利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

24 条记录 (耗时 0.033 秒)

    Photosensitive insulating paste and thick film multi-layer circuit substrate
    4.
    发明授权
    Photosensitive insulating paste and thick film multi-layer circuit substrate 有权
    感光绝缘膏和厚膜多层电路基板

    公开(公告)号：US06403694B1

    公开(公告)日：2002-06-11

    申请号：US09496159

    申请日：2000-02-01

    申请人： Makoto Tose ,  Hiromichi Kawakami ,  Shizuharu Watanabe

    发明人： Makoto Tose ,  Hiromichi Kawakami ,  Shizuharu Watanabe

    IPC分类号： C08K334

    CPC分类号： C03C8/14 ,  C03C8/16 ,  G03F7/0047 ,  H05K1/0306 ,  H05K3/0023 ,  H05K3/4667 ,  Y10T428/24926 ,  Y10T428/252 ,  Y10T428/259

    摘要： A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO2 powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO2 component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.

    摘要翻译： 感光绝缘膏含有硼硅酸盐玻璃粉末和结晶SiO 2粉末，其中粉末分散在光敏有机载体中，糊状物含有约3-40重量％的结晶SiO 2组分。 ％烧结后。 包括绝缘基板的厚膜多层电路基板（例如，芯片电感器），其上形成有绝缘层，其中在施加感光绝缘膏之后，通过曝光，显影和烧结形成绝缘层。

    Dielectric paste and thick-film capacitor using same
    5.
    发明授权
    Dielectric paste and thick-film capacitor using same 失效

    公开(公告)号：US5814571A

    公开(公告)日：1998-09-29

    申请号：US638951

    申请日：1996-04-24

    申请人： Hiromichi Kawakami ,  Hiroji Tani

    发明人： Hiromichi Kawakami ,  Hiroji Tani

    IPC分类号： C04B35/00 ,  C03C3/108 ,  C03C8/10 ,  C03C8/14 ,  C03C8/16 ,  H01B3/02 ,  H01G4/08 ,  H01G4/12 ,  H01G4/33

    CPC分类号： C03C8/16 ,  C03C8/10 ,  C03C8/14 ,  H01G4/1218

    摘要： A dielectric paste used for fabrication of a capacitor which permits manufacture of a small-sized ceramic oscillator by being incorporated in the oscillator. The dielectric paste comprises powdered glass, dielectric powder, and an organic vehicle. The dielectric powder is a lead-based perovskite compound. The powdered glass includes a main component given by xSiO.sub.2 --yB.sub.2 O.sub.3 --zPbO (where x, y, and z are expressed in mole percent). The x, y, and z lie within a region defined by connecting points A (x=70, y=0, and z=30), B (x=70, y=15, and z=15), C (x=10, y=75, and z=15), and D (x=10, y=0, and z=90). Preferably, at least one member selected from the group consisting of Al.sub.2 O.sub.3, CaO, TiO.sub.2, ZrO.sub.2, BaO and MgO is used as an additive. Preferably, glass frit accounts for about 35-95% by weight of the mixture of the powdered glass and the dielectric powder, and the dielectric powder accounts for about 5-65% by weight.

    Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit board
    8.
    发明授权
    Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit board 有权
    晶体玻璃组合物用于电路板，烧结晶体玻璃，绝缘体组合物绝缘膏和厚膜电路板

    公开(公告)号：US06270880B1

    公开(公告)日：2001-08-07

    申请号：US09418926

    申请日：1999-10-15

    申请人： Hiromichi Kawakami ,  Hirofumi Sunahara ,  Toshiki Tanaka ,  Shizuharu Watanabe ,  Hiroshi Takagi

    发明人： Hiromichi Kawakami ,  Hirofumi Sunahara ,  Toshiki Tanaka ,  Shizuharu Watanabe ,  Hiroshi Takagi

    IPC分类号： B32B300

    CPC分类号： C03C10/0009 ,  H01L23/15 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  Y10T428/24926 ,  H01L2924/00

    摘要： Provided is a crystalline glass composition for use in a circuit board that can be sintered at a temperature of 1100° C. and is endowed with favorable characteristics such as a relative dielectric constant of as low as ½ and a thermal expansion coefficient of as high as 12 ppm/° C. as an electrical insulating insulator for use in a circuit board. The crystalline glass composition contains SiO2, MgO and CaO, the composition ratio of SiO2, MgO and CaO in % by weight falling within an area surrounded by the lines connecting the points A (25, 45, 30), B (25, 0, 75), C (44, 0, 56), D (44, 22, 34), E (40, 19, 41) and F (29, 40, 31) in a ternary phase diagram wherein at least one melwinite, monticellite or calcium silicate crystalline phase is deposited by heat-treating the composition. A ceramic powder having a thermal expansion coefficient of about 6.0 ppm/C or more is sometimes added in the powder comprising the glass composition.

