Method for electroplating a body-centered cubic nickel-iron alloy thin film with a high saturation flux density
    3.
    发明授权
    Method for electroplating a body-centered cubic nickel-iron alloy thin film with a high saturation flux density 失效
    用于电镀具有高饱和磁通密度的体心立方镍铁合金薄膜的方法

    公开(公告)号:US07001499B2

    公开(公告)日:2006-02-21

    申请号:US10053785

    申请日:2002-01-18

    IPC分类号: C25D5/50

    摘要: A process for electroplating and annealing thin-films of nickel-iron alloys having from 63% to 81% iron content by weight to produce pole pieces having saturation flux density (BS) in the range from 1.9 to 2.3 T (19 to 23 kG) with acceptable magnetic anisotropy and magnetostriction and a coercivity (HC) no higher than 160 A/m (2 Oe). The desired alloy layer properties, including small crystal size and minimal impurity inclusions, can be produced by including higher relative levels of Fe++ ions in the electroplating bath while holding the bath at a lower temperature while plating from a suitable seed layer. The resulting alloy layer adopts a small crystal size (BCC) without significant inclusion of impurities, which advantageously permits annealing to an acceptable HC while retaining the high BS desired.

    摘要翻译: 电镀和退火铁含量为63%至81%的镍铁合金薄膜的方法,以产生具有饱和磁通密度(B S S S S)的范围在1.9至 2.3 T(19〜23kG)具有可接受的磁各向异性和磁致伸缩,矫顽力(H C C)不高于160A / m(2Oe)。 包括小晶体尺寸和最小杂质夹杂物在内的期望的合金层性能可以通过在电镀浴中包含更高的相对水平的Fe ++离子而制备,同时将浴保持在较低温度,同时从 合适的种子层。 所得到的合金层采用小晶粒尺寸(BCC),而不显着地包含杂质,这有利地允许退火到可接受的H C,同时保持所需的高B S S S。

    Method of electroplating a nickel-iron alloy film with a graduated composition

    公开(公告)号:US06599411B2

    公开(公告)日:2003-07-29

    申请号:US09839901

    申请日:2001-04-20

    IPC分类号: C25D518

    摘要: In the NiFe electroplating method of the present invention, the atomic percent (at. %) composition of Ni and Fe in NiFe electroplated material is controlled by selection of the duty cycle of the electroplating current during the electroplating process. Generally, for a particular electroplating bath, where the electroplating current duty cycle is greatest the NiFe electroplated material has a higher Fe at. %, and where the electroplating current duty cycle is reduced, a lower Fe at. %. Therefore, electroplated NiFe components from a single electroplating bath can have differing NiFe concentrations where the electroplating current duty cycle is altered. Additionally, NiFe components can be electroplated with a graduated or changing Ni and Fe concentration by altering the electroplating current duty cycle during the electroplating process.

    High-saturation thin-film write head for high-coercivity magnetic data storage media
    6.
    发明授权
    High-saturation thin-film write head for high-coercivity magnetic data storage media 有权
    用于高矫顽力磁数据存储介质的高饱和度薄膜写头

    公开(公告)号:US06876507B2

    公开(公告)日:2005-04-05

    申请号:US10054554

    申请日:2002-01-18

    IPC分类号: G11B5/60 G11B15/18

    CPC分类号: G11B5/6005

    摘要: A thin-film write head employing pole pieces formed of an electroplated body-centered cubic (BCC) nickel-iron alloy with a saturation flux density (BS) of 1.9 to 2.3 T (19 to 23 kG) and an acceptable coercivity (HC) of about 80 to about 160 A/m (1-2 Oe). The iron content of the electroplated nickel-iron alloy is from 64% to 81% by weight. The two-layer pole fabrication process holds magnetic anisotropy and coercivity to useable values while improving saturation flux density and optimizing magnetostriction. This is accomplished by first electroplating a BCC nickel-iron layer onto an underlying seed layer and then annealing the two layers to reduce coercivity to less than about 160 amps/meter and raise magnetization to acceptable levels.

