Wafer cell for immersion lithography
    1.
    发明申请
    Wafer cell for immersion lithography 失效
    用于浸没光刻的晶圆电池

    公开(公告)号:US20050237501A1

    公开(公告)日:2005-10-27

    申请号:US10829623

    申请日:2004-04-22

    IPC分类号: G03B27/52 G03F7/20

    CPC分类号: G03F7/70341

    摘要: An apparatus, system and method for use with a photolithographic system. In accordance with one embodiment, the photolithographic system of the present invention includes a workpiece support member for supporting a semiconductor wafer. A substantially transparent cover member is disposed over the workpiece support member to form a substantially enclosed workpiece cell therebetween. The enclosed workpiece cell is filled with a first immersion fluid having suitable refractive properties. The cover member, having suitable refractive properties, includes an upper surface contoured to form an open reservoir containing a second immersion fluid, having suitable refractive properties, and in which a final lens element may be immersed during a lithography process.

    摘要翻译: 一种用于光刻系统的设备,系统和方法。 根据一个实施例,本发明的光刻系统包括用于支撑半导体晶片的工件支撑构件。 基本上透明的盖构件设置在工件支撑构件上方,以在它们之间形成基本封闭的工件单元。 封闭的工件单元填充有具有合适折射特性的第一浸没流体。 具有合适的折射性质的盖构件包括上表面,其形状为形成具有合适的折射性质的第二浸没流体的开口储存器,并且其中最终的透镜元件可以在光刻工艺期间被浸没。

    WRAP-AROUND GATE FIELD EFFECT TRANSISTOR
    2.
    发明申请
    WRAP-AROUND GATE FIELD EFFECT TRANSISTOR 有权
    封边栅场效应晶体管

    公开(公告)号:US20070184588A1

    公开(公告)日:2007-08-09

    申请号:US11735075

    申请日:2007-04-13

    IPC分类号: H01L21/84

    摘要: A field effect transistor is formed having wrap-around, vertically-aligned, dual gate electrodes. Starting with a silicon-on-insulator (SOI) structure having a buried silicon island, a vertical reference edge is defined, by creating a cavity within the SOI structure, and used during two etch-back steps that can be reliably performed. The first etch-back removes a portion of an oxide layer for a first distance over which a gate conductor material is then applied. The second etch-back removes a portion of the gate conductor material for a second distance. The difference between the first and second distances defines the gate length of the eventual device. After stripping away the oxide layers, a vertical gate electrode is revealed that surrounds the buried silicon island on all four side surfaces.

    摘要翻译: 形成具有环绕,垂直排列的双栅电极的场效应晶体管。 从具有掩埋硅岛的绝缘体上硅(SOI)结构开始,通过在SOI结构内产生空腔并在可以可靠地执行的两个回蚀步骤期间使用垂直参考边缘。 第一次回蚀将氧化物层的一部分去除第一距离,然后施加栅极导体材料。 第二次回蚀将栅极导体材料的一部分移除第二距离。 第一和第二距离之间的差异定义了最终设备的栅极长度。 剥离氧化物层后,显示出在所有四个侧表面上包围掩埋硅岛的垂直栅电极。

    Dual gated finfet gain cell
    7.
    发明申请
    Dual gated finfet gain cell 有权
    双门控finfet增益单元

    公开(公告)号:US20060008927A1

    公开(公告)日:2006-01-12

    申请号:US11221118

    申请日:2005-09-07

    IPC分类号: H01L21/00

    摘要: A memory gain cell for a memory circuit, a memory circuit formed from multiple memory gain cells, and methods of fabricating such memory gain cells and memory circuits. The memory gain cell includes a storage device capable of holding a stored electrical charge, a write device, and a read device. The read device includes a fin of semiconducting material, electrically-isolated first and second gate electrodes flanking the fin, and a source and drain formed in the fin adjacent to the first and the second gate electrodes. The first gate electrode is electrically coupled with the storage device. The first and second gate electrodes are operative for gating a region of the fin defined between the source and the drain to thereby regulate a current flowing from the source to the drain. When gated, the magnitude of the current is dependent upon the electrical charge stored by the storage device.

    摘要翻译: 用于存储器电路的存储增益单元,由多个存储器增益单元形成的存储器电路,以及制造这种存储器增益单元和存储器电路的方法。 存储器增益单元包括能够保存存储的电荷的存储装置,写入装置和读取装置。 读取装置包括半导体材料的翅片,鳍片侧面的电隔离的第一和第二栅电极,以及形成在与第一和第二栅电极相邻的鳍片中的源极和漏极。 第一栅电极与存储装置电耦合。 第一和第二栅极电极用于选通限定在源极和漏极之间的鳍片的区域,从而调节从源极流到漏极的电流。 当门控时,电流的大小取决于存储设备存储的电量。

    Methods of forming alternating phase shift masks having improved phase-shift tolerance
    8.
    发明申请
    Methods of forming alternating phase shift masks having improved phase-shift tolerance 失效
    形成具有改进的相移公差的交替相移掩模的方法

    公开(公告)号:US20050202322A1

    公开(公告)日:2005-09-15

    申请号:US10798908

    申请日:2004-03-11

    IPC分类号: G03C5/00 G03F1/00 G03F9/00

    CPC分类号: G03F1/30

    摘要: Methods for fabricating alternating phase shift masks or reticles used in semiconductor optical lithography systems. The methods generally include forming a layer of phase shift mask material on a handle substrate and patterning the layer to define recessed phase shift windows. The patterned layer is transferred from the handle wafer to a mask blank. The depth of the phase shift windows is determined by the thickness of the layer of phase shift mask material and is independent of the patterning process. In particular, the depth of the phase shift windows is not dependent upon the etch rate uniformity of an etch process across a surface of a mask blank.

    摘要翻译: 用于制造用于半导体光刻系统中的交替相移掩模或掩模版的方法。 所述方法通常包括在手柄基板上形成一层相移掩模材料,并且图案化该层以限定凹陷的相移窗口。 图案层从手柄晶片转移到掩模板。 相移窗口的深度由相移掩模材料层的厚度确定,并且与图案化工艺无关。 特别地,相移窗口的深度不依赖于通过掩模板的表面的蚀刻工艺的蚀刻速率均匀性。