公开(公告)号：US07323712B2

公开(公告)日：2008-01-29

申请号：US11205174

申请日：2005-08-17

申请人： Terukazu Kokubo ,  Koji Seno ,  Masaya Naoi ,  Kazuo Inoue

发明人： Terukazu Kokubo ,  Koji Seno ,  Masaya Naoi ,  Kazuo Inoue

IPC分类号： H01L23/58

CPC分类号： H01R13/2414 ,  H01R43/007

摘要： An anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, contains a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout.

摘要翻译： 即使当晶片具有大面积时，即使在晶片面积大的情况下也可以容易地进行定位，保持和固定在被检查晶片上的各向异性导电连接器，该框架板具有多个各向异性导电膜分配孔， 要检查晶片的电极的区域，以及布置在各向异性导电膜分配孔中并由其周围的内周边缘支撑的多个弹性各向异性导电膜。

公开(公告)号：US20060033100A1

公开(公告)日：2006-02-16

申请号：US11205174

申请日：2005-08-17

申请人： Terukazu Kokubo ,  Koji Seno ,  Masaya Naoi ,  Kazuo Inoue

发明人： Terukazu Kokubo ,  Koji Seno ,  Masaya Naoi ,  Kazuo Inoue

IPC分类号： H01L23/58 ,  H01L21/66

CPC分类号： H01R13/2414 ,  H01R43/007

摘要： An anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, contains a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout.

摘要翻译： 即使当晶片具有大面积时，即使在晶片面积大的情况下，也可以容易地进行定位，保持和固定到被检查晶片的各向异性导电连接器，该框架板具有多个各向异性导电膜分配孔， 要检查晶片的电极的区域，以及布置在各向异性导电膜分配孔中并由其周围的内周边缘支撑的多个弹性各向异性导电膜。

公开(公告)号：US06969622B1

公开(公告)日：2005-11-29

申请号：US10470746

申请日：2002-02-06

申请人： Terukazu Kokubo ,  Koji Seno ,  Masaya Naoi ,  Kazuo Inoue

发明人： Terukazu Kokubo ,  Koji Seno ,  Masaya Naoi ,  Kazuo Inoue

IPC分类号： H01R11/01 ,  G01R1/06 ,  G01R1/073 ,  G01R31/26 ,  H01L21/66 ,  H01R13/24 ,  H01R43/00

CPC分类号： H01R13/2414 ,  H01R43/007

摘要： An anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, contains a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout.

摘要翻译： 即使当晶片具有大面积时，即使在晶片面积大的情况下，也可以容易地进行定位，保持和固定到被检查晶片的各向异性导电连接器，该框架板具有多个各向异性导电膜分配孔， 要检查晶片的电极的区域，以及布置在各向异性导电膜分配孔中并由其周围的内周边缘支撑的多个弹性各向异性导电膜。

公开(公告)号：US20050272282A1

公开(公告)日：2005-12-08

申请号：US10522536

申请日：2003-08-07

申请人： Ryoji Setaka ,  Terukazu Kokubo ,  Koji Seno ,  Takeo Hara

发明人： Ryoji Setaka ,  Terukazu Kokubo ,  Koji Seno ,  Takeo Hara

IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L23/498 ,  H01R13/24 ,  H01R4/58

CPC分类号： G01R1/07314 ,  G01R1/06755 ,  G01R31/2889 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2924/0002 ,  H01R12/714 ,  H01R13/2414 ,  H01L2924/00

摘要： Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least 50 nm: t=[1/(Sw·ρ)]×[N/(1−N)], wherein Sw is a BET specific surface area (m2/kg) of the core particles, ρ is a specific gravity (kg/m3) of the high-conductive metal, and N is (mass of the high-conductive metal/total mass of the conductive particles).

摘要翻译： 这里公开的是各向异性导电连接器，即使当晶片具有8英寸或更大的直径的大面积，并且待检查的电极的间距小时，可以容易地进行对晶片的定位和保持和固定， 并且即使在重复使用时也保持良好的导电性及其应用。 各向异性导电连接器具有框架板，其中已经相应于在晶片上的集成电路的全部或一部分中的电极区域形成了多个各向异性导电膜分配孔，以及多个各向异性导电膜分配孔， 各向异性导电膜排列孔。 弹性各向异性导电膜各自具有多个导电部件，用于在其厚度方向上延伸并且包含导电颗粒的连接用导电部件和绝缘部件彼此绝缘。 导电粒子是通过用高导电性金属涂布呈现磁性的芯粒而得到的，导电性金属与芯粒的比例为15质量％以下，t为50nm以上：t = [1 /（Sw.rho）] x [N /（1-N）]，其中Sw是核心颗粒的BET比表面积（m 2 SUP / kg / kg），rho是特定 高导电性金属的重量（kg / m 3），N（导电性金属的质量/导电性粒子的总质量）。

公开(公告)号：US20060177971A1

公开(公告)日：2006-08-10

申请号：US11395148

申请日：2006-04-03

申请人： Terukazu Kokubo ,  Koji Seno

发明人： Terukazu Kokubo ,  Koji Seno

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/52 ,  H01R13/2414 ,  H01R43/007 ,  H01L2924/00

摘要： Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a circuit device can be conducted with ease even when the pitch of electrodes of the circuit device to be connected is small, and moreover good conductivity can be achieved as to all conductive parts, and insulating property between adjacent conductive parts can be surely achieved, a production process thereof, and applied products thereof. The anisotropically conductive connector is obtained by forming a molding material layer for the elastic anisotropically conductive film with conductive particles exhibiting magnetism dispersed in a liquid polymeric substance-forming material, which will become an elastic polymeric substance by a curing treatment, within the through-hole in the frame plate and at the inner peripheral edge portion about the through-hole of the frame plate, applying a magnetic field having higher intensity at a portion to become the conductive part for connection and a portion to become the part to be supported in the molding material layer, than any other portion, to the molding material layer, thereby gathering the conductive particles at the portion to become the conductive part for connection in a state that the conductive particles present in the portion to become the part to be supported have been retained in this portion, and orienting them in the thickness-wise direction, and subjecting the molding material layer to a curing treatment.

