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公开(公告)号：US20070032055A1
公开(公告)日：2007-02-08
申请号：US11161538
申请日：2005-08-08
IPC分类号： H01L21/20
CPC分类号： H01L21/76808 , H01L21/31116 , H01L21/32136 , H01L21/76847 , H01L21/76877 , H01L21/76883 , H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： A method and structure for a composite stud contact interface with a decreased contact resistance and improved reliability. A selective dry etch is used which comprises a fluorine containing gas. The contact resistance is reduced by partially dry-etching back the tungsten contact after or during the M1 RIE process. The recessed contact is then subsequently metalized during the M1 liner/plating process. The tungsten contact height is reduced after it has been fully formed.
摘要翻译： 具有降低的接触电阻和改善的可靠性的复合螺柱接触界面的方法和结构。 使用包含含氟气体的选择性干蚀刻。 在M1 RIE工艺过程中或之后，通过部分干法蚀刻钨触点来降低接触电阻。 然后在M1衬套/电镀工艺期间将凹陷接触件金属化。 钨接触高度在完全成型后减小。
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2.发明授权Apparatus for providing solder interconnections to semiconductor and electronic packaging devices 失效用于向半导体和电子封装装置提供焊料互连的装置
公开(公告)号：US6099935A
公开(公告)日：2000-08-08
申请号：US573469
申请日：1995-12-15
申请人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
发明人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
CPC分类号： H01L24/81 , H01L21/6835 , H01L24/75 , H05K3/3484 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/0568 , H01L2224/05684 , H01L2224/11003 , H01L2224/11332 , H01L2224/11334 , H01L2224/11472 , H01L2224/13111 , H01L2224/16 , H01L2224/742 , H01L2224/75 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15787 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , Y10T428/24174 , Y10T428/24273 , Y10T428/24479
摘要： An apparatus for use in manufacturing a semiconductor device having input-output (IO) lands arranged in an IO array on an IO face includes a body having a plurality of cavities extending from an operating face into the body; the cavities are arranged in a cavity loci array which is in registeration with the IO lands when the apparatus is in a manufacturing position with the operating face generally adjacent the IO face. Each cavity has a depth and a lateral expanse which cooperate to establish a volume defined by a cavity bottom and at least one cavity wall. The volume accommodates an appropriate amount of solder material to establish a measure of the solder material on a facing IO land when the apparatus is in the manufacturing position. The depth is appropriate to facilitate wettingly attracting the solder material to the facing IO land when the apparatus is in the manufacturing position and the semiconductor device and the apparatus are exposed to appropriate ambient conditions to effect reflow of the solder material. The invention also includes a method for using the apparatus in manufacturing a semiconductor device.
摘要翻译： 一种用于制造半导体器件的装置，其具有以IO阵列布置在IO面上的输入 - 输出（IO）焊盘，该主体具有从操作面延伸到主体中的多个空腔; 空腔被布置在空腔轨迹阵列中，当该设备处于制造位置时，其中操作面大体上邻近IO面，该腔轨迹阵列与IO凸台对齐。 每个空腔具有深度和横向宽度，其协作以建立由空腔底部和至少一个空腔壁限定的体积。 当装置处于制造位置时，体积容纳适当量的焊料材料以建立在面对的IO焊盘上的焊料材料的量度。 当装置处于制造位置时，该深度适于促进将焊料材料润湿地吸引到相对的IO焊盘，并且半导体器件和设备暴露于适当的环境条件以实现焊料材料的回流。 本发明还包括一种在制造半导体器件中使用该装置的方法。
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公开(公告)号：US06448169B1
公开(公告)日：2002-09-10
申请号：US08576185
申请日：1995-12-21
申请人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
发明人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
IPC分类号： H01L2144
CPC分类号： B23K3/0607 , B23K2101/40 , H05K3/3484 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , Y10T29/49204
摘要： An apparatus for use in manufacturing a semiconductor device includes an input-output (IO) face having a plurality of IO lands, and is situated in an operating position in abutting relation with a depositor. The apparatus includes a first holding member holding the depositor in a first position; a second holding member holding the semiconductor device in the operating position. The depositor and the semiconductor device cooperate in the operating position to deposit solder ball connection structures to the IO lands. The apparatus further includes a separating member for moving at least one of the depositor and the semiconductor device from the operating position to an interim orientation. The interim orientation establishes a separation distance intermediate the depositor and the semiconductor device appropriate to disengage the solder ball connecting structures from the depositor.
摘要翻译： 一种用于制造半导体器件的装置包括具有多个IO引脚的输入输出（IO）面，并且位于与沉积器邻接的操作位置。 该装置包括将第一保持构件保持在第一位置; 保持半导体器件处于操作位置的第二保持构件。 存储器和半导体器件在操作位置协作以将焊球连接结构沉积到IO焊盘。 该装置还包括用于将存储器和半导体器件中的至少一个从操作位置移动到临时取向的分离构件。 临时方向建立了适于使焊球连接结构与沉积器脱离接触的存放器和半导体器件之间的间隔距离。
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公开(公告)号：US6149048A
公开(公告)日：2000-11-21
申请号：US057421
申请日：1998-04-08
申请人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
发明人： William Brearley , Laertis Economikos , Paul F. Findeis , Kimberley A. Kelly , Bouwe W. Leenstra , Arthur Gilman Merryman , Eric Daniel Perfecto , Chandrika Prasad , James Patrick Wood , Roy Yu
CPC分类号： B23K3/0607 , H05K3/3484 , B23K2201/40 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , Y10T29/49204
摘要： An apparatus for use in manufacturing a semiconductor device includes an input-output (IO) face having a plurality of IO lands, and is situated in an operating position in abutting relation with a depositor. The apparatus includes a first holding member holding the depositor in a first position; a second holding member holding the semiconductor device in the operating position. The depositor and the semiconductor device cooperate in the operating position to deposit solder ball connection structures to the IO lands. The apparatus further includes a separating member for moving at least one of the depositor and the semiconductor device from the operating position to an interim orientation. The interim orientation establishes a separation distance intermediate the depositor and the semiconductor device appropriate to disengage the solder ball connecting structures from the depositor.
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