公开(公告)号：US09687743B2

公开(公告)日：2017-06-27

申请号：US12608137

申请日：2009-10-29

申请人： Toru Osawa ,  Satoshi Kira ,  Shinya Saito ,  Kenta Tanaka ,  Jumpei Horita ,  Kozo Makino ,  Yoshiteru Fukuda ,  Masayuki Kuwajima ,  Takashi Yoshimi

发明人： Toru Osawa ,  Satoshi Kira ,  Shinya Saito ,  Kenta Tanaka ,  Jumpei Horita ,  Kozo Makino ,  Yoshiteru Fukuda ,  Masayuki Kuwajima ,  Takashi Yoshimi

IPC分类号： H04N5/76 ,  H04N9/80 ,  A63F13/60 ,  A63F13/92 ,  A63F13/332 ,  A63F13/77 ,  H04N21/41 ,  H04N21/436 ,  H04N21/4363

CPC分类号： A63F13/60 ,  A63F13/332 ,  A63F13/77 ,  A63F13/92 ,  A63F2300/402 ,  A63F2300/403 ,  A63F2300/552 ,  H04N21/4126 ,  H04N21/43615 ,  H04N21/43637

摘要： A first information processing apparatus executes an application, and generates control data in accordance with a state of an execution of the application. The control data is transmitted to a second information processing apparatus. Video data is stored in advance in the second information processing apparatus. The second information processing apparatus receives the control data transmitted from the first information processing apparatus, determines a video to be reproduced based on the control data, and reproduces the video based on the video data.

公开(公告)号：US20110013879A1

公开(公告)日：2011-01-20

申请号：US12608137

申请日：2009-10-29

申请人： Toru OSAWA ,  Satoshi Kira ,  Shinya Saito ,  Kenta Tanaka ,  Jumpei Horita ,  Kozo Makino ,  Yoshiteru Fukuda ,  Masayuki Kuwajima ,  Takashi Yoshimi

发明人： Toru OSAWA ,  Satoshi Kira ,  Shinya Saito ,  Kenta Tanaka ,  Jumpei Horita ,  Kozo Makino ,  Yoshiteru Fukuda ,  Masayuki Kuwajima ,  Takashi Yoshimi

IPC分类号： H04N7/18

CPC分类号： A63F13/60 ,  A63F13/332 ,  A63F13/77 ,  A63F13/92 ,  A63F2300/402 ,  A63F2300/403 ,  A63F2300/552 ,  H04N21/4126 ,  H04N21/43615 ,  H04N21/43637

摘要： A first information processing apparatus executes an application, and generates control data in accordance with a state of an execution of the application. The control data is transmitted to a second information processing apparatus. Video data is stored in advance in the second information processing apparatus. The second information processing apparatus receives the control data transmitted from the first information processing apparatus, determines a video to be reproduced based on the control data, and reproduces the video based on the video data.

摘要翻译： 第一信息处理装置执行应用，并根据应用的执行状态生成控制数据。 控制数据被发送到第二信息处理装置。 视频数据预先存储在第二信息处理装置中。 第二信息处理设备接收从第一信息处理设备发送的控制数据，基于控制数据确定要再现的视频，并且基于视频数据再现视频。

公开(公告)号：US08697187B2

公开(公告)日：2014-04-15

申请号：US12907585

申请日：2010-10-19

申请人： Yoshiteru Fukuda ,  Tomohiro Iseki ,  Takayuki Ishii

发明人： Yoshiteru Fukuda ,  Tomohiro Iseki ,  Takayuki Ishii

IPC分类号： B05D3/00

CPC分类号： H01L21/67184 ,  G03F7/162 ,  G03F7/2028 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67178

摘要： Resist coating treatments for application of a resist solution to removal of a resist film on a wafer edge portion. A laser irradiation unit applies a laser light in a resist coating unit. At the time of resist coating treatment, the resist solution is discharged onto a central portion of the rotated wafer from a resist solution supply nozzle to form a resist film on the wafer. Thereafter, the laser irradiation unit moves to an outer peripheral portion of the wafer and applies the laser light onto the resist film on the outer peripheral portion to dry the resist film on the outer peripheral portion. The application of laser light is continued, and the solvent supply nozzle moves to a position above the edge portion and supplies solvent to the resist film on the edge portion. The solvent dissolves and removes the resist film on the edge portion.

