公开(公告)号：US5381235A

公开(公告)日：1995-01-10

申请号：US990460

申请日：1992-12-15

申请人： Yasuo Inoue ,  Tadashi Nishimura ,  Takashi Ipposhi ,  Toshiaki Iwamatsu

发明人： Yasuo Inoue ,  Tadashi Nishimura ,  Takashi Ipposhi ,  Toshiaki Iwamatsu

IPC分类号： G01B11/24 ,  G01B11/02 ,  G01B11/25 ,  G01C3/06 ,  H01L27/14

CPC分类号： G01B11/024 ,  G01B11/2518

摘要： The present invention provides a three-dimensional shape measuring device and a sensor employed for the three-dimensional shape measuring device. The three-dimensional shape measuring device comprises a light source for scanning plane light over the surface of an object, an image sensor opposed to the object and provided with a plurality of pixels, an optical system for forming an image of a bright line appearing on the surface of the object due to plane light on the image sensor, a plurality of capacitors installed in association with pixels of the image sensor, a charger for storing given charges in a plurality of capacitors before plane light scanning starts, a plurality of dischargers lying in association with capacitors and gradually discharging the capacitors for pixels corresponding to a bright line image from when plane light scanning starts until the bright line image passes through the pixels, and an arithmetic logic means for computing charges remaining in the plurality of capacitors after plane light scanning is completed and thus providing a three-dimensional shape of an object. Thereby, a three-dimensional shape of an object can be measured at a high speed with high precision.

摘要翻译： 本发明提供了三维形状测量装置和用于三维形状测量装置的传感器。 三维形状测量装置包括：用于扫描物体表面上的平面光的光源，与该物体相对并设置有多个像素的图像传感器，用于形成亮线的图像的光学系统， 由于图像传感器上的平面光，物体的表面，与图像传感器的像素相关联地安装的多个电容器，用于在平面光扫描开始之前在多个电容器中存储给定电荷的充电器，多个放电器位于 与平面光扫描开始直到亮线图像通过像素的与亮线图像相对应的像素的电容器逐渐放电;以及算术逻辑装置，用于计算平面光后的多个电容器中剩余的电荷 扫描完成，从而提供对象的三维形状。 由此，可以高精度地测量物体的三维形状。

公开(公告)号：US5841171A

公开(公告)日：1998-11-24

申请号：US746951

申请日：1996-11-18

申请人： Toshiaki Iwamatsu ,  Takashi Ipposhi ,  Yasuo Inoue

发明人： Toshiaki Iwamatsu ,  Takashi Ipposhi ,  Yasuo Inoue

IPC分类号： H01L21/316 ,  H01L21/76 ,  H01L21/762 ,  H01L21/84 ,  H01L27/12 ,  H01L29/786 ,  H01L29/00

CPC分类号： H01L21/84 ,  H01L27/1203 ,  H01L29/78609 ,  H01L29/78654

摘要： In forming an element isolating region in a silicon semiconductor layer of an SOI substrate, a silicon nitride film of a predetermined thickness is deposited over an oxide film formed on a SOI layer. The silicon nitride film is patterned in a design size of active regions, and side walls of a silicon nitride film are formed on the side surfaces of the patterned silicon nitride film. A first LOCOS process is carried out using the nitride film as an oxidation mask. A LOCOS film formed by the first LOCOS process is removed to form narrower concavities under the side walls. Then, another silicon nitride film is deposited, and is removed leaving portions thereof forming the concavities. Then, a second LOCOS process is carried out to form a LOCOS film as an element isolating region. The second LOCOS process uses the oxidation mask having the narrow cavities, so that stress at the boundary of the active region and the element isolation region is reduced, and the growth of bird's beaks can be suppressed.

