公开(公告)号：US08859077B2

公开(公告)日：2014-10-14

申请号：US13028588

申请日：2011-02-16

申请人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Satoshi Hirano

发明人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Satoshi Hirano

IPC分类号： B32B3/24 ,  H05K3/46 ,  H05K1/11 ,  H05K3/20

CPC分类号： H05K3/4682 ,  H05K1/112 ,  H05K3/205 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/099 ,  Y10T428/24331 ,  Y10T428/24339

摘要： A plurality of openings are formed in a resin insulation layer on a bottom surface side of a wiring laminate portion which constitutes a multilayer wiring substrate. A plurality of motherboard connection terminals are disposed to correspond to the openings. The motherboard connection terminals are primarily comprised of a copper layer, and peripheral portions of terminal outer surfaces thereof are covered by the outermost resin insulation layer. A dissimilar metal layer made of at least one metal which is lower in etching rate than copper is formed between an inner main surface of the outermost resin insulation layer and peripheral portions of the terminal outer surfaces.

摘要翻译： 在构成多层布线基板的布线层叠体的底面侧的树脂绝缘层上形成有多个开口部。 多个主板连接端子被设置成对应于这些开口。 母板连接端子主要由铜层构成，其端子外表面的周边部分被最外层树脂绝缘层覆盖。 在最外层树脂绝缘层的内主表面和端子外表面的周边部分之间形成由蚀刻速率低于铜的至少一种金属制成的异种金属层。

公开(公告)号：US08707554B2

公开(公告)日：2014-04-29

申请号：US12979474

申请日：2010-12-28

申请人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Takuya Hando ,  Tatsuya Ito ,  Satoshi Hirano ,  Atsuhiko Sugimoto

发明人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Takuya Hando ,  Tatsuya Ito ,  Satoshi Hirano ,  Atsuhiko Sugimoto

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H05K1/0298 ,  H01L21/4846 ,  H01L23/49822 ,  H01L2224/16225 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K3/0055 ,  H05K3/3452 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/0989 ,  H05K2201/099

摘要： In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.

摘要翻译： 在堆积步骤中，将多个树脂绝缘层和多个导电层以多层布置交替层叠在可分离地层叠在基材侧上的金属箔上，从而形成布线层压体部分。 在钻井工序中，通过激光钻孔在最外层的树脂绝缘层上形成多个开口，露出连接端子。 随后，在去污步骤中，去除开口内部的污迹。 在堆积步骤之后执行的基材除去步骤中，除去基材并暴露金属箔。

公开(公告)号：US08772643B2

公开(公告)日：2014-07-08

申请号：US13028545

申请日：2011-02-16

申请人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Satoshi Hirano

发明人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Satoshi Hirano

IPC分类号： H05K1/09

CPC分类号： H05K3/4682 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/0588 ,  Y10T29/302 ,  Y10T29/49117 ,  H01L2924/00

摘要： A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface.

摘要翻译： 在布线层叠部的顶面侧的树脂绝缘层上形成有多个开口部，在其底面侧的树脂绝缘层上形成有多个开口部。 多个连接端子被设置成对应于这些开口。 连接端子的端子外表面的外围部分被顶表面侧上的树脂绝缘层覆盖，并且连接端子的端子外表面的周边部分被底表面侧上的树脂绝缘层覆盖。 每个第二主表面侧连接端子在端子外表面的中心具有凹部，并且凹部的最深部相对于端子外表面的周边部位于内侧 。

公开(公告)号：US08581388B2

公开(公告)日：2013-11-12

申请号：US12976427

申请日：2010-12-22

申请人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

发明人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

IPC分类号： H01L23/053 ,  H01L21/4763

CPC分类号： H05K3/3452 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/09527 ,  H05K2201/099 ,  H05K2203/0346 ,  H05K2203/0369 ,  H01L2924/00

摘要： A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.

摘要翻译： 一种多层布线基板，包括：布置在堆叠结构的第一主表面中的多个第一主表面侧连接端子; 并且多个第二主表面侧连接端子布置在所述堆叠结构的第二主表面中; 其中多个导体层交替地形成在多个堆叠的树脂绝缘层中，并且通过锥形的通孔导体可操作地连接，使得其直径朝向第一或第二主表面加宽，其中形成多个开口 在第二主表面中暴露的最外层树脂绝缘层中，并且布置成与多个开口相匹配的第二主表面侧连接端子的端子外表面从暴露的最外层树脂绝缘层的外主表面位于内侧， 并且端子内表面的边缘是圆形的。

