公开(公告)号：US06429752B1

公开(公告)日：2002-08-06

申请号：US09597990

申请日：2000-06-19

申请人： Thomas Harju ,  Thomas Emanuelsson

发明人： Thomas Harju ,  Thomas Emanuelsson

IPC分类号： H01P308

CPC分类号： H01P3/081 ,  H05K1/0251 ,  H05K1/0298 ,  H05K2201/09245 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/09845

摘要： The invention relates to an electrical transmission arrangement comprising a first section of a conductor with a main extension in two planes, and a first section of a ground plane which extends essentially in parallel with the conductor section on the first side of the conductor section and has a main extension in the same two planes as the conductor section. The transmission arrangement also comprises at least one second and one third section of the said conductor, which have their main extensions in the same two planes as the first section of the conductor, the second conductor section being displaced in parallel with respect to the first conductor section, and the third conductor section being displaced in parallel with respect to the second conductor section, and at least one second and one third section of the said ground plane, which have their main extensions in the same two planes as the first section of the ground plane, the second ground plane section being displaced in parallel with respect to the first ground plane section, and the third ground plane section being displaced in parallel with respect to the second ground plane section, the said parallel displacements of conductor sections and ground plane sections being done in a direction which is at right angles to the two planes which define the main extensions of the conductor sections and ground plane sections, each conductor section being electrically connected at least to the closest of the second conductor sections, each ground plane section being electrically connected at least to the closest of the second ground plane sections on the same side of the conductor, and the conductor sections being separated from the ground plane section by a dielectric material.

摘要翻译： 本发明涉及一种电传输装置，其包括在两个平面中具有主延伸的导体的第一部分和接地平面的第一部分，其基本上平行于导体部分的第一侧上的导体部分延伸，并且具有 在与导体部分相同的两个平面中的主要延伸。 所述传输装置还包括所述导体的至少一个第二和第三部分，它们的主要延伸部分与导体的第一部分相同的两个平面中，第二导体部分相对于第一导体平行移位 并且所述第三导体部分相对于所述第二导体部分并行移位，以及所述接地平面的至少一个第二和第三部分，所述第二导体部分的主要延伸部分在与所述第二部分的第一部分相同的两个平面中 所述第二接地平面部分相对于所述第一接地平面部分平行移位，并且所述第三接地平面部分相对于所述第二接地平面部分平行移位，所述平行位移的导体部分和接地平面 部分在与限定导体的主延伸部的两个平面成直角的方向上进行 每个导体部分至少与最靠近第二导体部分的电连接，每个接地平面部分至少与导体同一侧上最靠近的第二接地平面部分电连接，以及 导体部分通过电介质材料与接地平面部分分离。

公开(公告)号：US06433650B1

公开(公告)日：2002-08-13

申请号：US09597988

申请日：2000-06-19

申请人： Thomas Harju ,  Björn Albinsson

发明人： Thomas Harju ,  Björn Albinsson

IPC分类号： H01P308

CPC分类号： H01P3/081 ,  H01P1/047 ,  H01P5/028 ,  H05K1/0251 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/09845

摘要： The invention relates to an electrical transmission arrangement comprising a first section of a conductor with a main extension in a first and a second plane, and a first section of a ground plane which extends essentially in parallel with the first conductor section on a first side thereof, at a certain first distance therefrom and has a main extension in the same two planes as the first conductor section, which first conductor section and first ground plane section together are included in a microstrip arrangement, and a second section of the same conductor, a second and a third ground plane section, where the second and third ground plane sections extend essentially in parallel with the second conductor section on a first and, respectively, second side thereof at a second and, respectively, third distance therefrom, where the second conductor section and the second and third ground plane sections are included in a strip-line arrangement, in which transmission arrangement the conductor sections are separated from adjacent ground plane sections by a dielectric medium. The first and the second conductor sections are displaced in parallel with respect to one another along a third plane and exhibit an electrical connection to one another, and the ground plane sections are displaced in parallel with respect to one another along the same plane as the displacements of the conductor sections.

摘要翻译： 本发明涉及一种电气传输装置，其包括在第一和第二平面中具有主延伸部的导体的第一部分和在第一侧面上与第一导体部分基本上平行延伸的接地平面的第一部分 在与第一导体部分相同的两个平面中具有主延伸部，第一导体部分和第一接地平面部分一起包括在微带布置中，第二部分具有相同的导体， 第二和第三接地平面部分，其中第二和第三接地平面部分在与第二导体部分基本上平行于第一和第二侧上的第二和第二侧上延伸，第二和第二侧分别与第二导体部分 截面和第二和第三接地平面段包括在带状布置中，其中传动装置的行为 或者通过电介质与相邻的接地平面部分分开。 第一和第二导体部分沿着第三平面相对于彼此平行移位并且彼此呈现电连接，并且接地平面部分沿着与位移相同的平面相对于彼此平行地移位 的导体部分。

公开(公告)号：US06348844B1

公开(公告)日：2002-02-19

申请号：US09594771

申请日：2000-06-16

申请人： Björn Albinsson ,  Thomas Harju

发明人： Björn Albinsson ,  Thomas Harju

IPC分类号： H01P508

CPC分类号： H05K1/024 ,  H01P5/08 ,  H05K1/0298 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09536 ,  H05K2201/09845

摘要： The present invention relates to an arrangement in multilayer printed circuit boards, with the aim of improving matching in transitions between symmetric striplines (3) and asymmetric striplines (4). The requirement of a coverpad (6) for contact between the via (5) and the asymmetric stripline (4) for dimension reasons among other things, results in matching problems. In order to avoid this problem, the earth plane (7, 10) nearest the transition is moved away in the proximity of the via (5).

