公开(公告)号：US08016645B2

公开(公告)日：2011-09-13

申请号：US12861519

申请日：2010-08-23

申请人： Kazuhiro Nakiri ,  Yoshio Kawakami ,  Tetsuo Suzuki

发明人： Kazuhiro Nakiri ,  Yoshio Kawakami ,  Tetsuo Suzuki

IPC分类号： B24B7/24 ,  B24B9/02

CPC分类号： G11B5/8404 ,  B24B9/065

摘要： A chamfering apparatus is used to chamfer a peripheral edge of a glass substrate. The chamfering apparatus includes a grindstone having a cylindrical hollow end portion; a grindstone driving unit that rotates the grindstone around an axis of the cylindrical hollow end portion; a substrate rotation-driving unit that rotates the glass substrate around either one of an axis of the outer periphery and an axis of the center circular hole; and a pressing unit that presses the grindstone to the glass substrate such that an annular end surface of the grindstone contacts with an edge of either one of the outer periphery and the inner periphery of the glass substrate while the cylindrical hollow end portion of the grindstone faces with one of the outer periphery and the inner periphery of the glass substrate.

摘要翻译： 使用倒角装置来倒角玻璃基板的周缘。 该倒角装置包括：具有圆筒状的中空端部的砂轮; 磨石驱动单元，其使所述磨石围绕所述圆筒状中空端部的轴线旋转; 基板旋转驱动单元，其使玻璃基板围绕外周的轴线和中心圆孔的轴线旋转; 以及按压单元，其将磨石按压到玻璃基板，使得磨石的环形端面与玻璃基板的外周和内周的任一边缘的边缘接触，而砂轮的圆柱形中空端部面朝向 玻璃基板的外周和内周之一。

公开(公告)号：US07806751B2

公开(公告)日：2010-10-05

申请号：US12337205

申请日：2008-12-17

申请人： Tetsuo Suzuki ,  Yoshio Kawakami ,  Kazuhiro Nakiri

发明人： Tetsuo Suzuki ,  Yoshio Kawakami ,  Kazuhiro Nakiri

IPC分类号： B24B1/00

CPC分类号： G11B5/8404 ,  B24B9/065

摘要： A method of manufacturing a disk substrate includes a disk substrate forming step of forming a disk substrate; and an outer chamfering step of chamfering an outer edge of the disk substrate. The outer chamfering step includes chamfering the outer edge by bringing an end surface of a cylindrical-shaped outer chamfering grindstone having a hollow portion on its end into contact with the outer edge such that the hollow portion faces the outer edge while rotating each of the outer chamfering grindstone and the disk substrate.

摘要翻译： 盘状基板的制造方法包括形成盘基板的盘基板形成工序; 以及对盘基板的外缘进行倒角的外倒角工序。 外倒角步骤包括通过使其端部具有中空部分的圆柱形外倒角磨石的端面与外边缘接触而使外边缘倒角，使得中空部分面向外边缘，同时使外部边缘 倒角磨石和盘基片。

公开(公告)号：US07798889B2

公开(公告)日：2010-09-21

申请号：US12244821

申请日：2008-10-03

申请人： Kazuhiro Nakiri ,  Yoshio Kawakami ,  Tetsuo Suzuki

发明人： Kazuhiro Nakiri ,  Yoshio Kawakami ,  Tetsuo Suzuki

IPC分类号： B24B7/24 ,  B24B9/02

CPC分类号： G11B5/8404 ,  B24B9/065

摘要： A chamfering apparatus is used to chamfer a peripheral edge of a glass substrate. The chamfering apparatus includes a grindstone having a cylindrical hollow end portion; a grindstone driving unit that rotates the grindstone around an axis of the cylindrical hollow end portion; a substrate rotation-driving unit that rotates the glass substrate around either one of an axis of the outer periphery and an axis of the center circular hole; and a pressing unit that presses the grindstone to the glass substrate such that an annular end surface of the grindstone contacts with an edge of either one of the outer periphery and the inner periphery of the glass substrate while the cylindrical hollow end portion of the grindstone faces with one of the outer periphery and the inner periphery of the glass substrate.

摘要翻译： 使用倒角装置来倒角玻璃基板的周缘。 该倒角装置包括：具有圆筒状的中空端部的砂轮; 磨石驱动单元，其使所述磨石围绕所述圆筒状中空端部的轴线旋转; 基板旋转驱动单元，其使玻璃基板围绕外周的轴线和中心圆孔的轴线旋转; 以及按压单元，其将磨石按压到玻璃基板，使得磨石的环形端面与玻璃基板的外周和内周的任一边缘的边缘接触，同时磨石的圆柱形中空端部面对 玻璃基板的外周和内周之一。

公开(公告)号：US20090104853A1

公开(公告)日：2009-04-23

申请号：US12337205

申请日：2008-12-17

申请人： Tetsuo Suzuki ,  Yoshio Kawakami ,  Kazuhiro Nakiri

发明人： Tetsuo Suzuki ,  Yoshio Kawakami ,  Kazuhiro Nakiri

IPC分类号： B24B9/08

CPC分类号： G11B5/8404 ,  B24B9/065

摘要： A method of manufacturing a disk substrate includes a disk substrate forming step of forming a disk substrate; and an outer chamfering step of chamfering an outer edge of the disk substrate. The outer chamfering step includes chamfering the outer edge by bringing an end surface of a cylindrical-shaped outer chamfering grindstone having a hollow portion on its end into contact with the outer edge such that the hollow portion faces the outer edge while rotating each of the outer chamfering grindstone and the disk substrate.

