Semiconductor device and manufacturing method thereof
    1.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US08569839B2

    公开(公告)日:2013-10-29

    申请号:US13010417

    申请日:2011-01-20

    IPC分类号: H01L21/8238 H01L21/70

    摘要: To provide a semiconductor device that can be manufactured using a simple process without ensuring a high embedding property; and a manufacturing method of the device. In the manufacturing method of the semiconductor device according to the invention, a semiconductor substrate having a configuration obtained by stacking a support substrate, a buried insulating film, and a semiconductor layer in order of mention is prepared first. Then, an element having a conductive portion is completed over the main surface of the semiconductor layer. A trench encompassing the element in a planar view and reaching the buried insulating film from the main surface of the semiconductor layer is formed. A first insulating film (interlayer insulating film) is formed over the element and in the trench to cover the element and form an air gap in the trench, respectively. Then, a contact hole reaching the conductive portion of the element is formed in the first insulating film.

    摘要翻译: 提供可以使用简单的工艺制造而不确保高嵌入性的半导体器件; 以及该装置的制造方法。 在根据本发明的半导体器件的制造方法中,首先准备具有通过堆叠支撑衬底,埋入绝缘膜和半导体层获得的构造的半导体衬底。 然后,在半导体层的主表面上完成具有导电部分的元件。 形成了在平面图中包围元件并从半导体层的主表面到达掩埋绝缘膜的沟槽。 在元件上和沟槽中形成第一绝缘膜(层间绝缘膜)以覆盖元件并分别在沟槽中形成气隙。 然后,在第一绝缘膜中形成到达元件的导电部分的接触孔。

    SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:US20100181640A1

    公开(公告)日:2010-07-22

    申请号:US12690714

    申请日:2010-01-20

    IPC分类号: H01L29/06

    CPC分类号: H01L21/76264

    摘要: Provided is a semiconductor device about which the reliability thereof is certainly kept even when a void is generated in a buried film in its trench. A rectangular element formation region is formed in a silicon layer. A trench having a predetermined width is formed to surround the element formation region. A first TEOS film and a second TEOS film are buried in the trench. A protecting film is formed at an L-shaped intersection region of the trench.

    摘要翻译: 提供一种半导体器件,即使在其沟槽中的掩埋膜中产生空隙时,其可靠性肯定保持不变。 在硅层中形成矩形元件形成区域。 形成具有预定宽度的沟槽以包围元件形成区域。 第一TEOS膜和第二TEOS膜被埋在沟槽中。 保护膜形成在沟槽的L形交叉区域。

    Semiconductor memory device and driving method thereof
    4.
    发明授权
    Semiconductor memory device and driving method thereof 有权
    半导体存储器件及其驱动方法

    公开(公告)号:US07136301B2

    公开(公告)日:2006-11-14

    申请号:US10956124

    申请日:2004-10-04

    申请人: Shigeo Tokumitsu

    发明人: Shigeo Tokumitsu

    IPC分类号: G11C5/06 G11C11/40 H01L29/792

    摘要: First active regions and second active regions intersecting the first active regions at a right angle are defined on the surface of a semiconductor substrate, and diffusion regions are formed in the first and second active regions to interpose an intersecting region therebetween. Then, a gate structure is formed linearly to extend over the intersecting region at a non-zero angle with respect to the first and second active regions. Further, terminals to be connected to metal interconnects are provided on the diffusion regions at a non-zero angle with respect to the first and second active regions, respectively. Consequently provided is a nonvolatile semiconductor memory having a simple gate structure capable of storing 4-bits of information in one memory cell.

    摘要翻译: 在半导体衬底的表面上限定与第一有源区域成直角相交的第一有源区和第二有源区,并且在第一和第二有源区中形成扩散区以在其间插入相交区域。 然后,栅极结构线性形成,以相对于第一和第二有源区域以非零角度在交叉区域上延伸。 此外,要连接到金属互连的端子分别相对于第一和第二有源区域以非零角度设置在扩散区域上。 因此,提供了一种具有能够在一个存储单元中存储4位信息的简单门结构的非易失性半导体存储器。

    Semiconductor memory device and driving method thereof
    5.
    发明申请
    Semiconductor memory device and driving method thereof 有权
    半导体存储器件及其驱动方法

    公开(公告)号:US20050073002A1

    公开(公告)日:2005-04-07

    申请号:US10956124

    申请日:2004-10-04

    申请人: Shigeo Tokumitsu

    发明人: Shigeo Tokumitsu

    摘要: First active regions and second active regions intersecting the first active regions at a right angle are defined on the surface of a semiconductor substrate, and diffusion regions are formed in the first and second active regions to interpose an intersecting region therebetween. Then, a gate structure is formed linearly to extend over the intersecting region. Further, terminals to be connected to metal interconnects are provided on the diffusion regions, respectively. Consequently provided is a nonvolatile semiconductor memory having a simple gate structure capable of storing 4-bits of information in one memory cell.

    摘要翻译: 在半导体衬底的表面上限定与第一有源区域成直角相交的第一有源区和第二有源区,并且在第一和第二有源区中形成扩散区以在其间插入相交区域。 然后,栅极结构线性地形成以在交叉区域上延伸。 此外,分别在扩散区域上设置要连接到金属互连的端子。 因此,提供了一种具有能够在一个存储单元中存储4位信息的简单门结构的非易失性半导体存储器。