摘要翻译： 这里公开了各向异性导电连接器，即使当要连接的电路装置的电极的间距小时，也可以容易地进行对电路装置的定位和保持和固定，并且还可以实现良好的导电性， 所有导电部件和相邻导电部件之间的绝缘性可以确定地实现，其制造方法及其应用产品。 各向异性导电连接器通过在弹性各向异性导电膜中形成成型材料层而获得，该导电颗粒具有分散在通过固化处理形成弹性聚合物质的液体聚合物质形成材料中的磁性， 在框架板和围绕框架板的通孔的内周边缘部分处，在一部分处施加具有较高强度的磁场以成为用于连接的导电部分，并且在一部分中施加要被支撑的部分 成型材料层比任何其它部分成型到成型材料层，从而将导电颗粒聚集在成为导电部分的部分处，以便在存在于要被支撑部分的部分中的导电颗粒已经被 保持在该部分中，并使其沿厚度方向取向，并对发霉进行处理 将材料层进行固化处理。

公开(公告)号：US07131851B2

公开(公告)日：2006-11-07

申请号：US10522536

申请日：2003-08-07

申请人： Ryoji Setaka ,  Terukazu Kokubo ,  Koji Seno ,  Takeo Hara

发明人： Ryoji Setaka ,  Terukazu Kokubo ,  Koji Seno ,  Takeo Hara

IPC分类号： H01R4/58

CPC分类号： G01R1/07314 ,  G01R1/06755 ,  G01R31/2889 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2924/0002 ,  H01R12/714 ,  H01R13/2414 ,  H01L2924/00

摘要： Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least 50 nm: t=[1/(Sw·ρ)]×[N/(1−N)], wherein Sw is a BET specific surface area (m2/kg) of the core particles, ρ is a specific gravity (kg/m3) of the high-conductive metal, and N is (mass of the high-conductive metal/total mass of the conductive particles).

摘要翻译： 这里公开的是各向异性导电连接器，即使当晶片具有8英寸或更大的直径的大面积，并且待检查的电极的间距小时，可以容易地进行对晶片的定位和保持和固定， 并且即使在重复使用时也保持良好的导电性及其应用。 各向异性导电连接器具有框架板，其中已经相应于在晶片上的集成电路的全部或一部分中的电极区域形成了多个各向异性导电膜分配孔，以及多个各向异性导电膜分配孔， 各向异性导电膜排列孔。 弹性各向异性导电膜各自具有多个导电部件，用于在其厚度方向上延伸并且包含导电颗粒的连接用导电部件和绝缘部件彼此绝缘。 通过用高导电性金属涂布表现出磁性的芯颗粒而获得导电性粒子，高介电性金属与核心粒子的比例为15质量％以下，t为50nm以上，t = [1 /（Sw.rho）] x [N /（1-N）]，其中Sw是核心颗粒的BET比表面积（m 2 SUP / kg / kg），rho是特定 高导电性金属的重量（kg / m 3），N（导电性金属的质量/导电性粒子的总质量）。

公开(公告)号：US20070040245A1

公开(公告)日：2007-02-22

申请号：US10579342

申请日：2004-11-15

申请人： Koji Seno ,  Yuichi Haruta

发明人： Koji Seno ,  Yuichi Haruta

IPC分类号： H01L23/495

CPC分类号： H05K3/0032 ,  H01L2924/0002 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/007 ,  H05K3/4069 ,  H05K2201/0133 ,  H05K2201/10378 ,  H05K2203/0557 ,  H01L2924/00

摘要： An anisotropically conductive sheet that can surely achieve necessary electrical connection even to an object to be connected, the arrangement pitch of electrodes to be connected of which is extremely small, a production process thereof, and applied products equipped with the anisotropically conductive sheet. The anisotropically conductive sheet according to the present invention has an insulating sheet body formed of an elastic polymeric substance, in which a plurality of through-holes for forming conductive paths, each extending in a thickness-wise direction of the insulating sheet body, have been formed, and conductive path elements integrally provided in the respective through-holes for forming conductive paths of the insulating sheet body. The through-holes for forming conductive paths are formed by using a mask for exposure, in which a plurality of through-holes for beam transmission, the diameter of each of which becomes gradually small from one surface toward the other surface of the mask, have been formed in accordance with a pattern corresponding to a pattern of conductive path elements to be formed, and irradiating the insulating sheet body with a laser beam through the through-holes for beam transmission from the other surface side of the mask for exposure.

摘要翻译： 即使对于被连接物也可以确实地实现必要的电连接，其连接的电极的排列间距极小的各向异性导电片，其制造方法，以及配备有各向异性导电片的涂布物。 根据本发明的各向异性导电片具有由弹性聚合物形成的绝缘片体，其中，多个用于形成导电路径的通孔各自沿着绝缘片体的厚度方向延伸， 形成的导电路径元件，一体地设置在用于形成绝缘片体的导电路径的各个通孔中。 用于形成导电路径的通孔是通过使用用于曝光的掩模形成的，其中多个用于光束透射的通孔，其每个的直径从掩模的一个表面到另一个表面逐渐变小，具有 根据与要形成的导电路径元件的图案对应的图案形成，并且通过激光束从用于曝光的掩模的另一表面侧通过用于光束透射的通孔照射绝缘片体。