Distributed shunt structure for lapping of current perpendicular plane (CPP) heads
    1.
    发明授权
    Distributed shunt structure for lapping of current perpendicular plane (CPP) heads 有权
    分布式分流结构,用于研磨电流垂直平面(CPP)头

    公开(公告)号:US08070554B2

    公开(公告)日:2011-12-06

    申请号:US10990926

    申请日:2004-11-17

    IPC分类号: B24B49/00

    摘要: An apparatus and method for lapping and fabricating a read/write head is described. The lapping method includes performing a first lapping process on a structure having the read/write head fabricated therein. The first lapping process is for reducing a first resistive region. The first resistive region is located proximal to a surface of the structure. The first lapping process is for achieving a first lapping benchmark. The lapping method further includes performing a second lapping process on a second resistive region. The second lapping process laps at a rate lesser than the first lapping process. The second lapping process is for achieving a second lapping benchmark. The second resistive region is interposed between the first resistive region and the read/write head. The second resistive region has a different resistive value than the second resistive region.

    摘要翻译: 描述了用于研磨和制造读/写头的装置和方法。 研磨方法包括对其中制造读/写头的结构执行第一研磨处理。 第一次研磨工艺用于减少第一电阻区域。 第一电阻区域位于结构的表面附近。 第一个研磨过程是实现第一次研磨基准。 研磨方法还包括在第二电阻区域上进行第二研磨处理。 第二次研磨过程以比第一次研磨过程低的速度进行。 第二次研磨过程是实现第二次研磨基准。 第二电阻区域介于第一电阻区域和读/写头之间。 第二电阻区域具有与第二电阻区域不同的电阻值。

    WAFER-LEVEL METHOD FOR FABRICATING AN OPTICAL CHANNEL AND APERTURE STRUCTURE IN MAGNETIC RECORDING HEAD SLIDERS FOR USE IN THERMALLY-ASSISTED RECORDING (TAR)
    2.
    发明申请
    WAFER-LEVEL METHOD FOR FABRICATING AN OPTICAL CHANNEL AND APERTURE STRUCTURE IN MAGNETIC RECORDING HEAD SLIDERS FOR USE IN THERMALLY-ASSISTED RECORDING (TAR) 审中-公开
    用于制作用于热辅助记录(TAR)的磁记录头滑块中的光通道和光孔结构的波形方法

    公开(公告)号:US20090258186A1

    公开(公告)日:2009-10-15

    申请号:US12101066

    申请日:2008-04-10

    IPC分类号: G03F7/00 B32B3/10

    摘要: A process for forming a plurality of sliders for use in thermally-assisted recording (TAR) disk drives includes a wafer-level process for forming a plurality of aperture structures, and optionally abutting optical channels, on a wafer surface prior to cutting the wafer into individual sliders. The wafer has a generally planar surface arranged into a plurality of rectangularly-shaped regions. In each rectangular region a first metal layer is deposited on the wafer surface, followed by a layer of radiation-transmissive aperture material, which is then lithographically patterned to define the width of the aperture, the aperture width being parallel to the length of the rectangularly-shaped region. A second metal layer is deposited over the patterned layer of aperture material. The resulting structure is then lithographically patterned to define an aperture structure comprising aperture material surrounded by metal and having parallel radiation entrance and exit faces orthogonal to the wafer surface.

    摘要翻译: 用于形成用于热辅助记录(TAR)盘驱动器中的多个滑动件的方法包括在将晶片切割成晶片之前在晶片表面上形成多个孔结构和可选地邻接的光通道的晶片级工艺 个人滑块 晶片具有布置成多个矩形区域的大致平坦的表面。 在每个矩形区域中,第一金属层沉积在晶片表面上,随后是一层辐射透射的孔隙材料,然后将其光刻图案化以限定孔的宽度,孔的宽度平行于矩形的长度 形状区域。 在孔材料的图案化层上沉积第二金属层。 然后将所得结构光刻图案化以限定孔结构,该孔结构包括由金属包围并具有与晶片表面正交的平行辐射入射面和出射面的孔隙材料。

    Thermally assisted recording head with near field transducer having integral heatsink
    4.
    发明授权
    Thermally assisted recording head with near field transducer having integral heatsink 有权
    具有集成散热片的近场传感器的热辅助记录头

    公开(公告)号:US08339739B2

    公开(公告)日:2012-12-25

    申请号:US12807296

    申请日:2010-08-31

    IPC分类号: G11B5/187

    摘要: A write head structure for use with thermally assisted recording is disclosed. Improved heat sinking is provided for removing thermal energy created by a ridge aperture near field light transducer. Metal films conduct heat away from the region near the ridge aperture to the high pressure air film at the ABS between the head and media. This heat is further dissipated by the media. The metal films have varying thickness to improve lateral conductivity and may be composed of Au combined with a harder metal such as Ru to improve wear characteristics at the ABS.

