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公开(公告)号：US4012843A
公开(公告)日：1977-03-22
申请号：US531156
申请日：1974-12-09
CPC分类号： G02B5/1852
摘要： A tool for ruling grating grooves is reciprocated on a diffraction grating blank with the tool being restrained within a plane inclined at an arbitrary angle relative to a plane lying in contact with one point on a spherical concave of the diffraction grating blank. Translation for a variable pitch-groove spacing which changes as a function of the groove number or groove position is imparted to the diffraction grating blank in interlocking relationship with the reciprocation, thereby mechanically ruling the desired sphere of the grating blank with the grating grooves, whereby a concave diffraction grating which forms diffracted light of a specific wavelength into a completely stigmatic image at high diffraction efficiency can be manufactured.
摘要翻译： 用于排列光栅槽的工具在衍射光栅坯料上往复运动，其中工具被限制在相对于与衍射光栅坯料的球形凹部上的一个点接触的平面倾斜任意角度的平面内。 对于作为凹槽编号或凹槽位置的函数而变化的可变节距间距的平移被赋予与往复运动互锁关系的衍射光栅坯料，由此用光栅槽机械地划定光栅坯料的所需球体，由此 可以制造以高衍射效率将特定波长的衍射光形成为完全眩晕图像的凹面衍射光栅。
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公开(公告)号：US4219933A
公开(公告)日：1980-09-02
申请号：US56257
申请日：1979-07-10
申请人： Toshiaki Kita , Shigeo Moriyama , Tatsuo Harada
发明人： Toshiaki Kita , Shigeo Moriyama , Tatsuo Harada
CPC分类号： B26D3/08 , B24B13/046 , B24B19/02 , G02B5/1852
摘要： A device for the fabrication of a concave diffraction grating wherein grating grooves are mechanically ruled on a spherical surface of a diffraction grating blank and wherein a tool for ruling the grating grooves is reciprocated along the spherical surface of the diffraction grating blank, guided by a cylindrical cam, to form grooves having a uniform sectional shape over their whole area, whereby a concave diffraction grating of high diffraction efficiency and little scattering light is fabricated.
摘要翻译： 一种用于制造凹衍射光栅的装置，其中光栅槽机械地刻划在衍射光栅坯料的球形表面上，并且其中用于刻划光栅槽的工具沿衍射光栅坯料的球形表面往复运动，由圆柱形 凸轮形成在其整个区域上具有均匀截面形状的凹槽，由此制造高衍射效率和少量散射光的凹形衍射光栅。
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公开(公告)号：US4358198A
公开(公告)日：1982-11-09
申请号：US188511
申请日：1980-09-18
申请人： Shigeo Moriyama , Tatsuo Harada , Masaaki Ito
发明人： Shigeo Moriyama , Tatsuo Harada , Masaaki Ito
IPC分类号： B26D7/20 , B23Q1/26 , B23Q1/62 , G02B21/32 , G03F7/20 , H01L21/027 , H01L21/30 , H01L21/68 , H05K13/00 , G03B27/42
CPC分类号： G03F7/70716 , B23Q1/26 , B23Q1/621 , G02B21/32 , H01L21/30 , H05K13/0015
摘要： An apparatus for moving a table or a stage having movable parts adapted to be guided by guide rail means slidingly and rectilinearly. At least the movable parts are made of a non-iron light metal material. The sliding surfaces of the movable parts making sliding contact with the guide rail means are made of a self-lubricating material, while the sliding surfaces of the guide rail means making sliding contact with the movable parts are made of a material having a higher hardness and wear resistance than the non-iron light metal material, so that the weight of at least the movable parts is reduced to decrease the weight of the apparatus as a whole.
