公开(公告)号：US06537853B1

公开(公告)日：2003-03-25

申请号：US09652076

申请日：2000-08-31

申请人： Mark S. Johnson ,  Todd O. Bolken

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： H01L2148

CPC分类号： H01L21/56 ,  H01L21/565 ,  H01L21/67126 ,  H01L23/293 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.

摘要翻译： 一种封装具有第一和第二表面的制品的方法，包括将制品定位在载体上，使得第一表面的至少一部分接触载体。 承载制品的载体的一部分然后定位在模具内，并且在模具和载体之间形成密封件。 然后用密封材料填充模具以在物品和载体之间形成密封。

公开(公告)号：US06417018B1

公开(公告)日：2002-07-09

申请号：US09724470

申请日：2000-11-28

申请人： Todd O. Bolken ,  Mark S. Johnson

发明人： Todd O. Bolken ,  Mark S. Johnson

IPC分类号： H01L2100

CPC分类号： H01L23/293 ,  H01L21/56 ,  H01L21/565 ,  H01L21/67126 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a method of encapsulating a plurality of chip and board pre-assemblies. Each pre-assembly has first and second surfaces. The method includes positioning a first mold half in a sealing relationship with each first surface of the pre-assemblies and positioning a second mold half adjacent each second surface of the pre-assemblies. The first mold half is filled first thereby forcing each second surface of the pre-assemblies into a sealing engagement with the second mold half. The second molding section is then filled, to result in an asymmetrically overmolded chip and board assembly.

摘要翻译： 本发明涉及封装多个芯片和板预组件的方法。 每个预组件都有第一和第二表面。 该方法包括将与预组件的每个第一表面密封关系的第一半模定位，并将邻近预组件的每个第二表面的第二半模定位。 首先填充第一半模，从而迫使预组件的每个第二表面与第二半模密封接合。 然后填充第二模制部分，以产生不对称的包覆模制的芯片和板组件。

公开(公告)号：US06294825B1

公开(公告)日：2001-09-25

申请号：US09385981

申请日：1999-08-30

申请人： Todd O. Bolken ,  Mark S. Johnson

发明人： Todd O. Bolken ,  Mark S. Johnson

IPC分类号： H01L2144

CPC分类号： H01L23/293 ,  H01L21/56 ,  H01L21/565 ,  H01L21/67126 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a method and system of encapsulating a plurality of chip and board pre-assemblies. Each pre-assembly has first and second surfaces. The method includes positioning a first mold half in a sealing relationship with each first surface of the pre-assemblies and positioning a second mold half adjacent each second surface of the pre-assemblies. The first mold half is filled first thereby forceing each second surface of the pre-assemblies into a sealing engagement with the second mold half. The second molding section is then filled, to result in an asymmetrically overmolded chip and board assembly.

摘要翻译： 本发明涉及封装多个芯片和板预组件的方法和系统。 每个预组件都有第一和第二表面。 该方法包括将与预组件的每个第一表面密封关系的第一半模定位，并将邻近预组件的每个第二表面的第二半模定位。 首先填充第一半模，从而迫使预组件的每个第二表面与第二半模密封接合。 然后填充第二模制部分，以产生不对称的包覆模制的芯片和板组件。

公开(公告)号：US07655508B2

公开(公告)日：2010-02-02

申请号：US10894675

申请日：2004-07-20

申请人： Mark S. Johnson ,  Todd O. Bolken

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： H01L21/00

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14672 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.

摘要翻译： 一种封装具有第一和第二表面的制品的方法，包括将制品定位在载体上，使得第一表面的至少一部分接触载体。 承载制品的载体的一部分然后定位在模具内，并且在模具和载体之间形成密封件。 然后用密封材料填充模具以在物品和载体之间形成密封。

公开(公告)号：US06951981B2

公开(公告)日：2005-10-04

申请号：US10321977

申请日：2002-12-17

申请人： Mark S. Johnson ,  Todd O. Bolken

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14672 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

摘要翻译： 封装具有第一和第二表面的制品的方法包括将与制品的第一表面形成密封关系的第一模制部分定位并且将第二模制部分定位成邻近制品的第二表面。 首先填充第一模制部分，从而迫使制品的第二表面与第二模制部分密封接合。 然后填充第二模制部分。

