公开(公告)号：US5220044A

公开(公告)日：1993-06-15

申请号：US852285

申请日：1992-03-16

申请人： Thomas H. Baum ,  Carl E. Larson ,  Scott K. Reynolds

发明人： Thomas H. Baum ,  Carl E. Larson ,  Scott K. Reynolds

IPC分类号： C23C16/18 ,  H05K3/40

CPC分类号： C23C16/18 ,  H05K3/4076

摘要： Chemical vapor deposition precursors for depositing copper, silver, rhodium and iridium metals on substrates comprise ligand stabilized +1 metal beta-diketonate coordination complexes of said metals. Uses of such precursors in CVD processes are also provided.

摘要翻译： 用于在衬底上沉积铜，银，铑和铱金属的化学气相沉积前体包括所述金属的配体稳定的+1金属β-二酮配位络合物。 还提供了这些前体在CVD工艺中的使用。

公开(公告)号：US5096737A

公开(公告)日：1992-03-17

申请号：US602970

申请日：1990-10-24

申请人： Thomas H. Baum ,  Carl E. Larson ,  Scott K. Reynolds

发明人： Thomas H. Baum ,  Carl E. Larson ,  Scott K. Reynolds

IPC分类号： C07F1/08 ,  C07F1/10 ,  C07F9/02 ,  C07F9/50 ,  C07F15/00 ,  C23C16/18 ,  C23C16/48 ,  C23C16/50 ,  H01L21/285 ,  H05K3/40

CPC分类号： C23C16/18 ,  H05K3/4076

摘要： Chemical vapor deposition precursors for depositing copper, silver, rhodium and iridium metals on substrates comprise ligand stabilized +1 metal beta-diketonate coordination complexes of said metals. Uses of such precursors in CVD processes are also provided.

摘要翻译： 用于在衬底上沉积铜，银，铑和铱金属的化学气相沉积前体包括所述金属的配体稳定的+1金属β-二酮配位络合物。 还提供了这些前体在CVD工艺中的使用。

公开(公告)号：US09203159B2

公开(公告)日：2015-12-01

申请号：US13371924

申请日：2012-02-13

申请人： Daniel J. Friedman ,  Xiaoxiong Gu ,  Duixian Liu ,  Arun S. Natarajan ,  Scott K. Reynolds ,  Alberto Valdes Garcia

发明人： Daniel J. Friedman ,  Xiaoxiong Gu ,  Duixian Liu ,  Arun S. Natarajan ,  Scott K. Reynolds ,  Alberto Valdes Garcia

IPC分类号： H01Q1/24 ,  H01Q21/06

CPC分类号： H01Q21/061 ,  H01L2224/16225 ,  H01Q21/065 ,  H01Q23/00 ,  H04B7/04 ,  Y10T29/49016

摘要： Systems, methods, devices and apparatuses directed to transceiver devices are disclosed. In accordance with one method, a first set of antenna positions in a first section of a set of sections of a circuit layout for the circuit package is selected. The method further includes selecting another set of antenna positions in another section of the circuit layout such that an arrangement of selected antenna positions of the other set is different from an arrangement of selected antenna positions of a previously selected set of antenna positions. The selecting another set of positions in another section is iterated until selections have been made for a total number of antennas. The selecting the other set is performed such that consecutive unselected positions in the other section do not exceed a predetermined number of positions. In addition, antenna elements are formed at the selected positions to fabricate the circuit package.

摘要翻译： 公开了针对收发器设备的系统，方法，设备和设备。 根据一种方法，选择电路封装的电路布局的一组部分的第一部分中的第一组天线位置。 该方法还包括在电路布局的另一部分中选择另一组天线位置，使得另一组的所选择的天线位置的布置与先前选择的一组天线位置的选定天线位置的布置不同。 迭代在另一部分中选择另一组位置，直到对天线总数进行选择。 执行另一组的选择，使得另一部分中的连续未选定位置不超过预定数量的位置。 此外，天线元件形成在所选择的位置以制造电路封装。

公开(公告)号：US08816929B2

公开(公告)日：2014-08-26

申请号：US13191917

申请日：2011-07-27

申请人： Dong G. Kam ,  Duixian Liu ,  Scott K. Reynolds

发明人： Dong G. Kam ,  Duixian Liu ,  Scott K. Reynolds

IPC分类号： H01Q1/48 ,  H01Q1/38

CPC分类号： H01Q21/065 ,  H01Q9/0414 ,  H01Q21/0025 ,  H01Q21/064

摘要： Array packages and methods for forming large-scale antenna arrays. One method includes aligning two or more array packages. The two or more array packages each include one or more bottom dielectric layers, an array of antennas arranged in a plane above the one or more bottom dielectric layers, a ground plane layer above the one or more bottom dielectric layers, and a conductive surface on at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas. The conductive surface is electrically connected to the ground plane layer.

