摘要:
A heterojunction field effect transistor comprises a semi-insulating GaAs substrate, an n-InGaAs channel layer on the substrate, and a barrier layer on the n-InGaAs channel layer. The barrier layer is composed of a substantially fully depleted p-AlGaAs layer between two i-AlGaAs layers. A gate electrode is in Schottky contact with the barrier layer. Since the p-AlGaAs layer raises the barrier height in the barrier layer higher than the Schottky barrier, forward gate current is suppressed. In addition, the breakdown voltage is improved since a longer depletion region extends toward the drain side when a reverse bias is applied between the gate and the drain.
摘要:
A field effect transistor includes a semiconductor substrate having an active region, a source region, and a drain region at an upper portion of the substrate. The active region is located between the source and drain regions. A gate electrode is located on the active region. A source electrode is located on the source region and forms an ohmic contact with the source region. A drain electrode has a base part on and in ohmic contact with the drain region and an extended part having edge close to the gate electrode and over a boundary between the active region and the drain region. An insulating film is located between the boundary and the extended part and has a thickness that increases along a direction from the drain electrode toward the gate electrode in a step-by-step or continuous manner.
摘要:
A high-frequency semiconductor device includes: a first cell which includes of gate electrodes on a surface of an epitaxial layer of a substrate, drain electrodes and source electrodes alternately located relative to the gate electrodes, a source electrode connection wiring striding over the gate electrodes and the drain electrodes and connecting the source electrodes, and a drain electrode connection wiring striding over the gate electrodes and the source electrodes and connecting the drain electrodes; a second cell which has the same configurations as the first cell, is located in an extended direction of each of the gate electrodes of the first cell, and has the drain electrode connection wiring proximate to the drain electrode connection wiring of the first cell; and a gate electrode bar located between the drain electrode connection wirings of the first and second cells, and to which the gate electrodes of the first and second cells are connected.
摘要:
A field effect transistor includes a semiconductor substrate having an active region, a source region, and a drain region at an upper portion of the substrate. The active region is located between the source and drain regions. A gate electrode is located on the active region. A source electrode is located on the source region and forms an ohmic contact with the source region. A drain electrode has a base part on and in ohmic contact with the drain region and an extended part having edge closer to the gate electrode than to a boundary between the active region and the drain region. An insulating film is located between the boundary and the extended part and has a thickness that increases along a direction from the drain electrode toward the gate electrode in a step-by-step or continuous manner.
摘要:
A semiconductor device includes a first semiconductor layer and a first semiconductor element located in the first semiconductor layer. The semiconductor device also includes a second semiconductor layer of a transparent semiconductor material. The second semiconductor layer is disposed on the first semiconductor layer covering the first semiconductor element. The semiconductor device also includes a second semiconductor element located in the second semiconductor layer. The semiconductor device also includes a wire extending within the second semiconductor layer and electrically connecting the first and second semiconductor elements.
摘要:
Sample chips are tested after determining the chip layout on a semiconductor wafer so that one or plural ones of untested chips are surrounded by plural ones of the sample chips that adjoin the untested samples. A good/defective judgment on the untested chips is performed by using predicted good/defective judgment results that are statistically predicted based on results of the sample test and stored statistical data of a defect generation profile including address information that indicates defective chip locations. As a result, the good/defective judgment can be performed with high accuracy even in a case where defective chips are localized in a particular region on the wafer in a concentrated manner.
摘要:
A semiconductor device includes: a semiconductor substrate having a hexagonal crystalline structure with a c-axis and c-planes; and transistors on a c plane of the semiconductor substrate. Source electrodes of the transistors are connected to each other. Drain electrodes of the transistors are connected to each other. Gate electrodes of the transistors are connected to each other. The gate electrodes of the transistors extend along directions that form angles with each other that are 60 degrees or 120 degrees, in a plan view seen from a direction perpendicular to the c plane of the semiconductor substrate.
摘要:
A method for manufacturing a semiconductor device includes forming a source electrode and a drain electrode on a front face of a semiconductor substrate which is transparent to visible light, forming a front-side gate electrode between the source electrode and the drain electrode on the front face of the semiconductor substrate; forming an aligning mark on a region of the front face of the semiconductor substrate other than a region between the source electrode and the drain electrode, aligning the semiconductor substrate based on the aligning mark that is seen through the semiconductor substrate, and forming a back-side gate electrode on a back face of the semiconductor substrate in a location opposite the front-side gate electrode.
摘要:
There are provided an electric contact device for establishing reliable contact with ball contactors or strip contactors of a semiconductor device over contact areas of great area; a semiconductor device test socket using the electric contact device; a semiconductor module using the electric contact device; and a semiconductor device test method. A contact lead having a ring-shape or helical section is provided between a support pole and a movable pole. The movable pole is moved, to thereby bring the contact lead into an expanded state in which the diameter of the ring-shape or helical section becomes larger. A contactor is inserted into the ring-shape or helical section. The contact lead is then brought into a contacted state such that the diameter of the ring-shape or helical section becomes smaller, wherewith the contact lead is wrapped around the periphery of the contactor.
摘要:
A semiconductor device includes: a semiconductor substrate having a hexagonal crystalline structure with a c-axis and c-planes; and transistors on a c plane of the semiconductor substrate. Source electrodes of the transistors are connected to each other. Drain electrodes of the transistors are connected to each other. Gate electrodes of the transistors are connected to each other. The gate electrodes of the transistors extend along directions that form angles with each other that are 60 degrees or 120 degrees, in a plan view seen from a direction perpendicular to the c plane of the semiconductor substrate.