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    DIE FOR EXTRUSION MOLDING, PLASTIC MANUFACTURING DEVICE, AND PLASTIC MANUFACTURING METHOD
    5.
    发明申请
    DIE FOR EXTRUSION MOLDING, PLASTIC MANUFACTURING DEVICE, AND PLASTIC MANUFACTURING METHOD 有权

    公开(公告)号：US20220297367A1

    公开(公告)日：2022-09-22

    申请号：US17692129

    申请日：2022-03-10

    申请人： Takashi Tanaka

    发明人： Takashi Tanaka

    IPC分类号： B29C48/31 ,  B29C48/255 ,  B29C48/25

    摘要： A die for extrusion molding includes an extrusion port configured to extrude a plastic composition, and a plastic flow channel configured to cause the supplied plastic composition to flow to the extrusion port. The plastic flow channel includes a supply flow channel, and an extrusion flow channel. The supply flow channel is configured to be supplied with the plastic composition. The extrusion flow channel has an upstream end coupled to the supply flow channel, and downstream end having the extrusion port. In the extrusion flow channel, a flow channel cross-sectional area perpendicular to the flow direction of the plastic composition in the extrusion flow channel gradually changes to the extrusion port, and an inner wall surface of a flow channel has a protruding surface protruding toward an inside of the flow channel in a cross section including an extrusion central axis and parallel to the extrusion central axis.

    Fixing device configured to restrain increases in rotational torque of a fixing member, image forming apparatus and method of manufacturing fixing device
    6.
    发明授权
    Fixing device configured to restrain increases in rotational torque of a fixing member, image forming apparatus and method of manufacturing fixing device 有权

    公开(公告)号：US10990043B2

    公开(公告)日：2021-04-27

    申请号：US16881539

    申请日：2020-05-22

    申请人： Makoto Nakamura ,  Takashi Tanaka

    发明人： Makoto Nakamura ,  Takashi Tanaka

    IPC分类号： G03G15/20

    摘要： A fixing device receives a recording material having a toner image and applies pressure and heat to fix the toner image. The fixing device includes a fixing member, a sliding member, a pressing member, and a heating member. The fixing member has a rotatable endless belt shape that includes an inner circumferential resin layer. The sliding member is pressed against the inner circumferential surface of the fixing member with a lubricant interposed between the sliding member and the inner circumferential surface. The sliding member has a resin coating layer and slides on the inner circumferential surface. The pressing member presses the recording material toward an outer circumferential surface of the fixing member. The heating member generates heat to heat the recording material. A surface hardness of the inner circumferential surface of the fixing member is smaller than a surface hardness of the sliding surface of the sliding member.

    LED unit
    9.
    发明授权
    LED unit 有权
    LED单元

    公开(公告)号：US09434151B2

    公开(公告)日：2016-09-06

    申请号：US13521783

    申请日：2010-12-30

    申请人： Takashi Tanaka

    发明人： Takashi Tanaka

    IPC分类号： B41F23/04 ,  B41J11/00 ,  H01L25/075

    CPC分类号： B41F23/0486 ,  B41F23/0453 ,  B41J11/002 ,  H01L25/0753 ,  H01L2224/48137

    摘要： An LED unit includes: a plurality of LED modules each having an LED chip for generating ultraviolet ray provided in a package which has an opening formed on one surface and a lens formed to cover the opening of the package; a substrate-shaped base block where the LED modules are mounted in a first direction; and a heat radiation member where a plurality of the base blocks is provided in a second direction perpendicular to the first direction. The heat radiation member has a plurality of inclined surfaces where each of the base blocks is disposed. Further, one inclined surface and the other inclined surface of the heat radiation member are inclined to face each other in the second direction.

    摘要翻译： LED单元包括：多个LED模块，每个LED模块具有用于产生紫外线的LED芯片，所述LED芯片设置在具有在一个表面上形成的开口的封装件和形成为覆盖封装的开口的透镜; LED模块沿第一方向安装的基板形基座; 以及散热构件，其中在与第一方向垂直的第二方向上设置有多个基块。 散热构件具有多个倾斜面，其中设置每个基座。 此外，散热构件的一个倾斜表面和另一个倾斜表面在第二方向上相互倾斜。

    PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM
    10.
    发明申请
    PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM 有权
    电镀设备，镀层方法和储存介质

    公开(公告)号：US20150232994A1

    公开(公告)日：2015-08-20

    申请号：US14129698

    申请日：2012-06-04

    申请人： Yuichiro Inatomi ,  Takashi Tanaka ,  Mitsuaki Iwashita

    发明人： Yuichiro Inatomi ,  Takashi Tanaka ,  Mitsuaki Iwashita

    IPC分类号： C23C18/16 ,  C23C18/18

    CPC分类号： C23C18/163 ,  C23C18/1619 ,  C23C18/1632 ,  C23C18/1655 ,  C23C18/1669 ,  C23C18/1675 ,  C23C18/1676 ,  C23C18/168 ,  C23C18/18 ,  C23C18/50 ,  H05K3/187 ,  H05K2203/0165 ,  H05K2203/072 ,  H05K2203/075

    摘要： A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.

    摘要翻译： 电镀装置可以均匀地对基板的整个表面进行电镀处理。 电镀装置20包括被配置为保持和旋转衬底2的衬底保持/旋转装置110; 排出装置21，被配置为将电镀液体朝向保持在基板保持旋转装置110上的基板2排出; 以及配置为控制基板保持/旋转装置110和排出装置21的控制器160.此外，排出装置21包括：第一喷嘴40，其具有沿基板2的径向配置的多个排出口41，或具有 沿基板2的径向延伸的排出口42; 以及第二喷嘴45，其具有被配置为比第一喷嘴40的排出口更靠近基板2的中心部分的排出口46。