摘要翻译： 抗蚀剂涂覆处理用于在晶片边缘部分上施加抗蚀剂溶液以除去抗蚀剂膜。 激光照射单元在抗蚀剂涂布单元中施加激光。 在抗蚀剂涂布处理时，抗蚀剂溶液从抗蚀剂溶液供给喷嘴排出到旋转的晶片的中心部分，以在晶片上形成抗蚀剂膜。 此后，激光照射单元移动到晶片的外周部，并将激光施加到外周部分的抗蚀剂膜上，以干燥外周部分上的抗蚀剂膜。 继续施加激光，溶剂供给喷嘴移动到边缘部分上方的位置，并在边缘部分上的抗蚀剂膜上提供溶剂。 溶剂溶解并除去边缘部分上的抗蚀剂膜。

公开(公告)号：US07976896B2

公开(公告)日：2011-07-12

申请号：US11540629

申请日：2006-10-02

申请人： Yoshiteru Fukuda ,  Nobuhiro Ogata ,  Takayuki Ishii ,  Keiji Tanouchi

发明人： Yoshiteru Fukuda ,  Nobuhiro Ogata ,  Takayuki Ishii ,  Keiji Tanouchi

IPC分类号： B05D3/12

CPC分类号： H01L21/6715 ,  G03F7/162 ,  G03F7/168 ,  H01L21/67051

摘要： A spin chuck rotatably holds a semiconductor wafer, while resist is dropped on a surface of the semiconductor wafer through a resist application nozzle and thus applied thereon, and before the resist applied on the wafer dries, a cleaning liquid is supplied through a bevel cleaning nozzle to a portion of the wafer located at a peripheral portion thereof in a vicinity of a beveled portion to remove the resist adhering to the beveled portion. Thereafter, a film of the resist that is formed on the surface of the wafer is dried.

摘要翻译： 旋转卡盘可旋转地保持半导体晶片，同时抗蚀剂通过抗蚀剂施加喷嘴落在半导体晶片的表面上并因此施加在其上，并且在施加在晶片上的抗蚀剂干燥之前，通过斜面清洁喷嘴 到位于其周边部分的晶片的位于斜面部分附近的部分以去除附着在斜面部分上的抗蚀剂。 此后，将形成在晶片表面上的抗蚀剂膜干燥。

公开(公告)号：US07485188B2

公开(公告)日：2009-02-03

申请号：US11362105

申请日：2006-02-27

申请人： Takashi Takekuma ,  Yasuyuki Kometani ,  Yoshiteru Fukuda ,  Junya Minamida

发明人： Takashi Takekuma ,  Yasuyuki Kometani ,  Yoshiteru Fukuda ,  Junya Minamida

IPC分类号： B05C11/10

CPC分类号： H01L21/67253 ,  H01L21/6715

摘要： A coating process method in which a coating liquid is discharged onto the surface of a target substrate to be processed while rotating the target substrate so as to expand the coating liquid radially outward on the target substrate and, thus, to form a coated film comprises the step of detecting that the actual discharging of a coating liquid from a coating liquid discharging nozzle is started, and the step of controlling based on a signal of the detection at least one of the driving timing of a pump for allowing the coating liquid to be discharged from the coating liquid discharging nozzle, the operation timing of a valve mounted to a pipe for supplying the coating liquid into the coating liquid discharging nozzle, and the rotation starting or stopping timing of the target substrate.

摘要翻译： 一种涂布处理方法，其中在旋转目标衬底的同时将涂布液排放到待加工的目标衬底的表面上，以便在目标衬底上径向向外扩展涂覆液体，从而形成涂膜包括 检测是否开始从涂布液排出喷嘴实际排出涂布液的步骤，以及根据检测信号进行控制的步骤，用于使涂布液排出的泵的驱动正时中的至少一个 从涂布液排出喷嘴，安装到用于将涂布液供给到涂布液排出喷嘴中的管道的操作时间，以及目标基板的旋转开始或停止时机。