公开(公告)号：US08450622B2

公开(公告)日：2013-05-28

申请号：US13031735

申请日：2011-02-22

申请人： Shinnosuke Maeda ,  Takuya Torii ,  Tetsuo Suzuki ,  Satoshi Hirano

发明人： Shinnosuke Maeda ,  Takuya Torii ,  Tetsuo Suzuki ,  Satoshi Hirano

IPC分类号： H01K3/10 ,  H05K3/02 ,  H05K3/10 ,  H05K1/11

CPC分类号： H01L21/6835 ,  H01L23/3107 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/4682 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A multilayer wiring substrate includes first principal surface side connection terminals arranged on a first principal surface of a stacked configuration; wherein, the first principal surface side connection terminals include an IC chip connection terminal, and a passive element connection terminal; the IC chip connection terminal is located in an opening formed in a resin insulating layer of an uppermost outer layer; the passive element connection terminal is formed of an upper terminal part formed on the resin insulating layer, and a lower terminal part located in an opening formed at a portion of an inner side of the upper terminal part in the resin insulating layer; and, wherein an upper face of the upper terminal part is higher than a reference surface, and an upper face of the IC chip connection terminal and the lower terminal part are identical in height to or lower in height than the reference surface.

摘要翻译： 多层布线基板包括布置在堆叠构造的第一主表面上的第一主表面侧连接端子; 其中，所述第一主面侧连接端子包括IC芯片连接端子和无源元件连接端子; IC芯片连接端子位于形成在最上层外层的树脂绝缘层中的开口中; 无源元件连接端子由形成在树脂绝缘层上的上端子部和位于树脂绝缘层中的上端子部的内侧的开口部的下端子部构成， 并且其中所述上端子部分的上表面高于参考表面，并且所述IC芯片连接端子和所述下端子部分的上表面的高度与所述基准表面的高度相同或更低。

公开(公告)号：US20110252852A1

公开(公告)日：2011-10-20

申请号：US13140379

申请日：2009-10-22

申请人： Yoshiharu Watabe ,  Seiichi Minegishi ,  Tetsuo Suzuki ,  Masaomi Saruyama ,  Masashi Takagaki

发明人： Yoshiharu Watabe ,  Seiichi Minegishi ,  Tetsuo Suzuki ,  Masaomi Saruyama ,  Masashi Takagaki

IPC分类号： C21D9/40 ,  B21D26/02 ,  C21D1/00

CPC分类号： C21D9/0025 ,  B21D26/033 ,  C21D9/40 ,  F27D5/0006

摘要： Provided are a conveying jig, a method of manufacturing the conveying jig, and a method of heat-treating metal rings using the conveying jig. The conveying jig is provided with a base and ten holding shafts raised from the base. Ridges and grooves are alternatively provided in the side wall of each holding shaft. The metal rings are held in position by being engaged in the grooves in the holding shafts. The space enclosed within the holding shafts is communicated with the atmosphere, and this allows, when the metal rings held by the conveying jig are subjected to heat treatment in a heat treatment furnace, an atmospheric gas to circulate in the space enclosed within the holding shafts.

摘要翻译： 提供了输送夹具，制造输送夹具的方法以及使用输送夹具对金属环进行热处理的方法。 输送夹具设有一个基座和十个从底座上升的保持轴。 在每个保持轴的侧壁中可选地设置有脊和槽。 金属环通过接合在保持轴中的槽中而保持就位。 封闭在保持轴内的空间与大气连通，这样当由输送夹具保持的金属环在热处理炉中进行热处理时，能够在封闭在保持轴内的空间内循环大气 。

公开(公告)号：US08002923B2

公开(公告)日：2011-08-23

申请号：US12249341

申请日：2008-10-10

申请人： Tetsuo Suzuki ,  Yoshio Kawakami

发明人： Tetsuo Suzuki ,  Yoshio Kawakami

IPC分类号： B24B1/00 ,  B24B9/00 ,  B32B38/00

CPC分类号： G11B5/8404 ,  B24B9/065

摘要： A glass block is formed by stacking, fixing, and integrating a plurality of thin glass plates having a predetermined thickness. An annular glass block is formed by coring the glass block. Surfaces of an inside circumference and an outside circumference of the annular glass block are ground. The annular glass block of which the surfaces of the inside circumference and the outside circumference are ground are separated into individual annular glass substrates, and separated annular glass substrates are cleaned. Then, edge portions of the inside circumference and the outside circumference of a cleaned annular glass substrate are chamfered.