    摘要翻译： 本发明提供一种用于电路板的结晶玻璃组合物，其可以在1100℃的温度下烧结并具有良好的特性，例如相对介电常数低至1/2，热膨胀系数高达 12ppm /℃作为用于电路板的电绝缘绝缘体。 结晶玻璃组合物含有SiO 2，MgO和CaO，SiO 2，MgO和CaO的组成比以重量百分比落入由连接点A（25,45,30），B（25,0， 75），C（44，0，56），D（44,22,34），E（40,19,41）和F（29,40,31），其中至少一种黄铁矿， 或通过热处理该组合物沉积硅酸钙结晶相。 有时在包含玻璃组合物的粉末中加入热膨胀系数约为6.0ppm /℃以上的陶瓷粉末。

    Dielectric paste and thick-film capacitor using same
    9.
    发明授权
    Dielectric paste and thick-film capacitor using same 失效
    电介质浆料和厚膜电容器使用相同

    公开(公告)号：US6007900A

    公开(公告)日：1999-12-28

    申请号：US3478

    申请日：1998-01-06

    申请人： Hiromichi Kawakami ,  Hiroji Tani

    发明人： Hiromichi Kawakami ,  Hiroji Tani

    IPC分类号： C03C8/14 ,  H01G4/12 ,  B32B9/00 ,  H01G4/06

    CPC分类号： C03C8/14 ,  H01G4/1218 ,  Y10T428/24926

    摘要： A dielectric paste used for fabrication of a capacitor which permits manufacture of a small-sized ceramic oscillator by being incorporated in the oscillator. The dielectric paste comprises powdered glass, dielectric powder, and an organic vehicle. The dielectric powder is a lead-based perovskite compound. The powdered glass includes a main component given by xSiO.sub.2 --yB.sub.2 O.sub.3 --zPbO (where x, y, and z are expressed in mole percent). The x, y, and z lie within a region defined by connecting points A (x=70, y=0, and z=30), B (x=70, y=15, and z=15), C (x=10, y=75, and z=15), and D (x=10, y=0, and z=90). Preferably, at least one member selected from the group consisting of Al.sub.2 O.sub.3, CaO, TiO.sub.2, ZrO.sub.2, BaO and MgO is used as an additive. Preferably, glass frit accounts for about 35-95% by weight of the mixture of the powdered glass and the dielectric powder, and the dielectric powder accounts for about 5-65% by weight.

    摘要翻译： 用于制造电容器的电介质浆料，其允许通过结合在振荡器中制造小型陶瓷振荡器。 电介质浆料包括粉末状玻璃，电介质粉末和有机载体。 电介质粉末是铅基钙钛矿化合物。 粉末玻璃包括由xSiO 2 -yB 2 O 3 -zPbO（其中x，y和z以摩尔百分数表示）给出的主要成分。 x，y和z位于连接点A（x = 70，y = 0和z = 30），B（x = 70，y = 15和z = 15），C = 10，y = 75，z = 15），D（x = 10，y = 0，z = 90）。 优选使用选自Al 2 O 3，CaO，TiO 2，ZrO 2，BaO和MgO中的至少一种作为添加剂。 优选玻璃料占粉末状玻璃和电介质粉末的混合物的约35-95重量％，并且介电粉末占约5-65重量％。

    Ceramic multilayer substrate manufacturing method and unfired composite multilayer body
    10.
    发明申请
    Ceramic multilayer substrate manufacturing method and unfired composite multilayer body 有权
    陶瓷多层基板制造方法和未烧结复合多层体

    公开(公告)号：US20050008824A1

    公开(公告)日：2005-01-13

    申请号：US10476155

    申请日：2003-01-24

    申请人： Hiromichi Kawakami ,  Yoshifumi Saito

    发明人： Hiromichi Kawakami ,  Yoshifumi Saito

    IPC分类号： C04B35/64 ,  B28B11/00 ,  B28B11/12 ,  B28B11/24 ,  H01L21/48 ,  H01L23/12 ,  H01L23/15 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  B32B9/00

    CPC分类号： H05K3/0052 ,  B28B11/243 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/308 ,  Y10T428/2457 ,  Y10T428/24926 ,  H01L2924/00

    摘要： To produce a green composite laminate 11, a green multilayer collective substrate 13 containing low-temperature sinterable glass ceramic powder as a main ingredient is disposed between first and second shrinkage-restraining layers 14a and 14b containing alumina powder as a main ingredient. Grooves 16 are formed on one main surface 11a of the green composite laminate 11 such as to pass through the first shrinkage-restraining layer 14a and the green multilayer collective substrate 13 and reach the second shrinkage-restraining layer 14b, but not to reach the other main surface 11b of the green composite laminate 11. The green composite laminate 11 provided with the grooves 16 is sintered under conditions where the low-temperature sinterable glass ceramic powder is sintered and the green first and second shrinkage-restraining layers 14a and 14b are removed to prepare a plurality of ceramic multilayer substrates. This manufacturing method offers ceramic multilayer substrates with a high dimensional accuracy and substantially prevents defective divisions when a multilayer collective substrate is split into a plurality of ceramic multilayer substrates.

    摘要翻译： 为了制造绿色复合层叠体11，以含有低温烧结玻璃陶瓷粉末为主要成分的绿色多层集合基板13配置在以氧化铝粉末为主要成分的第一和第二收缩抑制层14a，14b之间。 沟槽16形成在绿色复合层压体11的一个主表面11a上，以通过第一收缩抑制层14a和绿色多层收集基板13到达第二收缩抑制层14b但不到达另一个 绿色复合层叠体11的主表面11b。在烧结低温可烧结玻璃陶瓷粉末并除去绿色第一和第二收缩抑制层14a和14b的条件下烧结设置有槽16的生坯复合层叠体11 以制备多个陶瓷多层基板。 该制造方法提供具有高尺寸精度的陶瓷多层基板，并且当将多层集合基板分割成多个陶瓷多层基板时，基本上防止有缺陷的划分。