公开(公告)号：US20110056840A1

公开(公告)日：2011-03-10

申请号：US12876723

申请日：2010-09-07

申请人： Toshihisa Isono ,  Shinji Tachibana ,  Naoyuki Omura ,  Shunsaku Hoshi ,  Kanako Matsuda ,  Koji Shimizu

发明人： Toshihisa Isono ,  Shinji Tachibana ,  Naoyuki Omura ,  Shunsaku Hoshi ,  Kanako Matsuda ,  Koji Shimizu

IPC分类号： C25D3/38 ,  C25D17/00 ,  C25D5/00

CPC分类号： C25D21/04 ,  C25D17/02 ,  C25D21/10 ,  C25D21/18

摘要： An electrolytic plating equipment includes: a plating tank for holding plating solution; and a separate tank apart from the plating tank, for holding the plating solution circulating between the plating tank and the separate tank. The separate tank contains a first space and a second space located downstream from the first space. The plating solution in the first space in an amount exceeding a specific height flows from the first space into the second space, and the plating solution falls through air in the second space.

摘要翻译： 电解电镀设备包括：用于保持电镀液的电镀槽; 以及与电镀槽分开的用于保持镀液在电镀槽和分离槽之间循环的单独的罐。 分离的容器包含位于第一空间下游的第一空间和第二空间。 第一空间中的镀液以超过特定高度的量从第一空间流入第二空间，电镀液在第二空间中流经空气。

公开(公告)号：US08801912B2

公开(公告)日：2014-08-12

申请号：US12401113

申请日：2009-03-10

申请人： Naoyuki Omura ,  Toshihisa Isono ,  Koji Shimizu ,  Shinji Tachibana ,  Tomohiro Kawase ,  Shunsaku Hoshi

发明人： Naoyuki Omura ,  Toshihisa Isono ,  Koji Shimizu ,  Shinji Tachibana ,  Tomohiro Kawase ,  Shunsaku Hoshi

IPC分类号： C25D21/18 ,  C25D17/00 ,  C25D3/38 ,  H05K3/24

CPC分类号： C25D17/00 ,  C25D3/38 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/18 ,  H05K3/241

摘要： Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel. Plating performance impairing components, which are produced when the copper ion supplying salt is dissolved in the plating bath for replenishing the copper ions, are oxidized and decomposed, whereby defective plating due to the presence of the plating performance impairing components can be prevented.

摘要翻译： 公开了一种通过在容纳硫酸铜电镀浴的电镀槽中使用不溶性阳极来重复电镀作为阴极的工件的方法，其中提供了不同于电镀槽的铜溶解容器，电镀浴是 转移到铜溶解容器中，并从铜溶解容器返回到电镀槽，用于使电镀槽和铜溶解容器之间的电镀槽循环，将铜离子供应盐装入铜溶解容器中并溶解在镀浴中 使得可以补充由电镀消耗的铜离子，并且将被镀工件连续电镀，其特征在于允许电镀液在阳极侧和阴极侧之间转移，电镀浴返回到 阳极将电镀液从铜溶解容器返回到电镀槽中。 当铜离子供应盐溶解在用于补充铜离子的镀浴中时产生的电镀性能损害部件被氧化分解，从而可以防止由于存在电镀性能损害部件而导致的不良电镀。

公开(公告)号：US20110062029A1

公开(公告)日：2011-03-17

申请号：US12840564

申请日：2010-07-21

申请人： Toshihisa Isono ,  Naoyuki Omura ,  Koji Shimizu ,  Shinji Tachibana

发明人： Toshihisa Isono ,  Naoyuki Omura ,  Koji Shimizu ,  Shinji Tachibana

IPC分类号： C25D5/02 ,  C25D3/38

CPC分类号： C25D3/38 ,  C25D5/02

摘要： For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ε-caprolactam, is contained in the bath as a leveler.