公开(公告)号：US20070257085A1

公开(公告)日：2007-11-08

申请号：US11742319

申请日：2007-04-30

申请人： Yoshiteru Fukuda ,  Kenichi Shigetomi ,  Shouken Moro

发明人： Yoshiteru Fukuda ,  Kenichi Shigetomi ,  Shouken Moro

IPC分类号： A47J36/02

CPC分类号： H01L21/67748 ,  H01L21/67005 ,  H01L21/67253 ,  H01L21/6838

摘要： In the present invention, a plurality of suction ports are provided in a heating plate of a heat processing apparatus. The suction ports are provided at a central portion, an intermediate portion, and a peripheral portion of a substrate mounting surface of the heating plate, respectively. The warped state of the substrate before heat-processed is measured, so that when the substrate warps protruding downward, the suction start timing via a suction port corresponding to the outer peripheral portion of the substrate is set to be relatively early as compared to the suction start timings via the other suction ports, and when the substrate warps protruding upward, the suction start timing via the suction port corresponding to the central portion of the substrate is set to be relatively early as compared to the suction start timings via the other suction ports. This allows a portion of the substrate bending upward to be sucked first when the substrate is mounted on the heating plate, thereby quickly performing correction of the warpage of the substrate to uniformly heat the substrate.

摘要翻译： 在本发明中，在热处理装置的加热板上设置多个吸入口。 吸入口分别设置在加热板的基板安装面的中央部分，中间部分和周边部分。 测量热处理前的基板的翘曲状态，使得当基板翘曲向下突出时，通过与基板的外周部分相对应的吸入口将吸入开始正时设定为与抽吸相比较早 通过其他吸入口开始定时，并且当基板翘曲向上突出时，通过与基板的中心部分相对应的吸入口的吸入开始定时与通过其它吸入口的吸入开始定时相比较早地设定 。 这使得当基板安装在加热板上时，首先将基板的一部分向上弯曲，从而快速地进行基板的翘曲校正以均匀地加热基板。

公开(公告)号：US20060068110A1

公开(公告)日：2006-03-30

申请号：US11232241

申请日：2005-09-22

申请人： Yoshiteru Fukuda ,  Tomohiro Iseki ,  Takayuki Ishii

发明人： Yoshiteru Fukuda ,  Tomohiro Iseki ,  Takayuki Ishii

IPC分类号： B05D5/00

CPC分类号： H01L21/67184 ,  H01L21/6708 ,  H01L21/6715

摘要： In the present invention, a plurality of solvent supply nozzles for solvents having different solubility parameters are provided in a coating treatment apparatus. For a solvent supply nozzle for use at the time of edge rinse, a solvent supply nozzle is selected that discharges a removal solvent having a solubility parameter different by a set value or more from that of a coating solvent contained in a coating solution. During coating treatment, the coating solution is discharged from a coating solution supply nozzle onto the central portion of a rotated substrate to form a solution film having a predetermined film thickness. Immediately after the formation, edge rinse is started with the coating solution on the substrate not dry yet, in which the removal solvent is supplied to the peripheral portion of the substrate from the selected solvent supply nozzle. In this event, the supplied removal solvent repels the coating solution on the substrate, so that only the coating solution on the peripheral portion is appropriately removed. According to the present invention, a series of coating treatments including the edge rinse can be carried out in a shorter time.

公开(公告)号：US09093222B2

公开(公告)日：2015-07-28

申请号：US13989151

申请日：2011-09-27

申请人： Goro Furutani ,  Takashi Terada ,  Yoshiteru Fukuda ,  Norio Wada

发明人： Goro Furutani ,  Takashi Terada ,  Yoshiteru Fukuda ,  Norio Wada

IPC分类号： B05C3/00 ,  H01G9/20 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01G9/20 ,  H01G9/2059 ,  H01L21/67057 ,  H01L21/67086 ,  H01L21/67757 ,  Y02E10/542 ,  Y02P70/521

摘要： Provided is a dye adsorption unit including a processing tank of which the upper surface is opened, in order to perform a batch dye adsorption process for a predetermined number of substrates. The dye adsorption unit further includes, as a moving system around the processing tank, a boat capable of going in and out of the processing tank from the upper opening, a boat transport unit that serves for the boat to go in and out of the processing tank, and a top cover for detachably closing the upper opening. Further, the dye adsorption unit includes a dye solution supply unit for supplying the dye solution into the processing tank, and a flow control unit for controlling the flow of the dye solution in the processing tank during the dye adsorption processing.

