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    PLANOGRAPHIC PRINTING PLATE PRECURSOR AND STACK THEREOF
    4.
    发明申请
    PLANOGRAPHIC PRINTING PLATE PRECURSOR AND STACK THEREOF 有权
    平面印刷机前置放映机及其堆叠

    公开(公告)号：US20080113296A1

    公开(公告)日：2008-05-15

    申请号：US11934537

    申请日：2007-11-02

    申请人： Hisao Yamamoto ,  Akihiro Endo

    发明人： Hisao Yamamoto ,  Akihiro Endo

    IPC分类号： G11B7/24

    CPC分类号： G03F7/092 ,  B41C1/1016 ,  B41C2201/02 ,  B41C2201/06 ,  B41C2201/10 ,  B41C2201/12 ,  B41C2201/14 ,  B41C2210/04 ,  B41C2210/06 ,  B41C2210/22 ,  B41C2210/24 ,  B41C2210/262

    摘要： The invention provides a planographic printing plate precursor that is writable by laser exposure and is composed of a support, a photosensitive recording layer formed on the support, and a backcoat layer containing an epoxy resin, the backcoat layer being formed on the side of the support opposite to the photosensitive recording layer side; and a stack of the planographic printing plate precursors. According to the invention, scratches on the photosensitive recording side of the planographic printing plate precursor can be prevented when brought into contact with another planographic printing plate precursor in the stack without interleaving slip sheets, and productivity in a plate making process can be improved.

    摘要翻译： 本发明提供一种通过激光曝光可写入的平版印刷版原版，由载体，形成在载体上的感光记录层和含有环氧树脂的背涂层组成，背涂层形成在载体侧 与感光记录层侧相对; 和一系列平版印刷版前体。 根据本发明，当与叠片中的其它平版印刷版前体接触而不会交错滑片时，可以防止平版印刷版原版的感光记录面上的划痕，并且可以提高制版过程中的生产率。

    Heat conductive silicone grease composition and cured product thereof
    6.
    发明申请
    Heat conductive silicone grease composition and cured product thereof 审中-公开
    导热硅脂组合物及其固化产物

    公开(公告)号：US20070042533A1

    公开(公告)日：2007-02-22

    申请号：US11505435

    申请日：2006-08-17

    申请人： Akihiro Endo ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Kei Miyoshi

    发明人： Akihiro Endo ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Kei Miyoshi

    IPC分类号： H01L21/00 ,  C08L83/04 ,  B32B9/04

    CPC分类号： H01L23/3737 ,  C10M169/04 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/053 ,  C10M2201/061 ,  C10M2229/041 ,  C10M2229/0415 ,  C10M2229/044 ,  C10M2229/046 ,  C10N2210/01 ,  C10N2210/03 ,  C10N2210/07 ,  C10N2210/08 ,  C10N2220/082 ,  C10N2230/02 ,  H01L2224/32245 ,  Y10T428/31663

    摘要： Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 μm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.

    摘要翻译： 本发明提供一种导热性硅氧烷润滑脂组合物，其包含（A）100质量份在每个分子内含有2个以上与硅原子键合的烯基的有机聚硅氧烷，（B）含有2个以上与各原子中的硅原子键合的氢原子的有机氢聚硅氧烷 分子，提供组分（A），（C）中每个链烯基组分（B）内与硅原子键合的0.1至5.0个氢原子，100至2200质量份的导热填料（ D）有效量的铂系催化剂和（E）有效量的加成反应缓凝剂，其中组分（C）包含大于90质量％且不大于100质量％的铟 平均粒径为0.1〜100μm的粉末。 还提供了通过在等于或大于铟粉末的熔点的温度下加热固化上述组合物而获得的导热硅酮固化产物。 还提供了一种电子设备，包括电子部件，散热构件和导热构件，其包括设置在电子部件和散热构件之间的上述固化物。 还提供了固化上述组合物的方法。 进一步提供一种在电子部件和散热部件之间形成导热部件的方法。 上述导热硅脂组合物产生具有优异导热性的合适薄的固化产物，其防止诸如涂层组分之外的组分的污染等问题，以及如果长时间使用则油品从产品中泄漏。