利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

20 条记录 (耗时 0.028 秒)

    Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package
    2.
    发明授权
    Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package 失效
    引导波光学互连嵌入在微电子晶圆级批量封装内

    公开(公告)号：US06785458B2

    公开(公告)日：2004-08-31

    申请号：US10074420

    申请日：2002-02-11

    申请人： Tony Mule′ ,  Chirag Patel ,  James D. Meindl ,  Thomas K. Gaylord ,  Elias N. Glytsis ,  Kevin P. Martin ,  Stephen M. Schultz ,  Muhannad Bakir ,  Hollie Reed ,  Paul Kohl

    发明人： Tony Mule′ ,  Chirag Patel ,  James D. Meindl ,  Thomas K. Gaylord ,  Elias N. Glytsis ,  Kevin P. Martin ,  Stephen M. Schultz ,  Muhannad Bakir ,  Hollie Reed ,  Paul Kohl

    IPC分类号： G02B610

    CPC分类号： G02B6/43 ,  G02B6/10 ,  G02B6/12002 ,  G02B6/1221 ,  G02B6/132 ,  G02B6/136 ,  G02B6/34 ,  G02B2006/12107

    摘要： Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.

    摘要翻译： 公开了具有波导的晶片级电子封装以及制造具有波导的芯片级电子封装的方法。 代表性的芯片级电子封装包括至少一个具有波导芯的波导。 此外，另一代表性的芯片级电子封装包括在波导芯的一部分周围具有气隙包覆层的波导。 用于制造芯片级电子封装的代表性方法包括：提供具有设置在基板上的钝化层的基板; 在所述钝化层的一部分上设置波导芯; 在所述钝化层和所述波导芯的至少一部分上设置第一牺牲层; 在所述钝化层和所述第一牺牲层上设置外涂层; 以及去除所述第一牺牲层以在所述外涂层聚合物层内和所述波导芯的一部分周围限定气隙包覆层。

    Systems and methods for three-dimensional lithography and nano-indentation
    5.
    发明申请
    Systems and methods for three-dimensional lithography and nano-indentation 审中-公开
    三维光刻和纳米压痕的系统和方法

    公开(公告)号：US20050257709A1

    公开(公告)日：2005-11-24

    申请号：US10699287

    申请日：2003-10-31

    申请人： Tony Mule ,  Paul Kohl ,  Muhannad Bakir ,  Kevin Martin ,  James Meindl ,  Hiren Thacker

    发明人： Tony Mule ,  Paul Kohl ,  Muhannad Bakir ,  Kevin Martin ,  James Meindl ,  Hiren Thacker

    IPC分类号： B41F1/00 ,  B81C1/00 ,  G03F7/00

    CPC分类号： G03F7/00 ,  B81B2201/042 ,  B81B2201/047 ,  B81B2201/058 ,  B81B2203/0384 ,  B81C1/00119 ,  B81C2201/0108 ,  B81C2201/0152 ,  B81C2201/0159 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0015

    摘要： Systems and methods for three dimensional lithography, nano-indentation, and combinations thereof are disclosed. One exemplary three dimensional lithography method, among others, includes: providing a substrate having at least one optical element, wherein the optical element is selected from a refractive element and a diffractive element; disposing a polymer layer on the substrate and the at least one optical element, wherein the polymer layer includes a polymer material selected from a positive-tone polymer material and a negative-tone polymer material; positioning a mask adjacent the polymer layer, wherein the mask does not cover at least one directly exposed portion of the polymer material directly overlaying the at least one element; and exposing the at least one directly exposed portion of the polymer material to optical energy, wherein the optical energy passes through the at least one directly exposed portion of the polymer material and interacts with the element, and the element redirects the optical energy through the polymer material forming at least one area of indirectly exposed polymer material.

    摘要翻译： 公开了用于三维光刻，纳米压痕及其组合的系统和方法。 一种示例性的三维光刻方法，其中包括：提供具有至少一个光学元件的衬底，其中所述光学元件选自折射元件和衍射元件; 在所述基板和所述至少一个光学元件上设置聚合物层，其中所述聚合物层包括选自正性聚合物材料和负性聚合物材料的聚合物材料; 将掩模定位在所述聚合物层附近，其中所述掩模不覆盖直接覆盖所述至少一个元件的聚合物材料的至少一个直接暴露部分; 并且将所述聚合物材料的至少一个直接暴露部分暴露于光能，其中所述光能通过所述聚合物材料的所述至少一个直接暴露部分并且与所述元件相互作用，并且所述元件将所述光能重定向通过所述聚合物 形成间接暴露的聚合物材料的至少一个区域的材料。

    Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof
    6.
    发明授权
    Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof 有权
    具有嵌入式气隙包覆层的光波导及其制造方法

    公开(公告)号：US06807352B2

    公开(公告)日：2004-10-19

    申请号：US10074067

    申请日：2002-02-11

    申请人： Tony Mule′ ,  James D. Meindl ,  Thomas K. Gaylord ,  Elias N. Glytsis ,  Paul Kohl

    发明人： Tony Mule′ ,  James D. Meindl ,  Thomas K. Gaylord ,  Elias N. Glytsis ,  Paul Kohl

    IPC分类号： G02B610

    CPC分类号： G02B6/136 ,  G02B6/10 ,  G02B6/1221 ,  G02B6/132 ,  G02B6/34 ,  G02B6/43 ,  G02B2006/12107

    摘要： Waveguides having air-gap cladding layers and methods of fabricating waveguides having air-gap cladding layers are disclosed. A representative waveguide includes a waveguide core having an air-gap cladding layer engaging a portion of the waveguide core. In addition, a representative method of fabricating a waveguide having an air-gap cladding layer includes: providing a substrate having a lower cladding layer disposed on the substrate; disposing a waveguide core on a portion of the lower cladding layer; disposing a sacrificial layer onto at least one portion of the lower cladding layer and the waveguide core; disposing an overcoat layer onto the lower cladding layer and the sacrificial layer; and removing the sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and engaging a portion of the waveguide core.