摘要翻译： 为了用于通孔和盲通孔共存的电路板，其中通孔的覆盖功率和盲孔的堵塞性能足够的电解铜电镀浴和电镀方法， 使用电解铜电镀浴。 电解镀铜浴主要由水溶性铜盐，硫酸和氯离子组成。 通过加热二乙烯三胺，己二酸和ε-己内酰胺的缩聚产物的表氯醇改性产物加工得到的聚酰胺多胺作为整平剂包含在浴中。

公开(公告)号：US07892411B2

公开(公告)日：2011-02-22

申请号：US12187918

申请日：2008-08-07

申请人： Shinji Tachibana ,  Tomohiro Kawase ,  Naoyuki Omura ,  Toshihisa Isono ,  Koji Shimizu

发明人： Shinji Tachibana ,  Tomohiro Kawase ,  Naoyuki Omura ,  Toshihisa Isono ,  Koji Shimizu

IPC分类号： C25D21/18 ,  C25D3/38

CPC分类号： C25D3/38 ,  C25D21/16 ,  H05K3/241

摘要： Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm2/L based on the plating bath, and applying air bubbling to the oxidative decomposition region at not lower than 0.01 L/dm2·min based on the immersed area.

摘要翻译： 本发明公开了一种电解铜电镀工艺，该方法是在使用可溶性阳极或不溶性阳极作为阳极并将工件作为阴极的情况下，在填充于镀槽中的含硫酸铜电镀液中的铜上电镀铜并含有有机添加剂， 设定浴电流密度不高于5A / L，将金属铜浸入硫酸铜电镀槽区域，该区域与阳极和阴极之间的区域以及与阳极和阴极相邻的区域分开 ，使得这样浸入的金属铜的附近可以用作氧化分解区域，基于电镀槽将金属铜的浸渍面积设定为不小于0.001dm 2 / L，并将空气鼓泡 氧化分解区域根据浸渍面积不低于0.01 L / dm2·min。

公开(公告)号：US07988842B2

公开(公告)日：2011-08-02

申请号：US12179352

申请日：2008-07-24

申请人： Shinji Tachibana ,  Koji Shimizu ,  Tomohiro Kawase ,  Naoyuki Omura ,  Toshihisa Isono ,  Kazuyoshi Nishimoto

发明人： Shinji Tachibana ,  Koji Shimizu ,  Tomohiro Kawase ,  Naoyuki Omura ,  Toshihisa Isono ,  Kazuyoshi Nishimoto

IPC分类号： C25D21/18 ,  C25B9/00

CPC分类号： C25D21/18

摘要： A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a cathode, the method including overflowing the plating bath from the plating vessel in an overflow vessel under which the plating bath in the overflow vessel is returned to the plating vessel, providing an oxidative decomposition vessel, and returning a plating bath from the oxidative decomposition vessel through the overflow vessel to the plating vessel to circulate the plating bath between the plating vessel and oxidative decomposition vessel, and metallic copper is immersed in the plating bath in the oxidative decomposition vessel and exposed to air bubbling, so that decomposed/degenerated organic products formed by decomposition or degeneration produced during the copper electroplating can be oxidatively decomposed.

摘要翻译： 一种连续铜电镀方法，其中铜连续地镀在工件上，以通过使用可溶性或不溶性阳极和工件作为阴极而放置在容纳含有有机添加剂的硫酸铜电镀液的电镀槽中，该方法包括使镀层溢出 在溢流容器中从电镀槽中洗涤，在溢流容器中将溢流容器中的电镀液返回到电镀槽中，提供氧化分解容器，并将来自氧化分解容器的电镀槽通过溢流容器返回到电镀槽 在电镀槽和氧化分解容器之间循环电镀槽，将金属铜浸入氧化分解容器中的电镀槽中，暴露于鼓泡状态，从而在铜电镀期间产生的分解/退化的有机产物 可以氧化分解。

公开(公告)号：US09028668B2

公开(公告)日：2015-05-12

申请号：US12840564

申请日：2010-07-21

申请人： Toshihisa Isono ,  Naoyuki Omura ,  Koji Shimizu ,  Shinji Tachibana

发明人： Toshihisa Isono ,  Naoyuki Omura ,  Koji Shimizu ,  Shinji Tachibana

IPC分类号： C25D3/38 ,  C25D5/02

CPC分类号： C25D3/38 ,  C25D5/02

摘要： For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ε-caprolactam, is contained in the bath as a leveler.