摘要翻译： 本发明涉及多层印刷电路板中的布置，目的是改善对称带状线（3）和非对称带状线（4）之间的转换中的匹配。 由于维度上的其他原因，通孔（5）和非对称带状线（4）之间的接触的盖板（6）的要求导致匹配问题。 为了避免这个问题，最接近过渡部分的接地平面（7,10）在通孔（5）附近被移开。

公开(公告)号：US06522214B1

公开(公告)日：2003-02-18

申请号：US09597989

申请日：2000-06-19

申请人： Thomas Harju ,  Björn Albinsson

发明人： Thomas Harju ,  Björn Albinsson

IPC分类号： H01P308

CPC分类号： H01P1/047 ,  H01P3/081 ,  H01P3/088 ,  H05K1/0251 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/09845

摘要： The invention relates to an electrical transmission arrangement comprising a first strip-line conductor which has its main extension in a first direction in a first plane in the transmission arrangement and comprises a conductor, an upper ground plane which is situated at an upper distance from the conductor and a lower ground plane which is situated at a lower distance from the conductor, and a second strip-line conductor which has its main extension in a second direction in a second plane in the transmission arrangement and comprises a conductor, an upper ground plane which is situated at an upper distance from the conductor and a lower ground plane which is situated at a lower distance from the conductor, where the ground planes are separated from their respective conductors and from one another by a dielectric material, in which transmission arrangement the lower ground plane of the first strip-line conductors coincides with the upper ground plane of the second strip-line conductors at at least one point. At the point, where the lower ground plane of the first strip-line conductor coincides with the upper ground plane of the second strip-line conductor, the main direction of extension of the first strip-line conductor crosses the main direction of extension of the second strip-line conductor, and the second strip-line conductor extends in a third plane in the transmission arrangement at this crossing point, whereby the second strip-line conductors exhibit electrical connections between adjacent planes, which connections connect the conductors of the second strip-line conductor, upper ground planes and lower ground planes to corresponding components in adjacent planes.

摘要翻译： 本发明涉及一种电传输装置，其包括第一带状导体，该第一带状导体导体在传输装置的第一平面中具有在第一方向上的主延伸部，并且包括导体，位于距离 导体和位于离导体较低距离处的下接地平面，以及第二条线导体，其在主传播装置的第二平面中在第二方向上以第二方向延伸，并且包括导体，上接地平面 其位于离导体的较高距离处，以及位于离导体较低距离处的下接地平面，其中接地平面与它们各自的导体分开并且通过电介质材料彼此分离，其中传输装置 第一带状线导体的下接地平面与第二带状线导体的上接地平面重合 至少有一点。 在第一带状线导体的下接地面与第二带状线导体的上接地面重合的点处，第一带状导体的主延伸方向与第二带状导体的主要延伸方向相交， 第二条线导体，并且第二带状线导体在该交叉点处在传输装置中的第三平面中延伸，由此第二带状线导体在相邻平面之间显示电连接，该连接将第二条带 线路导体，上地平面和下接地平面相邻的平面中的相应部件。

公开(公告)号：US06417744B1

公开(公告)日：2002-07-09

申请号：US09594483

申请日：2000-06-16

申请人： Björn Albinsson ,  Thomas Harju

发明人： Björn Albinsson ,  Thomas Harju

IPC分类号： H01P508

CPC分类号： H01L23/66 ,  H01L23/64 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01P5/08 ,  H05K1/024 ,  H05K1/0298 ,  H05K1/183 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention relates to a multilayer printed circuit board arrangement which results in better matching between a stripline (9) and a microstrip (4) in a cavity (6). The solution comprises the use of an asymmetric stripline (9) where the electric field is tied primarily to the lower earth plane (10). This results in good matching at the transition to the microstrip (4), whose field is tied to the lower earth plane (10).

摘要翻译： 多层印刷电路板装置技术领域本发明涉及一种多层印刷电路板装置，其能够在空腔（6）中的带状线（9）和微带线（4）之间更好的匹配。 解决方案包括使用非对称带状线（9），其中电场主要与下地平面（10）相连。 这导致在转移到微带（4）的情况下的良好匹配，其微场被连接到下地平面（10）。

公开(公告)号：US06333856B1

公开(公告)日：2001-12-25

申请号：US09594485

申请日：2000-06-16

申请人： Thomas Harju

发明人： Thomas Harju

IPC分类号： H05K706

CPC分类号： H05K1/183 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6627 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19032 ,  H01L2924/19107 ,  H05K1/0243 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention relates to an arrangement concerned with multilayer printed circuit boards that enables cavities in said board to be utilized more effectively. A substrate (14) that includes a chip (16) which is connected to the microstrips (17) of the substrate (14) by means of bonding wires (18) is placed on a bonding shelf (13) with the chip (16) orientated towards the bottom of the cavity (6). The microstrips (17) on the substrate (14) therewith come into contact with the microstrips (12) on the bonding shelf (13). The earth plane (15) of the substrate (14) is connected to the upper earth plane (2) by means of bonding wires (19). The arrangement means that the cavity (16) is utilized effectively, at the same time as the substrate (14) protects the underlying chips (7, 16) against mechanical influences.

摘要翻译： 本发明涉及一种有助于更有效地利用所述板中的空​​腔的多层印刷电路板的布置。 包括通过接合线（18）与衬底（14）的微带（17）连接的芯片（16）的衬底（14）被放置在具有芯片（16）的接合架（13）上， 朝向空腔（6）的底部。 衬底（14）上的微带（17）与粘结搁板（13）上的微带（12）接触。 衬底（14）的接地平面（15）通过接合线（19）连接到上接地平面（2）。 该装置意味着空腔（16）被有效利用，同时衬底（14）保护下面的芯片（7,16）免受机械影响。