摘要翻译： 通过堆叠，固定和整合具有预定厚度的多个薄玻璃板来形成玻璃块。 通过取芯玻璃块形成环形玻璃块。 研磨环形玻璃块的内周和外周的表面。 将内周面和外周面的表面研磨的环状玻璃块分离成单独的环状玻璃基板，并且分离的环状玻璃基板被清洁。 然后，将清洁后的环状玻璃基板的内周缘部和外周缘部进行倒角。

公开(公告)号：US20070012338A1

公开(公告)日：2007-01-18

申请号：US11424369

申请日：2006-06-15

申请人： Katsuyuki Iijima ,  Tetsuo Suzuki

发明人： Katsuyuki Iijima ,  Tetsuo Suzuki

IPC分类号： C23G1/00 ,  C23G1/02 ,  B08B7/00 ,  B08B3/00

CPC分类号： C23G1/22 ,  C23G1/00 ,  C23G1/12

摘要： A remover contains an alkaline component, a bivalent zinc ion, a ferric ion, a chelating agent, and a nitrate ion. By using this remover, an anodized film can be selectively removed from an aluminum or aluminum-alloy member.

摘要翻译： 去除剂含有碱性组分，二价锌离子，三价铁离子，螯合剂和硝酸根离子。 通过使用该去除剂，可以从铝或铝合金构件中选择性地除去阳极氧化膜。

公开(公告)号：US06866428B2

公开(公告)日：2005-03-15

申请号：US10188649

申请日：2002-07-01

申请人： Tetsuo Suzuki

发明人： Tetsuo Suzuki

IPC分类号： G02B6/255

CPC分类号： G02B6/2551

摘要： Provided are connection methods and a heat treatment apparatus to be used in the method capable of readily applying heat treatment to a fusion-spliced portion of a connection line which is formed by fusion-splicing optical fibers of different kinds and capable of finishing the heat treatment with no excess or insufficiency.In the connection methods, after fusion-splicing the optical fibers of different kinds having different MFDs, the heat treatment is carried out to match the MFDs. At the same time, a dummy connection line of dummy optical fibers of different kinds is prepared, which is the same combination as the connection line of the optical fibers of different kinds to which the heat treatment is applied. While measuring connection loss in the dummy connection line directly or indirectly, the heat treatment is applied to the dummy connection line as well as the connection line. When a measured value of the connection loss in the dummy connection line lowers below a preset decision value of the time to finish the heat treatment, the heat treatment is finished. It is possible to readily finish the heat treatment at an appropriate timing without giving an excessive or insufficient heat treatment.

摘要翻译： 提供了在能够容易地对通过熔接不同种类的光纤形成并能够完成热处理的连接线的熔接部分进行热处理的方法中使用的连接方法和热处理装置。 没有过剩或不足。在连接方法中，在熔接具有不同MFD的不同种类的光纤后，进行热处理以匹配MFD。 同时，准备了不同种类的虚拟光纤的虚拟连接线，这是与应用热处理的不同种类的光纤的连接线相同的组合。 在直接或间接测量虚拟连接线中的连接损耗的同时，对虚拟连接线以及连接线进行热处理。 当虚拟连接线中的连接损耗的测量值低于完成热处理的时间的预设决定值时，热处理结束。 可以在适当的时间下容易地完成热处理，而不会导致过热或不充分的热处理。

公开(公告)号：US06860119B2

公开(公告)日：2005-03-01

申请号：US10171016

申请日：2002-06-11

申请人： Tetsuo Suzuki ,  Naoki Amatatsu ,  Hiroaki Oonuma ,  Wataru Komatsu

发明人： Tetsuo Suzuki ,  Naoki Amatatsu ,  Hiroaki Oonuma ,  Wataru Komatsu

IPC分类号： G02B6/255 ,  C03B37/027

CPC分类号： G02B6/2551

摘要： An optical fiber splicing method is provided for largely reducing an optical loss in a splice and eliminating a varying outer diameter and bending deformation. This splicing method splices opposing end faces of two optical fibers by fusion, and heats a formed fusion splice to match mode field diameters of the two optical fibers in the fusion splice, wherein the two optical fibers are fixed with an axial tension applied or not applied to the fusion splice, after the formation of the fusion splice, before the fusion splice is heated.

摘要翻译： 提供了一种光纤接合方法，用于大大降低接头中的光损耗并消除变化的外径和弯曲变形。 该拼接方法通过熔接将两个光纤相对的端面接合，并且加热形成的熔接以匹配熔接中两个光纤的模场直径，其中两个光纤被施加或未施加的轴向张力固定 在融合拼接之后，在融合接头加热之前。