摘要翻译： 用于形成大型天线阵列的阵列封装和方法。 一种方法包括对准两个或更多个阵列封装。 两个或更多个阵列封装每个包括一个或多个底部电介质层，布置在一个或多个底部电介质层上方的平面中的天线阵列，一个或多个底部电介质层上方的接地平面层，以及位于 阵列封装的外表面的至少一部分并且与天线阵列的平面正交。 导电表面电连接到接地层。

公开(公告)号：US08543079B2

公开(公告)日：2013-09-24

申请号：US13589680

申请日：2012-08-20

申请人： Troy J. Beukema ,  Scott K. Reynolds

发明人： Troy J. Beukema ,  Scott K. Reynolds

IPC分类号： H04B1/28

CPC分类号： H04B1/005 ,  H03D1/229 ,  H03D3/007 ,  H03D5/00

摘要： Provision of gigabit-rate data transmission over wireless radio links, using carrier frequencies in the millimeter-wave range (>30 GHz). More specifically, a circuit for detection of amplitude-shift keyed (ASK) or other amplitude modulations (AM) which can be easily incorporated into an integrated circuit receiver system is described, making the receiver capable of supporting both complex IQ modulation schemes and simpler, non-coherent on-off or multiple-level keying signals. Several novel radio architectures are also described which, with the addition of a frequency discriminator network, have the capability of handling frequency shift keyed (FSK) or other frequency modulations (FM), as well as AM and complex IQ modulation schemes. These radio architectures support this wide variety of modulations by efficiently sharing detector hardware components. Disclosed herein are architecture for supporting both quadrature down-conversion and ASK/AM, ASK/AM detector circuit details, AM-FM detector architecture, and an AM-FM/IQ demodulator system and FSK/FM detector circuit details.

摘要翻译： 通过毫米波范围（> 30 GHz）的载波频率，通过无线无线电链路提供千兆比特数据传输。 更具体地，描述了用于检测可以容易地并入到集成电路接收机系统中的幅移键控（ASK）或其他幅度调制（AM）的电路，使得接收机能够支持复合IQ调制方案和更简单， 非相干开关或多电平键控信号。 还描述了几种新颖的无线电架构，其中通过添加鉴频器网络具有处理频移键控（FSK）或其他频率调制（FM）以及AM和复杂IQ调制方案的能力。 这些无线电架构通过有效地共享检测器硬件组件来支持这种广泛的调制。 这里公开了用于支持正交下变频和ASK / AM，ASK / AM检测器电路细节，AM-FM检测器架构以及AM-FM / IQ解调器系统和FSK / FM检测器电路细节的架构。

公开(公告)号：US20130207274A1

公开(公告)日：2013-08-15

申请号：US13396030

申请日：2012-02-14

申请人： Duixian Liu ,  Jean-Olivier Plouchart ,  Scott K. Reynolds

发明人： Duixian Liu ,  Jean-Olivier Plouchart ,  Scott K. Reynolds

IPC分类号： H01L23/48

CPC分类号： G06K19/07775 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L27/14618 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Wafer-scale packaging structures and methods are provided for integrally packaging antenna structures with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems for millimeter wave (mmWave) and Terahertz (THz) applications. For example, a chip package includes an RFIC chip, an antenna structure and an interface layer. The RFIC chip includes a semiconductor substrate having an active surface and an inactive surface, and a BEOL (back end of line) structure formed on the active surface of the semiconductor substrate. The antenna structure includes an antenna substrate and a planar antenna radiator formed on a surface of the antenna substrate, wherein the antenna substrate is formed of a low loss semiconductor material. The interface layer connects the antenna structure to the BEOL structure of the RFIC chip.

摘要翻译： 提供了用于将天线结构与半导体RFIC（射频集成电路）芯片整体封装在一起的晶片级封装结构和方法，以形成用于毫米波（mmWave）和太赫兹（THz）应用的紧凑的集成无线电/无线通信系统。 例如，芯片封装包括RFIC芯片，天线结构和接口层。 RFIC芯片包括具有活性表面和非活性表面的半导体衬底，以及形成在半导体衬底的有源表面上的BEOL（后端）结构。 天线结构包括天线基板和形成在天线基板的表面上的平面天线辐射器，其中天线基板由低损耗半导体材料形成。 接口层将天线结构连接到RFIC芯片的BEOL结构。

公开(公告)号：US20080280577A1

公开(公告)日：2008-11-13

申请号：US12177252

申请日：2008-07-22

申请人： Troy J. Beukema ,  Scott K. Reynolds

发明人： Troy J. Beukema ,  Scott K. Reynolds

IPC分类号： H04B1/18

CPC分类号： H04B1/005 ,  H03D1/229 ,  H03D3/007 ,  H03D5/00

摘要： This disclosure addresses providing gigabit-rate data transmission over wireless radio links, using carrier frequencies in the millimeter-wave range (>30 GHz). More specifically, a circuit for detection of amplitude-shift keyed (ASK) or other amplitude modulations (AM) which can be easily incorporated into an integrated circuit receiver system is described, making the receiver capable of supporting both complex IQ modulation schemes and simpler, non-coherent on-off or multiple-level keying signals. Several novel radio architectures are also described which, with the addition of a frequency discriminator network, have the capability of handling frequency shift keyed (FSK) or other frequency modulations (FM), as well as AM and complex IQ modulation schemes. These radio architectures support this wide variety of modulations by efficiently sharing detector hardware components. The architecture for supporting both quadrature down-conversion and ASK/AM is described first, followed by the ASK/AM detector circuit details, then the AM-FM detector architecture, and finally the most general AM-FM/IQ demodulator system concept and the FSK/FM detector circuit details.