    摘要翻译: 公开了一种用于热辅助记录的写头结构。 提供改进的散热用于去除由场光传感器附近的脊孔产生的热能。 金属膜将热量从脊孔附近的区域传导到头部和介质之间的ABS处的高压空气膜。 这种热量被介质进一步消散。 金属膜具有不同的厚度以改善横向导电性,并且可以由Au与诸如Ru的较硬金属组合以提高ABS的磨损特性。

    Thermally assisted recording head having recessed waveguide with near field transducer and methods of making same
    5.
    发明授权
    Thermally assisted recording head having recessed waveguide with near field transducer and methods of making same 有权
    带有近场传感器的凹槽波导的热辅助记录头及其制造方法

    公开(公告)号:US08169881B2

    公开(公告)日:2012-05-01

    申请号:US12347084

    申请日:2008-12-31

    IPC分类号: G11B7/135

    摘要: According to one embodiment, an apparatus includes a near field transducer comprising a conductive metal film having a main body and a ridge extending from the main body and an optical waveguide for illumination of the near field transducer, a light guiding core layer of the optical waveguide being spaced from the near field transducer by less than about 100 nanometers and greater than 0 nanometers. In another embodiment, a method includes forming a near field transducer structure and removing a portion of the near field transducer structure. The method also includes forming a cladding layer adjacent a remaining portion of the near field transducer structure, wherein a portion of the cladding layer extends along the remaining portion of the near field transducer structure and forming a core layer above the cladding layer. Other apparatuses and methods are also included in the invention.

    摘要翻译: 根据一个实施例,一种装置包括近场换能器,其包括具有主体和从主体延伸的脊的导电金属膜和用于照射近场换能器的光波导,光波导的导光芯层 与近场传感器间隔小于约100纳米且大于0纳米。 在另一实施例中,一种方法包括形成近场换能器结构并去除近场换能器结构的一部分。 该方法还包括在近场换能器结构的剩余部分附近形成包覆层,其中包层的一部分沿着近场换能器结构的剩余部分延伸并在包层上方形成芯层。 本发明还包括其他装置和方法。

    Device with ESD protection utilizing a shorting material between electrical pads or leads which are shorted then unshorted by severing the shorting material and then recreating the short by reapplying the shorting material
    10.
    发明授权
    Device with ESD protection utilizing a shorting material between electrical pads or leads which are shorted then unshorted by severing the shorting material and then recreating the short by reapplying the shorting material 失效
    具有ESD保护的装置,利用电焊盘或导线之间的短路材料,短路材料短路,然后通过切断短路材料,然后通过重新应用短路材料重建短路

    公开(公告)号:US07345853B2

    公开(公告)日:2008-03-18

    申请号:US11745787

    申请日:2007-05-08

    IPC分类号: G11B5/39

    摘要: A device according to one embodiment includes an electronic component such as an MR sensor, a pair of leads operatively coupled to the electronic component, and shorting material between the leads, the shorting material having been applied by a laser deposition process, the shorting material having been severed. A magnetic storage system according to another embodiment includes magnetic media; and at least one head for reading from and writing to the magnetic media, each head having: a sensor; and a writer coupled to the sensor. The system also includes a pair of pads or leads operatively coupled to the head; shorting material between the leads, the shorting material having been applied by a laser deposition process, the shorting material having been severed; a slider for supporting the head; and a control unit coupled to the head for controlling operation of the head.

    摘要翻译: 根据一个实施例的装置包括诸如MR传感器的电子部件,可操作地耦合到电子部件的一对引线以及引线之间的短路材料,通过激光沉积工艺施加了短路材料,所述短路材料具有 被切断 根据另一实施例的磁存储系统包括磁介质; 以及用于从磁介质读取和写入至少一个头部,每个头部具有:传感器; 以及耦合到传感器的写入器。 该系统还包括可操作地耦合到头部的一对垫或引线; 在引线之间短路材料,通过激光沉积工艺施加的短路材料,短路材料已被切断; 用于支撑头部的滑块; 以及耦合到头部用于控制头部的操作的控制单元。