    摘要翻译： 公开了具有气隙包覆层的波导和制造具有气隙包覆层的波导的方法。 代表性的波导包括具有接合波导芯的一部分的气隙包覆层的波导芯。 另外，制造具有气隙包层的波导的代表性方法包括：提供具有设置在基板上的下包层的基板; 在所述下包层的一部分上设置波导芯; 在所述下包层和所述波导芯的至少一部分上设置牺牲层; 在下包层和牺牲层上设置外涂层; 以及去除所述牺牲层以在所述外涂层聚合物层内限定气隙包层并与所述波导芯的一部分接合。

    Compliant wafer-level packaging devices and methods of fabrication
    8.
    发明授权
    Compliant wafer-level packaging devices and methods of fabrication 失效
    符合晶圆级封装的器件和制造方法

    公开(公告)号：US06690081B2

    公开(公告)日：2004-02-10

    申请号：US09993100

    申请日：2001-11-19

    申请人： Muhannad S. Bakir ,  Hollie Reed ,  Paul Kohl ,  Chirag S. Patel ,  Kevin P. Martin ,  James Meindl

    发明人： Muhannad S. Bakir ,  Hollie Reed ,  Paul Kohl ,  Chirag S. Patel ,  Kevin P. Martin ,  James Meindl

    IPC分类号： H01L2900

    CPC分类号： H01L23/49811 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    摘要： Devices and method of fabrication thereof are disclosed. A representative device includes one or more lead packages. The lead packages include a substrate including a plurality of die pads, an overcoat polymer layer, a plurality of sacrificial polymer layers disposed between the substrate and the overcoat polymer layer, and a plurality of leads. Each lead is disposed upon the overcoat polymer layer having a first portion disposed upon a die pad. The sacrificial polymer layer can be removed to form one or more air-gaps.

    摘要翻译： 公开了其制造的装置及其制造方法。 代表性的装置包括一个或多个引线封装。 引线封装包括包括多个管芯焊盘，外涂层聚合物层，设置在基板和外涂层聚合物层之间的多个牺牲聚合物层以及多个引线的基板。 每个引线设置在具有设置在管芯焊盘上的第一部分的外涂层聚合物层上。 可以除去牺牲聚合物层以形成一个或多个气隙。

    Method of making an electrostatic actuator
    9.
    发明授权
    Method of making an electrostatic actuator 失效
    制造静电致动器的方法

    公开(公告)号：US06933165B2

    公开(公告)日：2005-08-23

    申请号：US10668887

    申请日：2003-09-22

    申请人： Jurgen Musolf ,  Paul Kohl

    发明人： Jurgen Musolf ,  Paul Kohl

    IPC分类号： H01G5/18 ,  H01H59/00 ,  H01L21/00 ,  H01L21/44

    CPC分类号： H01H59/0009 ,  B82Y30/00 ,  H01G5/18 ,  H01H2059/0081

    摘要： A method of fabricating an electrostatic actuator with an intrinsic stress gradient is provided. An electrode is formed on a substrate and a support layer is formed over the electrode. A metal layer is deposited onto the support layer via a deposition process. Deposition process conditions are varied in order to induce a stress gradient into the metal layer. The intrinsic stress in the metal layer increases in the direction from the bottom to the top of the metal layer. The support layer under the electrode is removed to release the electrostatic actuator.

    摘要翻译： 提供一种制造具有固有应力梯度的静电致动器的方法。 在基板上形成电极，在电极上形成支撑层。 通过沉积工艺将金属层沉积到载体层上。 改变沉积工艺条件以便诱导金属层中的应力梯度。 金属层中的固有应力在从金属层的底部到顶部的方向上增加。 除去电极下面的支撑层以释放静电致动器。

    Electrostatic actuators with intrinsic stress gradient
    10.
    发明授权
    Electrostatic actuators with intrinsic stress gradient 失效
    具有固有应力梯度的静电执行器

    公开(公告)号：US06625004B1

    公开(公告)日：2003-09-23

    申请号：US09944867

    申请日：2001-08-31

    申请人： Jurgen Musolf ,  Paul Kohl

    发明人： Jurgen Musolf ,  Paul Kohl

    IPC分类号： H01G501

    CPC分类号： H01H59/0009 ,  B82Y30/00 ,  H01G5/18 ,  H01H2059/0081

    摘要： An electrostatic actuator with an intrinsic stress gradient is provided. The electrostatic actuator comprises an electrode and an electrostatically actuated beam fixed at one end relative to the electrode. The electrostatically actuated beam further includes a metal layer made substantially of a single metal with an induced stress gradient therein. The stress gradient in the metal layer determines the initial curvature of the beam. Upon electrostatic actuation of the beam, the beam is deflected from its initial curvature relative to the electrode. In one embodiment, the electrostatically actuated beam is used as a top movable electrode of an electrostatically actuated variable capacitor. The capacitance of the electrostatically actuated capacitor is changed upon electrostatic actuation of the beam.

    摘要翻译： 提供具有固有应力梯度的静电致动器。 静电致动器包括相对于电极在一端固定的电极和静电致动的光束。 静电致动光束还包括基本上由其中具有诱发应力梯度的单一金属制成的金属层。 金属层中的应力梯度决定了梁的初始曲率。 在光束的静电致动时，光束相对于电极从其初始曲率偏转。 在一个实施例中，静电驱动的光束用作静电驱动的可变电容器的顶部可移动电极。 静电驱动的电容器的电容在光束的静电驱动时改变。