摘要翻译： 在形成SOI衬底的硅半导体层中的元件隔离区域时，在形成于SOI层上的氧化物膜上沉积预定厚度的氮化硅膜。 以活性区域的设计尺寸对氮化硅膜进行构图，并且在图案化的氮化硅膜的侧表面上形成氮化硅膜的侧壁。 使用氮化物膜作为氧化掩模进行第一LOCOS工艺。 去除由第一LOCOS工艺形成的LOCOS膜，以在侧壁下形成更窄的凹面。 然后，沉积另一个氮化硅膜，并除去形成凹部的部分。 然后，进行第二LOCOS工艺以形成LOCOS膜作为元件隔离区。 第二LOCOS工艺使用具有窄腔的氧化掩模，使得有源区域和元件隔离区域的边界处的应力减小，并且可以抑制鸟喙的生长。

公开(公告)号：US6096583A

公开(公告)日：2000-08-01

申请号：US133690

申请日：1998-08-12

申请人： Toshiaki Iwamatsu ,  Takashi Ipposhi ,  Yasuo Inoue

发明人： Toshiaki Iwamatsu ,  Takashi Ipposhi ,  Yasuo Inoue

IPC分类号： H01L21/316 ,  H01L21/76 ,  H01L21/762 ,  H01L21/84 ,  H01L27/12 ,  H01L29/786 ,  H01L21/70

CPC分类号： H01L21/84 ,  H01L27/1203 ,  H01L29/78609 ,  H01L29/78654

摘要： In forming an element isolating region in a silicon semiconductor layer of an SOI substrate, a silicon nitride film of a predetermined thickness is deposited over an oxide film formed on a SOI layer. The silicon nitride film is patterned in a design size of active regions, and side walls of a silicon nitride film are formed on the side surfaces of the patterned silicon nitride film. A first LOCOS process is carried out using the nitride film as an oxidation mask. A LOCOS film formed by the first LOCOS process is removed to form narrower concavities under the side walls. Then, another silicon nitride film is deposited, and is removed leaving portions thereof forming the concavities. Then, a second LOCOS process is carried out to form a LOCOS film as an element isolating region. The second LOCOS process uses the oxidation mask having the narrow cavities, so that stress at the boundary of the active region and the element isolation region is reduced, and the growth of bird's beaks can be suppressed.

摘要翻译： 在形成SOI衬底的硅半导体层中的元件隔离区域时，在形成于SOI层上的氧化物膜上沉积预定厚度的氮化硅膜。 以活性区域的设计尺寸对氮化硅膜进行构图，并且在图案化的氮化硅膜的侧表面上形成氮化硅膜的侧壁。 使用氮化物膜作为氧化掩模进行第一LOCOS工艺。 去除由第一LOCOS工艺形成的LOCOS膜，以在侧壁下形成更窄的凹面。 然后，沉积另一个氮化硅膜，并除去形成凹部的部分。 然后，进行第二LOCOS工艺以形成LOCOS膜作为元件隔离区。 第二LOCOS工艺使用具有窄腔的氧化掩模，使得有源区域和元件隔离区域的边界处的应力减小，并且可以抑制鸟喙的生长。

公开(公告)号：US5514880A

公开(公告)日：1996-05-07

申请号：US142564

申请日：1993-10-28

申请人： Hisayuki Nishimura ,  Kazuyuki Sugahara ,  Shigenobu Maeda ,  Takashi Ipposhi ,  Yasuo Inoue ,  Toshiaki Iwamatsu ,  Mikio Ikeda ,  Tatsuya Kunikiyo ,  Junji Tateishi ,  Tadaharu Minato

发明人： Hisayuki Nishimura ,  Kazuyuki Sugahara ,  Shigenobu Maeda ,  Takashi Ipposhi ,  Yasuo Inoue ,  Toshiaki Iwamatsu ,  Mikio Ikeda ,  Tatsuya Kunikiyo ,  Junji Tateishi ,  Tadaharu Minato

IPC分类号： H01L21/20 ,  H01L21/336 ,  H01L21/8244 ,  H01L27/11 ,  H01L29/78 ,  H01L29/786 ,  H01L29/10 ,  H01L29/06

CPC分类号： H01L27/11 ,  H01L27/1108 ,  H01L29/78654 ,  H01L27/1281 ,  Y10S257/903

摘要： In a miniaturized complete CMOS SRAM of a TFT load type, a field effect thin-film transistor (TFT) can achieve stable reading and writing operation of a memory cell and can reduce power consumption thereof. The field effect thin-film transistor formed on an insulator includes an active layer and a gate electrode. The gate electrode is formed on a channel region of the active layer with a gate insulating film therebetween. The active layer is formed of a channel region and source/drain regions. The channel region is formed of a monocrystal silicon layer and does not includes a grain boundary. The source/drain regions is formed of a polysilicon layer. The channel region has a density of crystal defects of less than 10.sup.9 pieces/cm.sup.2. The thin film transistor shows an ON current of 0.25 .mu.A/.mu.m per channel width of 1 .mu.m and an OFF current of 15 fA/.mu.m. The thin-film transistor can be applied to a p-channel MOS transistor serving as a load transistor in a memory cell of a CMOS type SRAM.

