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    Means for increasing implantable medical device electrode surface area
    1.
    发明授权
    Means for increasing implantable medical device electrode surface area 有权
    增加植入式医疗器械电极表面积的手段

    公开(公告)号：US07191009B2

    公开(公告)日：2007-03-13

    申请号：US10914303

    申请日：2004-08-09

    申请人： Timothy G. Laske ,  Gonzalo Martinez ,  Lea A. Nygren

    发明人： Timothy G. Laske ,  Gonzalo Martinez ,  Lea A. Nygren

    IPC分类号： A61N1/00

    CPC分类号： A61N1/375 ,  A61N1/3756

    摘要： A surface area of an IMD electrode is increased by forming a conductive layer over an external portion of a sidewall of an IMD connector header and electrically coupling the conductive layer of the connector header to a conductive mounting surface of a hermetically sealed IMD housing; wherein the conductive mounting surface is an extension of an external conductive surface of the IMD, which external conductive surface forms the IMD electrode that is increased in surface area by the conductive layer formed over the connector header.

    摘要翻译： 通过在IMD连接器集管的侧壁的外部部分上形成导电层并将连接器集管的导电层电耦合到密封的IMD壳体的导电安装表面来增加IMD电极的表面积; 其中所述导电安装表面是所述IMD的外部导电表面的延伸部，所述外部导电表面形成所述IMD电极，所述IMD电极通过形成在所述连接器插头上的导电层而在表面积上增加。

    MEDICAL ELECTRODE INCLUDING AN IRIDIUM OXIDE SURFACE AND METHODS OF FABRICATION
    2.
    发明申请
    MEDICAL ELECTRODE INCLUDING AN IRIDIUM OXIDE SURFACE AND METHODS OF FABRICATION 有权
    包括氧化铝表面的医用电极和制造方法

    公开(公告)号：US20080183260A1

    公开(公告)日：2008-07-31

    申请号：US11669512

    申请日：2007-01-31

    申请人： Lea A. Nygren

    发明人： Lea A. Nygren

    IPC分类号： A61N1/05 ,  C23C14/00 ,  A61B5/042

    CPC分类号： A61N1/0565 ,  A61B5/042 ,  A61B2562/125 ,  A61N1/05 ,  A61N1/056 ,  C23C14/0036 ,  C23C14/028 ,  C23C14/08 ,  C23C14/085 ,  C23C14/35

    摘要： An implantable medical electrode includes a substrate and an iridium oxide surface, which is formed by an iridium oxide film applied over a roughened surface of the substrate. The film is preferably applied via direct current magnetron sputtering in a sputtering atmosphere comprising argon and oxygen. A sputtering target power may be between approximately 80 watts and approximately 300 watts, and a total sputtering pressure may be between approximately 9 millitorr and approximately 20 millitorr. The iridium oxide film may have a thickness greater than or equal to approximately 15,000 angstroms and have a microstructure exhibiting a columnar growth pattern.

    摘要翻译： 可植入医疗电极包括基材和氧化铱表面，其由施加在基材的粗糙化表面上的氧化铱膜形成。 该膜优选通过直流磁控溅射在包含氩和氧的溅射气氛中进行。 溅射靶功率可以在约80瓦特和约300瓦特之间，并且总溅射压力可以在约9毫托和约20毫托之间。 氧化铱膜可以具有大于或等于约15,000埃的厚度，并且具有显示柱状生长图案的微结构。

    COMPACT CONNECTOR ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE
    4.
    发明申请
    COMPACT CONNECTOR ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE 有权
    用于可植入医疗设备的紧凑型连接器组件

    公开(公告)号：US20130070423A1

    公开(公告)日：2013-03-21

    申请号：US13239037

    申请日：2011-09-21

    申请人： Rajesh V. Iyer ,  Michael G. Marinkov ,  Lea A. Nygren ,  Jeffrey J. Clayton ,  James Strom ,  Thomas E. Meyer ,  Steven T. Deininger ,  Wayne R. Kuechenmeister

    发明人： Rajesh V. Iyer ,  Michael G. Marinkov ,  Lea A. Nygren ,  Jeffrey J. Clayton ,  James Strom ,  Thomas E. Meyer ,  Steven T. Deininger ,  Wayne R. Kuechenmeister

    IPC分类号： H05K7/00 ,  H01R43/02

    CPC分类号： A61N1/3754 ,  H01R24/68 ,  H01R43/20 ,  H01R2107/00

    摘要： A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees.