摘要翻译： 盘状基板的制造方法包括形成盘基板的盘基板形成工序; 以及对盘基板的外缘进行倒角的外倒角工序。 外倒角步骤包括通过使其端部具有中空部分的圆柱形外倒角砂轮的端面与外边缘接触来使外边缘倒角，使得中空部分面向外边缘，同时使每个外部边缘 倒角磨石和盘基片。

公开(公告)号：US08002923B2

公开(公告)日：2011-08-23

申请号：US12249341

申请日：2008-10-10

申请人： Tetsuo Suzuki ,  Yoshio Kawakami

发明人： Tetsuo Suzuki ,  Yoshio Kawakami

IPC分类号： B24B1/00 ,  B24B9/00 ,  B32B38/00

CPC分类号： G11B5/8404 ,  B24B9/065

摘要： A glass block is formed by stacking, fixing, and integrating a plurality of thin glass plates having a predetermined thickness. An annular glass block is formed by coring the glass block. Surfaces of an inside circumference and an outside circumference of the annular glass block are ground. The annular glass block of which the surfaces of the inside circumference and the outside circumference are ground are separated into individual annular glass substrates, and separated annular glass substrates are cleaned. Then, edge portions of the inside circumference and the outside circumference of a cleaned annular glass substrate are chamfered.

摘要翻译： 通过堆叠，固定和整合具有预定厚度的多个薄玻璃板来形成玻璃块。 通过取芯玻璃块形成环形玻璃块。 研磨环形玻璃块的内周和外周的表面。 将内周面和外周面的表面研磨的环状玻璃块分离成单独的环状玻璃基板，并且分离的环状玻璃基板被清洁。 然后，将清洁后的环状玻璃基板的内周缘部和外周缘部进行倒角。

公开(公告)号：US20100317265A1

公开(公告)日：2010-12-16

申请号：US12861519

申请日：2010-08-23

申请人： Kazuhiro Nakiri ,  Yoshio Kawakami ,  Tetsuo Suzuki

发明人： Kazuhiro Nakiri ,  Yoshio Kawakami ,  Tetsuo Suzuki

IPC分类号： B24B9/10

CPC分类号： G11B5/8404 ,  B24B9/065

摘要： A chamfering apparatus is used to chamfer a peripheral edge of a glass substrate. The chamfering apparatus includes a grindstone having a cylindrical hollow end portion; a grindstone driving unit that rotates the grindstone around an axis of the cylindrical hollow end portion; a substrate rotation-driving unit that rotates the glass substrate around either one of an axis of the outer periphery and an axis of the center circular hole; and a pressing unit that presses the grindstone to the glass substrate such that an annular end surface of the grindstone contacts with an edge of either one of the outer periphery and the inner periphery of the glass substrate while the cylindrical hollow end portion of the grindstone faces with one of the outer periphery and the inner periphery of the glass substrate.

摘要翻译： 使用倒角装置来倒角玻璃基板的周缘。 该倒角装置包括：具有圆筒状的中空端部的砂轮; 磨石驱动单元，其使磨石围绕圆筒状中空端部的轴线旋转; 基板旋转驱动单元，其使玻璃基板围绕外周的轴线和中心圆孔的轴线旋转; 以及按压单元，其将磨石按压到玻璃基板，使得磨石的环形端面与玻璃基板的外周和内周的任一边缘的边缘接触，同时磨石的圆柱形中空端部面对 玻璃基板的外周和内周之一。

公开(公告)号：US20090042493A1

公开(公告)日：2009-02-12

申请号：US12244821

申请日：2008-10-03

申请人： Kazuhiro NAKIRI ,  Yoshio Kawakami ,  Tetsuo Suzuki

发明人： Kazuhiro NAKIRI ,  Yoshio Kawakami ,  Tetsuo Suzuki

IPC分类号： B24B5/00

CPC分类号： G11B5/8404 ,  B24B9/065

摘要： A chamfering apparatus is used to chamfer a peripheral edge of a glass substrate. The chamfering apparatus includes a grindstone having a cylindrical hollow end portion; a grindstone driving unit that rotates the grindstone around an axis of the cylindrical hollow end portion; a substrate rotation-driving unit that rotates the glass substrate around either one of an axis of the outer periphery and an axis of the center circular hole; and a pressing unit that presses the grindstone to the glass substrate such that an annular end surface of the grindstone contacts with an edge of either one of the outer periphery and the inner periphery of the glass substrate while the cylindrical hollow end portion of the grindstone faces with one of the outer periphery and the inner periphery of the glass substrate.