摘要翻译： 本公开涉及使用毫米波范围（> 30GHz）中的载波频率，通过无线无线电链路提供千兆比特数据传输。 更具体地，描述了用于检测可以容易地并入到集成电路接收机系统中的幅移键控（ASK）或其他幅度调制（AM）的电路，使得接收机能够支持复合IQ调制方案和更简单， 非相干开关或多电平键控信号。 还描述了几种新颖的无线电架构，其中通过添加鉴频器网络具有处理频移键控（FSK）或其他频率调制（FM）以及AM和复杂IQ调制方案的能力。 这些无线电架构通过有效地共享检测器硬件组件来支持这种广泛的调制。 首先描述支持正交下变频和ASK / AM的架构，其次是ASK / AM检波器电路细节，然后是AM-FM检测器架构，最后是最通用的AM-FM / IQ解调器系统概念和 FSK / FM检测电路的细节。

公开(公告)号：US08988299B2

公开(公告)日：2015-03-24

申请号：US13029657

申请日：2011-02-17

申请人： Dong G. Kam ,  Duixian Liu ,  Scott K. Reynolds

发明人： Dong G. Kam ,  Duixian Liu ,  Scott K. Reynolds

IPC分类号： H01Q13/10 ,  H01Q19/10 ,  H01Q1/22 ,  H01Q3/30 ,  H01Q9/04 ,  H01Q9/06 ,  H01Q21/06 ,  H01L23/66 ,  H01L23/00

CPC分类号： H01Q1/2283 ,  G06K19/07775 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/1421 ,  H01L2924/15321 ,  H01Q3/30 ,  H01Q9/0407 ,  H01Q9/065 ,  H01Q21/065

摘要： A chip package includes a plurality of layers including conductive planes connected by vias. The layers include a first portion having an antenna formed therein and a parallel-plate mode suppression mechanism to suppress parallel-plate mode excitation of the antenna. The parallel-plate mode suppression mechanism includes a reflector offset from an antenna ground plane and first grounded vias. A second portion has an interface for connecting to an integrated circuit device wherein the first portion and the second portion are separated by the parallel-plate mode suppression mechanism.

摘要翻译： 芯片封装包括多个层，包括通孔连接的导电平面。 这些层包括其中形成有天线的第一部分和用于抑制天线的平行板模式激励的平行板模式抑制机构。 平行板模式抑制机构包括从天线接地平面偏移的反射器和第一接地通孔。 第二部分具有用于连接到集成电路器件的接口，其中第一部分和第二部分由平行板模式抑制机构分开。

公开(公告)号：US20130027271A1

公开(公告)日：2013-01-31

申请号：US13191917

申请日：2011-07-27

申请人： Dong G. Kam ,  Duixian Liu ,  Scott K. Reynolds

发明人： Dong G. Kam ,  Duixian Liu ,  Scott K. Reynolds

IPC分类号： H01Q21/00

CPC分类号： H01Q21/065 ,  H01Q9/0414 ,  H01Q21/0025 ,  H01Q21/064

摘要： Array packages and methods for forming large-scale antenna arrays. One method includes aligning two or more array packages. The two or more array packages each include one or more bottom dielectric layers, an array of antennas arranged in a plane above the one or more bottom dielectric layers, a ground plane layer above the one or more bottom dielectric layers, and a conductive surface on at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas. The conductive surface is electrically connected to the ground plane layer.

摘要翻译： 用于形成大型天线阵列的阵列封装和方法。 一种方法包括对准两个或更多个阵列封装。 两个或更多个阵列封装每个包括一个或多个底部电介质层，布置在一个或多个底部电介质层上方的平面中的天线阵列，一个或多个底部电介质层上方的接地平面层，以及位于 阵列封装的外表面的至少一部分并且与天线阵列的平面正交。 导电表面电连接到接地层。

公开(公告)号：US20130027244A1

公开(公告)日：2013-01-31

申请号：US13600930

申请日：2012-08-31

申请人： Aydin Babakhani ,  Duixian Liu ,  Scott K. Reynolds ,  Mihai A. Sanduleanu

发明人： Aydin Babakhani ,  Duixian Liu ,  Scott K. Reynolds ,  Mihai A. Sanduleanu

IPC分类号： G01S13/89

CPC分类号： G01S13/89 ,  H01Q1/2283 ,  H01Q7/00 ,  H01Q21/061

摘要： Systems and method for near-field millimeter wave imaging are provided, in particular, near-field millimeter wave imaging systems and methods that enable sub-wavelength resolution imaging by scanning objects with sub-wavelength probe elements and capturing and measuring phase and intensity of reflected energy to generate images.