公开(公告)号：US6143581A

公开(公告)日：2000-11-07

申请号：US255554

申请日：1999-02-22

申请人： Mark S. Johnson ,  Todd O. Bolken

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  B29C2045/14672 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239

摘要： A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

公开(公告)号：US5925384A

公开(公告)日：1999-07-20

申请号：US845603

申请日：1997-04-25

申请人： Todd O. Bolken ,  Mark S. Johnson

发明人： Todd O. Bolken ,  Mark S. Johnson

IPC分类号： B29C31/06 ,  B29C45/18 ,  B29C31/04 ,  B29C45/02

CPC分类号： B29C31/066 ,  B29C45/1808 ,  B29C45/02 ,  B29C45/14655

摘要： A manual loader for use in bypassing an automatic pellet feeder for an automold machine used to encapsulate integrated circuit assemblies in plastic. The loader has a support mounted adjacent the mold section of the machine. The loader also has at least one pellet boat which moves relative to the support into and out of said mold section. The pellet boat includes one or more pellet pots which are adapted to receive and hold a solid pellet of material. The loader has a release mechanism which is movable between a blocking position and a release position. The release mechanism retains the pellets in the pellet pots in the blocking position and releases the pellets from the pots when manipulated to the release position for dropping the pellets into a mold of the machine's mold section.

公开(公告)号：US06605331B1

公开(公告)日：2003-08-12

申请号：US09388045

申请日：1999-09-01

申请人： Mark S. Johnson ,  Todd O. Bolken

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： B32B302

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14672 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

公开(公告)号：US6033614A

公开(公告)日：2000-03-07

申请号：US138924

申请日：1998-08-24

申请人： Todd O. Bolken ,  Mark S. Johnson

发明人： Todd O. Bolken ,  Mark S. Johnson

IPC分类号： B29C31/06 ,  B29C45/18 ,  B29C31/00

CPC分类号： B29C31/066 ,  B29C45/1808 ,  B29C45/02 ,  B29C45/14655

摘要： A manual loader for use in bypassing an automatic pellet feeder for an automold machine used to encapsulate integrated circuit assemblies in plastic. The loader has a support mounted adjacent the mold section of the machine. The loader also has at least one pellet boat which moves relative to the support into and out of said mold section. The pellet boat includes one or more pellet pots which are adapted to receive and hold a solid pellet of material. The loader has a release mechanism which is movable between a blocking position and a release position. The release mechanism retains the pellets in the pellet pots in the blocking position and releases the pellets from the pots when manipulated to the release position for dropping the pellets into a mold of the machine's mold section.

摘要翻译： 一种手动装载机，用于绕过用于将集成电路组件封装在塑料中的汽车机器的自动颗粒供料器。 装载机具有邻近机器的模具部分安装的支撑件。 装载机还具有至少一个小球舟，其相对于支撑件移动进入和离开所述模具部分。 颗粒舟包括一个或多个适于容纳和保持固体颗粒的颗粒的颗粒罐。 装载机具有可在阻挡位置和释放位置之间移动的释放机构。 释放机构将颗粒保持在处于阻塞位置的颗粒罐中，并且当操作到释放位置时将颗粒从罐中释放，以将颗粒落入机器的模具部分的模具中。

公开(公告)号：US07296346B2

公开(公告)日：2007-11-20

申请号：US11492650

申请日：2006-07-25

申请人： Mark S. Johnson

发明人： Mark S. Johnson

IPC分类号： H05K3/02

CPC分类号： H05K3/242 ,  H05K3/0052 ,  H05K2201/09263 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing and equipment alignment problems. The serpentine plating buss design therefore increases board yield.

摘要翻译： 本发明一般涉及一种用于最小化PCB面板单片化中的短路问题的电镀总线设计和方法。 更具体地，本发明包括蛇形电镀母线，其增加了PCB分割工艺窗口，从而由于由于偶然的制造和设备对准问题引起的分度误差而使短路问题最小化。 蛇形电镀母线设计因此增加了板材的产量。