摘要翻译： 在TFT负载型的小型化的完全CMOS SRAM中，场效应薄膜晶体管（TFT）能够实现对存储单元的稳定的读/写操作并且可以降低其功耗。 形成在绝缘体上的场效应薄膜晶体管包括有源层和栅电极。 栅电极形成在有源层的沟道区上，其间具有栅极绝缘膜。 有源层由沟道区和源极/漏极区形成。 沟道区由单晶硅层形成，不包含晶界。 源/漏区由多晶硅层形成。 沟道区域的晶体缺陷密度小于109个/ cm 2。 薄膜晶体管的通道宽度为1μm，导通电流为0.25μA/μm，OFF电流为15fA /μm。 薄膜晶体管可以被施加到用作CMOS型SRAM的存储单元中的负载晶体管的p沟道MOS晶体管。

公开(公告)号：US5736438A

公开(公告)日：1998-04-07

申请号：US483411

申请日：1995-06-07

申请人： Hisayuki Nishimura ,  Kazuyuki Sugahara ,  Shigenobu Maeda ,  Takashi Ipposhi ,  Yasuo Inoue ,  Toshiaki Iwamatsu ,  Mikio Ikeda ,  Tatsuya Kunikiyo ,  Junji Tateishi ,  Tadaharu Minato

发明人： Hisayuki Nishimura ,  Kazuyuki Sugahara ,  Shigenobu Maeda ,  Takashi Ipposhi ,  Yasuo Inoue ,  Toshiaki Iwamatsu ,  Mikio Ikeda ,  Tatsuya Kunikiyo ,  Junji Tateishi ,  Tadaharu Minato

IPC分类号： H01L21/20 ,  H01L21/336 ,  H01L21/8244 ,  H01L27/11 ,  H01L29/78 ,  H01L29/786 ,  H01L21/84

CPC分类号： H01L27/11 ,  H01L27/1108 ,  H01L29/78654 ,  H01L27/1281 ,  Y10S257/903

摘要： In a miniaturized complete CMOS SRAM of a TFT load type, a field effect thin-film transistor (TFT) can achieve stable reading and writing operation of a memory cell and can reduce power consumption thereof. The field effect thin-film transistor formed on an insulator includes an active layer and a gate electrode. The gate electrode is formed on a channel region of the active layer with a gate insulating film therebetween. The active layer is formed of a channel region and source/drain regions. The channel region is formed of a monocrystal silicon layer and does not includes a grain boundary. The source/drain regions is formed of a polysilicon layer. The channel region has a density of crystal defects of less than 10.sup.9 pieces/cm.sup.2. The thin film transistor shows an ON current of 0.25 .mu.A/.mu.m per channel width of 1 .mu.m and an OFF current of 15 fA/.mu.m. The thin-film transistor can be applied to a p-channel MOS transistor serving as a load transistor in a memory cell of a CMOS type SRAM.

摘要翻译： 在TFT负载型的小型化的完全CMOS SRAM中，场效应薄膜晶体管（TFT）能够实现对存储单元的稳定的读/写操作并且可以降低其功耗。 形成在绝缘体上的场效应薄膜晶体管包括有源层和栅电极。 栅电极形成在有源层的沟道区上，其间具有栅极绝缘膜。 有源层由沟道区和源极/漏极区形成。 沟道区由单晶硅层形成，不包含晶界。 源/漏区由多晶硅层形成。 沟道区域的晶体缺陷密度小于109个/ cm 2。 薄膜晶体管的通道宽度为1μm，导通电流为0.25μA/μm，OFF电流为15fA /μm。 薄膜晶体管可以被施加到用作CMOS型SRAM的存储单元中的负载晶体管的p沟道MOS晶体管。