摘要翻译： 使用倒角装置来倒角玻璃基板的周缘。 该倒角装置包括：具有圆筒状的中空端部的砂轮; 磨石驱动单元，其使所述磨石围绕所述圆筒状中空端部的轴线旋转; 基板旋转驱动单元，其使玻璃基板围绕外周的轴线和中心圆孔的轴线旋转; 以及按压单元，其将磨石按压到玻璃基板，使得磨石的环形端面与玻璃基板的外周和内周的任一边缘的边缘接触，而砂轮的圆柱形中空端部面朝向 玻璃基板的外周和内周之一。

公开(公告)号：US08859077B2

公开(公告)日：2014-10-14

申请号：US13028588

申请日：2011-02-16

申请人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Satoshi Hirano

发明人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Satoshi Hirano

IPC分类号： B32B3/24 ,  H05K3/46 ,  H05K1/11 ,  H05K3/20

CPC分类号： H05K3/4682 ,  H05K1/112 ,  H05K3/205 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/099 ,  Y10T428/24331 ,  Y10T428/24339

摘要： A plurality of openings are formed in a resin insulation layer on a bottom surface side of a wiring laminate portion which constitutes a multilayer wiring substrate. A plurality of motherboard connection terminals are disposed to correspond to the openings. The motherboard connection terminals are primarily comprised of a copper layer, and peripheral portions of terminal outer surfaces thereof are covered by the outermost resin insulation layer. A dissimilar metal layer made of at least one metal which is lower in etching rate than copper is formed between an inner main surface of the outermost resin insulation layer and peripheral portions of the terminal outer surfaces.

摘要翻译： 在构成多层布线基板的布线层叠体的底面侧的树脂绝缘层上形成有多个开口部。 多个主板连接端子被设置成对应于这些开口。 母板连接端子主要由铜层构成，其端子外表面的周边部分被最外层树脂绝缘层覆盖。 在最外层树脂绝缘层的内主表面和端子外表面的周边部分之间形成由蚀刻速率低于铜的至少一种金属制成的异种金属层。

公开(公告)号：US08707554B2

公开(公告)日：2014-04-29

申请号：US12979474

申请日：2010-12-28

申请人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Takuya Hando ,  Tatsuya Ito ,  Satoshi Hirano ,  Atsuhiko Sugimoto

发明人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Takuya Hando ,  Tatsuya Ito ,  Satoshi Hirano ,  Atsuhiko Sugimoto

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H05K1/0298 ,  H01L21/4846 ,  H01L23/49822 ,  H01L2224/16225 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K3/0055 ,  H05K3/3452 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/0989 ,  H05K2201/099

摘要： In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.

摘要翻译： 在堆积步骤中，将多个树脂绝缘层和多个导电层以多层布置交替层叠在可分离地层叠在基材侧上的金属箔上，从而形成布线层压体部分。 在钻井工序中，通过激光钻孔在最外层的树脂绝缘层上形成多个开口，露出连接端子。 随后，在去污步骤中，去除开口内部的污迹。 在堆积步骤之后执行的基材除去步骤中，除去基材并暴露金属箔。

公开(公告)号：US20110252852A1

公开(公告)日：2011-10-20

申请号：US13140379

申请日：2009-10-22

申请人： Yoshiharu Watabe ,  Seiichi Minegishi ,  Tetsuo Suzuki ,  Masaomi Saruyama ,  Masashi Takagaki

发明人： Yoshiharu Watabe ,  Seiichi Minegishi ,  Tetsuo Suzuki ,  Masaomi Saruyama ,  Masashi Takagaki

IPC分类号： C21D9/40 ,  B21D26/02 ,  C21D1/00

CPC分类号： C21D9/0025 ,  B21D26/033 ,  C21D9/40 ,  F27D5/0006

摘要： Provided are a conveying jig, a method of manufacturing the conveying jig, and a method of heat-treating metal rings using the conveying jig. The conveying jig is provided with a base and ten holding shafts raised from the base. Ridges and grooves are alternatively provided in the side wall of each holding shaft. The metal rings are held in position by being engaged in the grooves in the holding shafts. The space enclosed within the holding shafts is communicated with the atmosphere, and this allows, when the metal rings held by the conveying jig are subjected to heat treatment in a heat treatment furnace, an atmospheric gas to circulate in the space enclosed within the holding shafts.

摘要翻译： 提供了输送夹具，制造输送夹具的方法以及使用输送夹具对金属环进行热处理的方法。 输送夹具设有一个基座和十个从底座上升的保持轴。 在每个保持轴的侧壁中可选地设置有脊和槽。 金属环通过接合在保持轴中的槽中而保持就位。 封闭在保持轴内的空间与大气连通，这样当由输送夹具保持的金属环在热处理炉中进行热处理时，能够在封闭在保持轴内的空间内循环大气 。