利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

50 条记录 (耗时 0.017 秒)

    Plating buss and a method of use thereof
    1.
    发明授权
    Plating buss and a method of use thereof 有权
    电镀母线及其使用方法

    公开(公告)号：US07296346B2

    公开(公告)日：2007-11-20

    申请号：US11492650

    申请日：2006-07-25

    申请人： Mark S. Johnson

    发明人： Mark S. Johnson

    IPC分类号： H05K3/02

    CPC分类号： H05K3/242 ,  H05K3/0052 ,  H05K2201/09263 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing and equipment alignment problems. The serpentine plating buss design therefore increases board yield.

    摘要翻译： 本发明一般涉及一种用于最小化PCB面板单片化中的短路问题的电镀总线设计和方法。 更具体地，本发明包括蛇形电镀母线，其增加了PCB分割工艺窗口，从而由于由于偶然的制造和设备对准问题引起的分度误差而使短路问题最小化。 蛇形电镀母线设计因此增加了板材的产量。

    "> Method of forming an-before
    6.
    发明授权
    Method of forming an-before "immured" 失效
    形成未成年人基础的方法

    公开(公告)号：US4999966A

    公开(公告)日：1991-03-19

    申请号：US310379

    申请日：1989-02-15

    申请人： Mark S. Johnson ,  Gordon T. French, Jr.

    发明人： Mark S. Johnson ,  Gordon T. French, Jr.

    IPC分类号： E02D27/42 ,  E04H12/22

    CPC分类号： E02D27/42 ,  E04H12/22

    摘要： A foundation for supporting poles, particularly electrical power cable support poles, is formed by boring a hole only slightly larger than the pole base onto the earth a desired depth. A reinforcing structure is lowered into the hole. The reinforcing structure usually rests on the bottom of the hole and extends above the earth surface a number of feet. The hole is then filled with concrete, usually up to the earth surface, and allowed to cure. A lowermost or base section of the pole is then lowered into position about an exposed upper portion of the reinforcing structure. Concrete is placed into the interior of the pole section about the reinforcing structure until it is covered. After the concrete cures, any remaining pole sections may be installed onto the base section.

    摘要翻译： 用于支撑杆，特别是电力电缆支撑杆的基础是通过将仅仅稍微大于极基座的孔钻到地球上形成所需的深度而形成。 加强结构下降到孔中。 加固结构通常位于孔的底部，并在地表面上延伸数英尺。 然后，孔中充满混凝土，通常直到地表，并允许固化。 然后，极的最下部或底部部分围绕加强结构的暴露的上部部分下降到位置。 将混凝土放置在围绕加强结构的极部分的内部，直到其被覆盖。 在混凝土固化后，任何剩余的极板部分可以安装在基部上。

    CONDUCTIVE STRUCTURES FOR MICROFEATURE DEVICES AND METHODS FOR FABRICATING MICROFEATURE DEVICES
    9.
    发明申请
    CONDUCTIVE STRUCTURES FOR MICROFEATURE DEVICES AND METHODS FOR FABRICATING MICROFEATURE DEVICES 有权
    用于微型装置的导电结构和用于制造微型装置的方法

    公开(公告)号：US20120302054A1

    公开(公告)日：2012-11-29

    申请号：US13538891

    申请日：2012-06-29

    申请人： Mark S. Johnson

    发明人： Mark S. Johnson

    IPC分类号： H01L21/768

    CPC分类号： H05K3/428 ,  H01L21/4857 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H05K1/0287 ,  H05K3/108 ,  H05K2201/09609 ,  H05K2201/10378

    摘要： Methods for fabricating conductive structures on and/or in interposing devices and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method for fabricating interposer devices having substrates includes forming a plurality of conductive sections on a first substrate in a first pattern. The method continues by forming a plurality of conductive sections on a second substrate in a second pattern. The method further includes constructing a plurality of conductive lines in a common third pattern on both the first substrate and the second substrate. The conductive lines can be formed on the first and second substrates either before or after forming the first pattern of conductive sections on the first substrate and/or forming the second pattern of conductive sections on the second substrate.

    摘要翻译： 在此公开了使用这种方法形成的在和/或介入装置和微特征装置之间的导电结构的制造方法。 在一个实施例中，一种用于制造具有衬底的插入器器件的方法包括以第一图案在第一衬底上形成多个导电部分。 该方法通过在第二图案的第二基板上形成多个导电部分来继续。 该方法还包括在第一基板和第二基板上在公共第三图案中构造多条导线。 导电线可以在形成第一衬底上的第一导电部分图案之前或之后形成在第一衬底和第二衬底上，和/或在第二衬底上形成导电部分的第二图案。