    摘要翻译: 使用由电感体心立方(BCC)镍铁合金形成的极片的薄膜写头,其饱和磁通密度(BS)为1.9至2.3T(19至23kG)和可接受的矫顽力(HC) 为约80至约160A / m(1-2Oe)。 电镀镍铁合金的铁含量为64〜81重量%。 双层极制造工艺将磁各向异性和矫顽力保持在可用值上,同时提高饱和磁通密度和优化磁致伸缩。 这是通过首先将BCC镍铁层电镀到下层种子层上,然后使两层退火以将矫顽力降低到小于约160安培/米,并将磁化升高至可接受的水平来实现的。

    Thermally assisted recording head with near field transducer having integral heatsink
    7.
    发明授权
    Thermally assisted recording head with near field transducer having integral heatsink 有权
    具有集成散热片的近场传感器的热辅助记录头

    公开(公告)号:US08339739B2

    公开(公告)日:2012-12-25

    申请号:US12807296

    申请日:2010-08-31

    IPC分类号: G11B5/187

    摘要: A write head structure for use with thermally assisted recording is disclosed. Improved heat sinking is provided for removing thermal energy created by a ridge aperture near field light transducer. Metal films conduct heat away from the region near the ridge aperture to the high pressure air film at the ABS between the head and media. This heat is further dissipated by the media. The metal films have varying thickness to improve lateral conductivity and may be composed of Au combined with a harder metal such as Ru to improve wear characteristics at the ABS.

    摘要翻译: 公开了一种用于热辅助记录的写头结构。 提供改进的散热用于去除由场光传感器附近的脊孔产生的热能。 金属膜将热量从脊孔附近的区域传导到头部和介质之间的ABS处的高压空气膜。 这种热量被介质进一步消散。 金属膜具有不同的厚度以改善横向导电性,并且可以由Au与诸如Ru的较硬金属组合以提高ABS的磨损特性。

    Thermally assisted recording head having recessed waveguide with near field transducer and methods of making same
    8.
    发明授权
    Thermally assisted recording head having recessed waveguide with near field transducer and methods of making same 有权
    带有近场传感器的凹槽波导的热辅助记录头及其制造方法

    公开(公告)号:US08169881B2

    公开(公告)日:2012-05-01

    申请号:US12347084

    申请日:2008-12-31

    IPC分类号: G11B7/135

    摘要: According to one embodiment, an apparatus includes a near field transducer comprising a conductive metal film having a main body and a ridge extending from the main body and an optical waveguide for illumination of the near field transducer, a light guiding core layer of the optical waveguide being spaced from the near field transducer by less than about 100 nanometers and greater than 0 nanometers. In another embodiment, a method includes forming a near field transducer structure and removing a portion of the near field transducer structure. The method also includes forming a cladding layer adjacent a remaining portion of the near field transducer structure, wherein a portion of the cladding layer extends along the remaining portion of the near field transducer structure and forming a core layer above the cladding layer. Other apparatuses and methods are also included in the invention.

    摘要翻译: 根据一个实施例,一种装置包括近场换能器,其包括具有主体和从主体延伸的脊的导电金属膜和用于照射近场换能器的光波导,光波导的导光芯层 与近场传感器间隔小于约100纳米且大于0纳米。 在另一实施例中,一种方法包括形成近场换能器结构并去除近场换能器结构的一部分。 该方法还包括在近场换能器结构的剩余部分附近形成包覆层,其中包层的一部分沿着近场换能器结构的剩余部分延伸并在包层上方形成芯层。 本发明还包括其他装置和方法。

    Distributed shunt structure for lapping of current perpendicular plane (CPP) heads
    10.
    发明授权
    Distributed shunt structure for lapping of current perpendicular plane (CPP) heads 有权
    分布式分流结构,用于研磨电流垂直平面(CPP)头

    公开(公告)号:US08070554B2

    公开(公告)日:2011-12-06

    申请号:US10990926

    申请日:2004-11-17

    IPC分类号: B24B49/00

    摘要: An apparatus and method for lapping and fabricating a read/write head is described. The lapping method includes performing a first lapping process on a structure having the read/write head fabricated therein. The first lapping process is for reducing a first resistive region. The first resistive region is located proximal to a surface of the structure. The first lapping process is for achieving a first lapping benchmark. The lapping method further includes performing a second lapping process on a second resistive region. The second lapping process laps at a rate lesser than the first lapping process. The second lapping process is for achieving a second lapping benchmark. The second resistive region is interposed between the first resistive region and the read/write head. The second resistive region has a different resistive value than the second resistive region.

    摘要翻译: 描述了用于研磨和制造读/写头的装置和方法。 研磨方法包括对其中制造读/写头的结构执行第一研磨处理。 第一次研磨工艺用于减少第一电阻区域。 第一电阻区域位于结构的表面附近。 第一个研磨过程是实现第一次研磨基准。 研磨方法还包括在第二电阻区域上进行第二研磨处理。 第二次研磨过程以比第一次研磨过程低的速度进行。 第二次研磨过程是实现第二次研磨基准。 第二电阻区域介于第一电阻区域和读/写头之间。 第二电阻区域具有与第二电阻区域不同的电阻值。