公开(公告)号：US20070105329A1

公开(公告)日：2007-05-10

申请号：US11617936

申请日：2006-12-29

申请人： Toshiaki Iwamatsu ,  Takashi Ipposhi

发明人： Toshiaki Iwamatsu ,  Takashi Ipposhi

IPC分类号： H01L29/76 ,  H01L21/8222

CPC分类号： H01L27/0617 ,  H01L21/76283 ,  H01L21/84 ,  H01L27/0629 ,  H01L27/1203 ,  H01L27/13 ,  H01L28/10 ,  H01L28/20 ,  H01L29/665 ,  H01L29/6659 ,  H01L29/7833

摘要： Plural trench isolation films are provided with portions of an SOI layer interposed therebetween in a surface of the SOI layer in a resistor region (RR) where a spiral inductor (SI) is to be provided. Resistive element are formed on the trench isolation films, respectively. Each of the trench isolation films includes a central portion which passes through the SOI layer and reaches a buried oxide film to include a full-trench isolation structure, and opposite side portions each of which passes through only a portion of the SOI layer and is located on the SOI layer to include a partial-trench isolation structure. Thus, each of the trench isolation films includes a hybrid-trench isolation structure.

摘要翻译： 多个沟槽隔离膜在其中设置有螺旋电感器（SI）的电阻器区域（RR）中的SOI层的表面中设置有SOI层的部分。 电阻元件分别形成在沟槽隔离膜上。 每个沟槽隔离膜包括穿过SOI层并到达掩埋氧化膜以包括全沟槽隔离结构的中心部分，以及相对的侧部，其每个仅穿过SOI层的一部分并且位于 在SOI层上以包括部分沟槽隔离结构。 因此，每个沟槽隔离膜包括混合沟槽隔离结构。

公开(公告)号：US07187040B2

公开(公告)日：2007-03-06

申请号：US11078581

申请日：2005-03-14

申请人： Shigeto Maegawa ,  Takashi Ipposhi ,  Toshiaki Iwamatsu ,  Shigenobu Maeda ,  Il-Jung Kim ,  Kazuhito Tsutsumi ,  Hirotada Kuriyama ,  Yoshiyuki Ishigaki ,  Motomu Ukita ,  Toshiaki Tsutsumi

发明人： Shigeto Maegawa ,  Takashi Ipposhi ,  Toshiaki Iwamatsu ,  Shigenobu Maeda ,  Il-Jung Kim ,  Kazuhito Tsutsumi ,  Hirotada Kuriyama ,  Yoshiyuki Ishigaki ,  Motomu Ukita ,  Toshiaki Tsutsumi

IPC分类号： H01L29/76 ,  H01L31/113

CPC分类号： H01L29/78609 ,  H01L27/124 ,  H01L29/41733 ,  H01L29/458 ,  H01L29/66757 ,  H01L29/78618 ,  H01L29/78624 ,  H01L29/78639

摘要： Provided are a thin-film transistor formed by connecting polysilicon layers having different conductivity types with each other which prevents occurrence of inconvenience resulting from diffusion of impurities and a method of fabricating the same. A drain (6), a channel (7) and a source (8) are integrally formed on a surface of a second oxide film (4) by polysilicon. The drain (6) is formed to be connected with a pad layer (3) (second polycrystalline semiconductor layer) through a contact hole (5) which is formed to reach an upper surface of the pad layer (3). The pad layer (3) positioned on a bottom portion of the contact hole (5) (opening) is provided with a boron implantation region BR.

摘要翻译： 提供了通过将具有不同导电类型的多晶硅层彼此连接而形成的薄膜晶体管，其防止由杂质扩散引起的不便的发生及其制造方法。 漏极（6），沟道（7）和源极（8）通过多晶硅一体地形成在第二氧化膜（4）的表面上。 漏极（6）形成为通过形成为到达焊盘层（3）的上表面的接触孔（5）与焊盘层（3）（第二多晶半导体层）连接。 定位在接触孔（5）（开口）的底部的衬垫层（3）设置有硼注入区域BR。

