号来计算干扰的位置,并根据所计算的干扰位置计算目标对象的温度。

    In-chamber member temperature control method, in-chamber member, substrate mounting table and plasma processing apparatus including same
    10.
    发明授权
    In-chamber member temperature control method, in-chamber member, substrate mounting table and plasma processing apparatus including same 有权
    室内部件温度控制方法,室内部件,基板安装台和包括其的等离子体处理装置

    公开(公告)号:US08425791B2

    公开(公告)日:2013-04-23

    申请号:US12498703

    申请日:2009-07-07

    IPC分类号: G01L21/30 G01R31/00

    摘要: In a method of controlling the temperature of an in-chamber member used in a plasma processing apparatus that processes a target substrate with plasma, a plurality of power-feeding portions is provided in the in-chamber member and the in-chamber member is heated by supplying electric power thereto through the power-feeding portions. A resistance value or resistivity of the in-chamber member is measured and the electric power is controlled based on the temperature of the in-chamber member estimated from the resistance value or resistivity. The in-chamber member includes one or more annular members arranged around the target substrate. The in-chamber member is a member making contact with plasma within a chamber and existing near the target substrate.

    摘要翻译: 在等离子体处理对象基板的等离子体处理装置中使用的室内部件的温度控制方法中,在室内部件中设置有多个供电部,加热室内部件 通过供电部向其供电。 测量室内构件的电阻值或电阻率,并且基于根据电阻值或电阻率估计的室内构件的温度来控制电功率。 腔内构件包括围绕靶基底布置的一个或多个环形构件。 腔内构件是与腔室内的等离子体接触并存在于靶基底附近的构件。