摘要翻译： 一种用于移动桌子或台架的装置，其具有适于被导轨装置滑动且直线地引导的可移动部件。 至少可移动部件由非铁轻金属材料制成。 与导轨装置滑动接触的可移动部件的滑动表面由自润滑材料制成，而与可移动部件滑动接触的导轨装置的滑动表面由具有较高硬度的材料制成， 耐磨性比非铁轻金属材料低，使得至少可移动部件的重量减小，从而降低整体装置的重量。
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公开(公告)号：US4409860A
公开(公告)日：1983-10-18
申请号：US138095
申请日：1980-04-07
申请人： Shigeo Moriyama , Masaaki Ito , Tatsuo Harada
发明人： Shigeo Moriyama , Masaaki Ito , Tatsuo Harada
CPC分类号： G03F7/70716 , B23Q1/621 , Y10T74/20354
摘要： In an apparatus for precisely moving a table, rectilinear drive systems for both X- and Y-axes are fixed to a support frame, a movable stage is constructed so as to have its motion in the direction of one of these axes constrained by the motion of the rectilinear drive system for the one axis and to have its motion in the direction of the other axis constrained by the rectilinear motion of the rectilinear drive system for the other axis, and means for coupling the rectilinear drive system for at least one of the axes and the movable stage so as to have a backlash.
摘要翻译： 在用于精确移动工作台的装置中，用于X轴和Y轴两者的直线驱动系统固定在支撑框架上，可动台被构造成使得其运动沿这些轴中的一个受到运动约束的方向 的直线驱动系统，并且沿着另一个轴线的直线运动限制的另一个轴线的方向运动;以及用于将直线驱动系统耦合到至少一个的直线驱动系统的装置， 轴和可动台以具有间隙。
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公开(公告)号：US4057347A
公开(公告)日：1977-11-08
申请号：US670830
申请日：1976-03-26
申请人： Shigeo Moriyama , Tatsuo Harada , Yoshio Kawamura , Seiya Hashimoto , Akihiro Takanashi , Toshiei Kurosaki , Shinji Kuniyoshi , Sumio Hosaka
发明人： Shigeo Moriyama , Tatsuo Harada , Yoshio Kawamura , Seiya Hashimoto , Akihiro Takanashi , Toshiei Kurosaki , Shinji Kuniyoshi , Sumio Hosaka
IPC分类号： G03B27/32 , G02B27/18 , G03F9/00 , G05D3/12 , H01L21/027 , H01L21/30 , G01B11/26 , G03B27/54
CPC分类号： G03F9/70
摘要： An improved optical exposure apparatus for use in exposing a workpiece to a desired light pattern with a high alignment accuracy and a high operational speed is disclosed. The apparatus comprises a moving table on which a workpiece to be exposed is disposed, a movable holder on which a mask having an original pattern is disposed, a light source for irradiating said mask, a reduction lens for projecting a reduced pattern of said original pattern onto said workpiece, means for positioning said moving table to a predetermined position, means for detecting the error of said table positioning, means for calculating a value of the error of positioning the workpiece divided by the reduction rate of the reduction lens, and means for automatically shifting said movable holder by the calculated value so as to cancel said error.
摘要翻译： 公开了一种用于以高对准精度和高操作速度将工件暴露于期望的光图案的改进的光学曝光装置。 该装置包括：移动台，设置待曝光的工件;可移动的保持器，其上设置有原始图案的掩模;用于照射所述掩模的光源;还原透镜，用于将所述原始图案的缩小图案投影 在所述工件上，用于将所述移动台定位到预定位置的装置，用于检测所述工作台定位误差的装置，用于计算所述工件定位误差值除以所述还原透镜的减速率的装置， 自动地将所述活动支架移动所述计算值，以便消除所述误差。
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公开(公告)号：US07137866B2
公开(公告)日：2006-11-21
申请号：US11267306
申请日：2005-11-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
IPC分类号： B24B49/00
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/02 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended.Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate.The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
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7.发明申请公开(公告)号：US20050095960A1
公开(公告)日：2005-05-05
申请号：US11004991
申请日：2004-12-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended. Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate. The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