摘要翻译： 提供了一种染料吸附单元，其包括上表面打开的处理槽，以便对预定数量的基材进行分批染料吸附处理。 染料吸附单元还包括作为围绕处理罐的移动系统的能够从上部开口进出处理槽的船，用于船进出加工的船运输单元 罐和顶盖，用于可拆卸地封闭上部开口。 此外，染料吸附单元包括用于将染料溶液供给到处理槽中的染料溶液供给单元和用于在染料吸附处理期间控制处理槽中的染料溶液的流动的流量控制单元。

公开(公告)号：US20130316485A1

公开(公告)日：2013-11-28

申请号：US13989151

申请日：2011-09-27

申请人： Goro Furutani ,  Takashi Terada ,  Yoshiteru Fukuda ,  Norio Wada

发明人： Goro Furutani ,  Takashi Terada ,  Yoshiteru Fukuda ,  Norio Wada

IPC分类号： H01G9/20

CPC分类号： H01G9/20 ,  H01G9/2059 ,  H01L21/67057 ,  H01L21/67086 ,  H01L21/67757 ,  Y02E10/542 ,  Y02P70/521

摘要： [Problem] To significantly reduce the processing time of a step in which a coloring matter is adsorbed onto a porous semiconductor layer formed on the surface to be treated of a substrate.[Solution] A dye adsorption unit (20) includes a processing tank (30) of which the upper surface is opened, in order to perform a batch dye adsorption process for a predetermined number of substrates (G). The dye adsorption unit (20) further includes, as a moving system around the processing tank (30), a boat (32) capable of going in and out of the processing tank (30) from the upper opening, a boat transport unit (34) that serves for the boat (32) to go in and out of the processing tank (30), and a top cover (36) for detachably closing the upper opening. Further, the dye adsorption unit (20) includes a dye solution supply unit for supplying the dye solution into the processing tank (30), and a flow control unit for controlling the flow of the dye solution in the processing tank during the dye adsorption processing.

摘要翻译： [问题]为了显着地减少着色物质吸收到形成在待处理基材表面上的多孔半导体层上的步骤的处理时间。 [解决方案]染料吸附单元（20）包括打开上表面的处理槽（30），以对预定数量的基板（G）进行间染染色吸附处理。 染料吸附单元（20）还包括作为围绕处理罐（30）的移动系统的能够从上开口进出处理罐（30）的船（32），船运输单元 34），用于使船（32）进出处理罐（30），以及用于可拆卸地封闭上部开口的顶盖（36）。 此外，染料吸附单元（20）包括用于将染料溶液供给到处理槽（30）中的染料溶液供给单元和用于在染料吸附处理期间控制处理槽中的染料溶液的流动的流量控制单元 。

公开(公告)号：US07832352B2

公开(公告)日：2010-11-16

申请号：US11574888

申请日：2005-09-13

申请人： Yoshiteru Fukuda ,  Tomohiro Iseki ,  Takayuki Ishii

发明人： Yoshiteru Fukuda ,  Tomohiro Iseki ,  Takayuki Ishii

IPC分类号： B05B5/00 ,  B05B3/00 ,  B05B7/06

CPC分类号： H01L21/67184 ,  G03F7/162 ,  G03F7/2028 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67178

摘要： To perform a series of resist coating treatments from application of a resist solution to removal of a resist film on a wafer edge portion in a shorter time.A laser irradiation unit for applying a laser light is provided in a resist coating unit. At the time of resist coating treatment, the resist solution is discharged onto a central portion of the rotated wafer from a resist solution supply nozzle to form a resist film on the wafer. Thereafter, the laser irradiation unit moves to an outer peripheral portion of the wafer and applies the laser light onto the resist film on the outer peripheral portion to dry the resist film on the outer peripheral portion. After the resist film on the outer peripheral portion dries, the application of laser light is continued, and the solvent supply nozzle moves to a position above the edge portion of the wafer and supplies the solvent to the resist film on the edge portion of the wafer. The supply of the solvent dissolves and removes the resist film on the edge portion of the wafer.

摘要翻译： 为了在较短时间内从抗蚀剂溶液施加到晶片边缘部分上去除抗蚀剂膜，进行一系列光刻胶涂覆处理。 在抗蚀剂涂布单元中设置用于施加激光的激光照射单元。 在抗蚀剂涂布处理时，抗蚀剂溶液从抗蚀剂溶液供给喷嘴排出到旋转的晶片的中心部分，以在晶片上形成抗蚀剂膜。 此后，激光照射单元移动到晶片的外周部，并将激光施加到外周部分的抗蚀剂膜上，以干燥外周部分上的抗蚀剂膜。 在外围部分的抗蚀剂膜干燥之后，继续施加激光，并且溶剂供应喷嘴移动到晶片的边缘部分上方的位置，并将溶剂供应到晶片的边缘部分上的抗蚀剂膜 。 溶剂的供应溶解并除去晶片边缘部分上的抗蚀剂膜。