    摘要翻译： 用于可植入医疗装置的连接器组件包括安装在导电阵列板中的多个馈通，多个馈通中的每个馈通包括通过绝缘体与导电阵列板电绝缘的馈通引脚，以及包括多个 导电条设置在非导电块中。 多个导电条以小于135度的角度与馈通销物理和电接触。 连接器组件还包括至少一个电路，该电路包括对应于多个馈通的多个导体。 电路的多个导体以小于135度的角度物理和电接触电子模块组件的多个导电条中的相应导电条之一。

    Method for fabrication of low-polarization implantable stimulation electrode
    6.
    发明授权
    Method for fabrication of low-polarization implantable stimulation electrode 有权
    低极化可植入刺激电极的制造方法

    公开(公告)号：US08155754B2

    公开(公告)日：2012-04-10

    申请号：US11042649

    申请日：2005-01-25

    申请人： Lea A. Nygren ,  James A. Coles, Jr. ,  Scott J. Brabec ,  Randy G. Rose

    发明人： Lea A. Nygren ,  James A. Coles, Jr. ,  Scott J. Brabec ,  Randy G. Rose

    IPC分类号： A61N1/04

    CPC分类号： A61N1/05 ,  C23C28/32 ,  Y10T29/49204

    摘要： A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.

    摘要翻译： 一种用于制造可植入医疗电极的方法包括使电极基板粗糙化，施加粘合层，以及在优化以最小化电极阻抗和脉冲后极化的条件下，在粘附层上沉积阀金属氧化物涂层。 电极基板可以是各种电极金属或包括钛，铂，铂 - 铱或铌的合金。 粘合层可以由钛或锆形成。 阀金属氧化物涂层是在受控目标功率，溅射压力和溅射气体比设置下溅射到粘附层上的氧化钌涂层，其被优化以最小化电极阻抗和后脉冲极化。

    Compact connector assembly for implantable medical device
    7.
    发明授权
    Compact connector assembly for implantable medical device 有权
    用于可植入医疗器械的紧凑型连接器组件

    公开(公告)号：US08593816B2

    公开(公告)日：2013-11-26

    申请号：US13239037

    申请日：2011-09-21

    申请人： Rajesh V. Iyer ,  Michael G. Marinkov ,  Lea A. Nygren ,  Jeffrey J. Clayton ,  James Strom ,  Thomas E. Meyer ,  Steven T. Deininger ,  Wayne R. Kuechenmeister

    发明人： Rajesh V. Iyer ,  Michael G. Marinkov ,  Lea A. Nygren ,  Jeffrey J. Clayton ,  James Strom ,  Thomas E. Meyer ,  Steven T. Deininger ,  Wayne R. Kuechenmeister

    IPC分类号： H05K7/00 ,  A61N1/00

    CPC分类号： A61N1/3754 ,  H01R24/68 ,  H01R43/20 ,  H01R2107/00

    摘要： A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees.

    摘要翻译： 用于可植入医疗装置的连接器组件包括安装在导电阵列板中的多个馈通，多个馈通中的每个馈通包括通过绝缘体与导电阵列板电绝缘的馈通引脚，以及包括多个 导电条设置在非导电块中。 多个导电条以小于135度的角度与馈通销物理和电接触。 连接器组件还包括至少一个电路，该电路包括对应于多个馈通的多个导体。 电路的多个导体以小于135度的角度物理和电接触电子模块组件的多个导电条中的相应导电条之一。

    CERAMIC COMPONENTS FOR BRAZED FEEDTHROUGHS USED IN IMPLANTABLE MEDICAL DEVICES
    10.
    发明申请
    CERAMIC COMPONENTS FOR BRAZED FEEDTHROUGHS USED IN IMPLANTABLE MEDICAL DEVICES 审中-公开
    用于可植入医疗器械的烧烤饲料的陶瓷组件

    公开(公告)号：US20110106205A1

    公开(公告)日：2011-05-05

    申请号：US12764140

    申请日：2010-04-21

    申请人： Markus W. Reiterer ,  Andrew J. Thom ,  Lea A. Nygren ,  William D. Wolf

    发明人： Markus W. Reiterer ,  Andrew J. Thom ,  Lea A. Nygren ,  William D. Wolf

    IPC分类号： A61N1/375 ,  H02G3/18

    CPC分类号： H01G4/35 ,  A61N1/3754

    摘要： A feedthrough assembly, as well as a method of forming a feedthrough assembly, including a metallic ferrule, and a biocompatible, non-conductive, high-temperature, co-fired insulator engaged with the metallic ferrule at an interface between the ferrule and the insulator. The insulator includes a first surface at the interface and a second surface internal to the insulator. At least one conductive member may be disposed at the second surface, wherein at least the first surface of the insulator is devoid of surface cracks greater than 30 μm. The first surface of the insulator may also be devoid of a surface roughness greater than 0.5 μm.

    摘要翻译： 馈通组件以及形成馈通组件的方法，该馈通组件包括金属套圈以及在金属套圈和绝缘体之间的界面处与金属套圈接合的生物相容，非导电，高温共烧绝缘体 。 绝缘体包括界面处的第一表面和绝缘体内部的第二表面。 至少一个导电构件可以设置在第二表面处，其中绝缘体的至少第一表面没有大于30μm的表面裂纹。 绝缘体的第一表面也可以没有大于0.5μm的表面粗糙度。