摘要翻译： 本发明涉及一种抛光装置以及使用该装置的半导体制造方法。 磨石表面的磨合通过施胶处理进行研磨，由此可以进行工具表面的修整，同时防止在磨石表面产生裂纹，这是产生划痕的原因。 此外，可以保证修整工具的表面的平整度，因为切割的尺寸大小; 即使使用了几厘米厚的砂轮，也可以保持平坦度， 并且可以总是执行具有较少的面内不均匀性的处理。 因此，修整工具的寿命可以大大延长。 此外，与晶片的处理联合进行本施胶修整，从而能够提高装置的生产量以及维持处理速度。 本装置和方法对于具有不规则性的各种衬底表面的平坦化是有效的。
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8.发明授权Method for fabricating semiconductor device and processing apparatus for processing semiconductor device 失效半导体装置的制造方法以及半导体装置的处理装置公开(公告)号：US06612912B2
公开(公告)日：2003-09-02
申请号：US09371003
申请日：1999-08-10
申请人： Kan Yasui , Souichi Katagiri , Shigeo Moriyama , Yoshio Kawamura , Ryousei Kawai , Sadayuki Nishimura , Masahiko Sato
发明人： Kan Yasui , Souichi Katagiri , Shigeo Moriyama , Yoshio Kawamura , Ryousei Kawai , Sadayuki Nishimura , Masahiko Sato
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B1/04 , B24B37/042 , B24B53/12
摘要： A method for fabricating a semiconductor device includes grindstone surface activation treatment by means of a brush or ultrasonic wave carried out when a concave/convex pattern of a semiconductor wafer is planarized by polishing a semiconductor wafer held by a wafer holder by using a grindstone constituted of abrasive grains and material for holding the abrasive grains onto which the semiconductor wafer is pressed with relative motion. The semiconductor wafer is processed with high removal rate and the polishing thickness is controlled accurately.
摘要翻译： 一种制造半导体器件的方法包括：当半导体晶片的凹凸图案通过使用由晶片保持器保持的半导体晶片进行平面化而进行的刷子或超声波的磨石表面激活处理， 磨料颗粒和用于保持磨料颗粒的材料，半导体晶片被相对运动地压在其上。 半导体晶片以高去除率进行处理，并且精确地控制抛光厚度。
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公开(公告)号：US5025268A
公开(公告)日：1991-06-18
申请号：US377325
申请日：1989-07-10
CPC分类号： G02B26/125 , B41J2/471 , G02B13/0005 , G02B27/0031 , G02B3/02
摘要： An optical scanning apparatus has a scanning lens with a rotationally asymmetric aspheric surface having individual curvature radii in the main scanning direction and in the sub-scanning direction. The curvature radius in the sub-scanning direction is asymmetrically increased in the lateral direction with the distance from the optical axis. A field curvature aberration which may be generated in the sub-scanning direction on the scanning surface due to an oblique incident of optical beams on the rotating polygonal mirror or the movement of the reflective surface caused by rotation of the rotating polygonal mirror is compensated for by the scanning lens and the focusing properties of the system can be kept at a level of high resolving power.
摘要翻译： 光学扫描装置具有在主扫描方向和副扫描方向上具有单独曲率半径的旋转非对称非球面的扫描透镜。 副扫描方向的曲率半径与光轴的距离在横向方向上不对称地增加。 可以由旋转多面镜上的光束的倾斜入射引起的扫描面上的副扫描方向产生的场曲率像差或由旋转多面镜的旋转引起的反射面的移动而补偿 扫描透镜和系统的聚焦属性可以保持在高分辨率的水平。
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公开(公告)号：US4984259A
公开(公告)日：1991-01-08
申请号：US481682
申请日：1990-02-20
申请人： Masaaki Itou , Shigeo Moriyama
发明人： Masaaki Itou , Shigeo Moriyama
IPC分类号： G21K1/06 , G03F7/20 , G21K5/02 , H01L21/027
CPC分类号： G03F7/70075
摘要： An X-ray exposure apparatus comprises an X-ray source, a reflecting mirror for deflecting an X-ray beam radiated from the X-ray source to an object, and mechanisms for rotating the reflecting mirror about an axis of rotation apart from a reflecting surface of the reflecting mirror. The reflecting mirror has such a shape that the angle of incidence remains constant relative to the X-ray beam at given angles of rotation.
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