Two-stage valve suitable as high-flow high-pressure microvalve
    2.
    发明授权
    Two-stage valve suitable as high-flow high-pressure microvalve 失效
    两级阀适用于高流量高压微型阀

    公开(公告)号:US06830229B2

    公开(公告)日:2004-12-14

    申请号:US10376150

    申请日:2003-02-28

    IPC分类号: F16K3112

    摘要: A two-stage valve for controlling the flow of fluid from a pressurized fluid supply with an upper main body including a cavity with a contoured inner surface; a lower main body with at least one flow exhaust passage forming a primary flow path through the two-stage valve; a pre-stressed diaphragm sandwiched between the upper and lower main bodies, and pressure control capability for controlling the pressure in the cavity. A first valve opens and closes the flow of gas from the pressurized gas supply to the cavity. A second valve allows the pressure in the cavity to exhaust to the environment. Raising and lowering of the pressure in the cavity causes the pre-stressed diaphragm to open and close the flow of gas from the pressurized gas supply through the primary flow path of the two-stage valve. The design is suitable as a microvalve using Micro-Electro-Mechanical Systems (MEMS) concepts.

    摘要翻译: 一种用于控制来自加压流体供应源的流体流动的两级阀,其中上部主体包括具有轮廓内表面的空腔; 具有形成通过所述两级阀的主流路的至少一个流动排气通道的下主体; 夹在上下主体之间的预应力隔膜和用于控制空腔中的压力的​​压力控制能力。 第一阀打开并关闭气体从加压气体供给到空腔的流动。 第二个阀允许空腔中的压力排放到环境中。 升高和降低空腔中的压力导致预应力隔膜打开和关闭来自加压气体供应通过两级阀的主流路的气体流。 该设计适用于使用微机电系统(MEMS)概念的微型阀。

    METHOD AND SYSTEM FOR GAS TEMPERATURE MEASUREMENT
    6.
    发明申请
    METHOD AND SYSTEM FOR GAS TEMPERATURE MEASUREMENT 有权
    气温测量方法与系统

    公开(公告)号:US20140033737A1

    公开(公告)日:2014-02-06

    申请号:US13563024

    申请日:2012-07-31

    IPC分类号: G01J5/00 F02C7/00

    摘要: A temperature measurement system includes at least one filament configured to emit thermal radiation in a relatively broad and substantially continuous wavelength band that is at least partially representative of a temperature of the at least one filament. The system also includes an optical system configured to receive at least a portion of the thermal radiation emitted from the filament. The optical system includes a wavelength splitting device configured to split the emitted thermal radiation into at least one relatively narrow wavelength band of thermal radiation. The optical system also includes a detector array configured to receive the at least one relatively narrow wavelength band of thermal radiation and to generate electrical signals at least partially representative of the received thermal radiation. The temperature measurement system further includes a controller communicatively coupled to the detector array. The controller is configured to transform the generated electrical signals to a temperature indication using a predetermined conversion module.

    摘要翻译: 温度测量系统包括至少一根被配置成在相对宽且基本上连续的波长带中发射热辐射的灯丝,其至少部分代表至少一根灯丝的温度。 该系统还包括被配置为接收从灯丝发射的热辐射的至少一部分的光学系统。 光学系统包括波长分离装置,其被配置为将发射的热辐射分裂成至少一个相对较窄的热辐射波长带。 光学系统还包括被配置为接收至少一个相对较窄的热辐射波段的检测器阵列,并且产生至少部分地表示所接受的热辐射的电信号。 温度测量系统还包括通信地耦合到检测器阵列的控制器。 控制器被配置为使用预定的转换模块将生成的电信号转换成温度指示。

    Unique cooling scheme for advanced thermal management of high flux electronics
    8.
    发明申请
    Unique cooling scheme for advanced thermal management of high flux electronics 有权
    独特的冷却方案,用于高通量电子器件的先进热管理

    公开(公告)号:US20080156462A1

    公开(公告)日:2008-07-03

    申请号:US11649173

    申请日:2007-01-03

    IPC分类号: F28F7/00

    摘要: Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.

    摘要翻译: 公开了一种用于冷却电子封装的系统。 该系统包括流体泵和微冷却器组件。 该系统利用在电子封装中散布有电子层的一个或多个冷却层。 每个冷却层具有形成在衬底中的冷却通道阵列,通过冷却通道阵列提供冷却流体的输入歧管,以及从冷却通道阵列收集流体的输出歧管。 冷却系统的元件通过导管集成,导管包括用于将流体从流体泵通到电子封装的封装导管,用于将流体从电子封装件通至微型冷却器组件的冷却器导管,以及用于通过 从微冷却器组件到流体泵的流体。 还公开了一种用于冷却电子封装的方法。

    Cooling Systems Employing Fluidic Jets, Methods for Their Use and Methods for Cooling
    9.
    发明申请
    Cooling Systems Employing Fluidic Jets, Methods for Their Use and Methods for Cooling 有权
    使用流体喷射的冷却系统,使用方法和冷却方法

    公开(公告)号:US20080041574A1

    公开(公告)日:2008-02-21

    申请号:US11464563

    申请日:2006-08-15

    IPC分类号: H05K7/20

    摘要: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.

    摘要翻译: 在一个实施例中,公开了一种冷却系统。 冷却系统包括:用于接收冷却介质的冷却通道,设置在冷却通道附近的基板以及设置在基板内并与冷却通道流体连通的流体射流。 冷却通道用于与要冷却的部件进行热连通。 冷却通道的高度小于或等于约3mm,宽度小于或等于2mm。 流体射流包括由阱和膜限定的空腔。 在一个实施例中,冷却电气部件的方法包括:使冷却介质通过冷却通道,将冷却介质拉入一个或多个流体喷射器中,将冷却介质从一个或多个流体喷射器排出到冷却通道 并且从电气部件去除热能。