公开(公告)号：US20060289904A1

公开(公告)日：2006-12-28

申请号：US11425072

申请日：2006-06-19

申请人： Mikio Tsujiuchi ,  Toshiaki Iwamatsu ,  Takashi Ipposhi

发明人： Mikio Tsujiuchi ,  Toshiaki Iwamatsu ,  Takashi Ipposhi

IPC分类号： H01L29/76

CPC分类号： H01L29/458 ,  H01L21/76283 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/66772 ,  H01L29/78609

摘要： In the semiconductor device which has partial trench isolation as isolation between elements formed in an SOI substrate, resistance reduction of the source drain of a transistor and reduction of leakage current are aimed at. A MOS transistor is formed in the active region specified by the isolation insulating layer in the SOI layer formed on the buried oxide film layer (BOX layer). An isolation insulating layer is a partial trench isolation which has not reached a BOX layer, and source and drain regions include the first and the second impurity ion which differs in a mass number mutually.

公开(公告)号：US20060244064A1

公开(公告)日：2006-11-02

申请号：US11448827

申请日：2006-06-08

申请人： Takashi Ipposhi ,  Toshiaki Iwamatsu

发明人： Takashi Ipposhi ,  Toshiaki Iwamatsu

IPC分类号： H01L27/12

CPC分类号： H01L29/7833 ,  H01L21/761 ,  H01L21/76283 ,  H01L21/823878 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/665

摘要： Formed on an insulator (9) are an N− type semiconductor layer (10) having a partial isolator formed on its surface and a P− type semiconductor layer (20) having a partial isolator formed on its surface. Source/drain (11, 12) being P+ type semiconductor layers are provided on the semiconductor layer (10) to form a PMOS transistor (1). Source/drain (21, 22) being N+ type semiconductor layers are provided on the semiconductor layer (20) to form an NMOS transistor (2). A pn junction (J5) formed by the semiconductor layers (10, 20) is provided in a CMOS transistor (100) made up of the transistors (1, 2). The pn junction (J5) is positioned separately from the partial isolators (41, 42), where the crystal defect is thus very small. Therefore, the leakage current is very low at the pn junction (J5).

公开(公告)号：US07112854B1

公开(公告)日：2006-09-26

申请号：US08850631

申请日：1997-05-02

申请人： Shigeto Maegawa ,  Takashi Ipposhi ,  Toshiaki Iwamatsu ,  Shigenobu Maeda ,  Il-Jung Kim ,  Kazuhito Tsutsumi ,  Hirotada Kuriyama ,  Yoshiyuki Ishigaki ,  Motomu Ukita ,  Toshiaki Tsutsumi

发明人： Shigeto Maegawa ,  Takashi Ipposhi ,  Toshiaki Iwamatsu ,  Shigenobu Maeda ,  Il-Jung Kim ,  Kazuhito Tsutsumi ,  Hirotada Kuriyama ,  Yoshiyuki Ishigaki ,  Motomu Ukita ,  Toshiaki Tsutsumi

IPC分类号： H01L29/78

CPC分类号： H01L29/78609 ,  H01L27/124 ,  H01L29/41733 ,  H01L29/458 ,  H01L29/66757 ,  H01L29/78618 ,  H01L29/78624 ,  H01L29/78639

摘要： Provided are a thin-film transistor formed by connecting polysilicon layers having different conductivity types with each other which prevents occurrence of inconvenience resulting from diffusion of impurities and a method of fabricating the same. A drain (6), a channel (7) and a source (8) are integrally formed on a surface of a second oxide film (4) by polysilicon. The drain (6) is formed to be connected with a pad layer (3) (second polycrystalline semiconductor layer) through a contact hole (5) which is formed to reach an upper surface of the pad layer (3). The pad layer (3) positioned on a bottom portion of the contact hole (5) (opening) is provided with a boron implantation region BR.

摘要翻译： 提供了通过将具有不同导电类型的多晶硅层彼此连接而形成的薄膜晶体管，其防止由杂质扩散引起的不便的发生及其制造方法。 漏极（6），沟道（7）和源极（8）通过多晶硅一体地形成在第二氧化膜（4）的表面上。 漏极（6）形成为通过形成为到达焊盘层（3）的上表面的接触孔（5）与焊盘层（3）（第二多晶半导体层）连接。 定位在接触孔（5）（开口）的底部的衬垫层（3）设置有硼注入区域BR。