摘要翻译： 为了用于通孔和盲通孔共存的电路板，其中通孔的覆盖功率和盲孔的堵塞性能足够的电解铜电镀浴和电镀方法， 使用电解铜电镀浴。 电解镀铜浴主要由水溶性铜盐，硫酸和氯离子组成。 通过加热二乙烯三胺，己二酸和ε-己内酰胺的缩聚产物的表氯醇改性产物加工得到的聚酰胺多胺作为整平剂包含在浴中。

公开(公告)号：US20090026083A1

公开(公告)日：2009-01-29

申请号：US12179352

申请日：2008-07-24

申请人： Shinji TACHIBANA ,  Koji Shimizu ,  Tomohiro Kawase ,  Naoyuki Omura ,  Toshihisa Isono ,  Kazuyoshi Nishimoto

发明人： Shinji TACHIBANA ,  Koji Shimizu ,  Tomohiro Kawase ,  Naoyuki Omura ,  Toshihisa Isono ,  Kazuyoshi Nishimoto

IPC分类号： C25D21/18

CPC分类号： C25D21/18

摘要： A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a cathode, the method including overflowing the plating bath from the plating vessel in an lo overflow vessel under which the plating bath in the overflow vessel is returned to the plating vessel, providing an oxidative decomposition vessel, and returning a plating bath from the oxidative decomposition vessel through the overflow vessel to the plating vessel to circulate the plating bath between the plating vessel and oxidative decomposition vessel, and metallic copper is immersed in the plating bath in the oxidative decomposition vessel and exposed to air bubbling, so that decomposed/degenerated organic products formed by decomposition or degeneration produced during the copper electroplating can be oxidatively decomposed.

摘要翻译： 一种连续铜电镀方法，其中铜连续地镀在工件上，以通过使用可溶性或不溶性阳极和工件作为阴极而放置在容纳含有有机添加剂的硫酸铜电镀液的电镀槽中，该方法包括使镀层溢出 在溢流容器中从电镀容器中洗涤，溢流容器内的电镀槽返回到电镀槽中，提供氧化分解容器，并将来自氧化分解容器的电镀槽通过溢流容器返回到电镀容器 使电镀槽和氧化分解容器之间的电镀槽循环，将金属铜浸入氧化分解容器中的电镀槽中，暴露于鼓泡状态，使得在铜中产生的分解或退化形成的分解/退化的有机产物 电镀可能被氧化分解。

公开(公告)号：US08816900B2

公开(公告)日：2014-08-26

申请号：US13467589

申请日：2012-05-09

申请人： Yutaka Hasegawa ,  Koji Shimizu

发明人： Yutaka Hasegawa ,  Koji Shimizu

IPC分类号： G01S13/00 ,  G01S7/40

CPC分类号： G01S13/34 ,  G01S3/74 ,  G01S7/4026 ,  G01S13/42 ,  G01S13/48 ,  G01S13/931 ,  G01S2013/9321 ,  G01S2013/9325 ,  G01S2013/9346

摘要： In an environment inspection mode of a calibration system, a radar device executes a signal analysis process to calculate an eigenvalue ratio of each comparison eigenvalue. The eigenvalue ratio has a small value when a pair of eigenvalues corresponding to arrival radar waves has a strong correlation. On the other hand, the eigenvalue ratio has a large value when the eigenvalue ratio is calculated between an eigenvalue and thermal noise. When there is no eigenvalue which is not more than a reference threshold value, the radar device indicates a notice that the current environment is suitable for the calibration of the radar device. On the other hand, when there is presence of at least one eigenvalue of not more than the reference threshold value, the radar device indicates a notice that the current environment is unsuitable for the calibration of the radar device.

摘要翻译： 在校准系统的环境检查模式中，雷达装置执行信号分析处理，以计算每个比较特征值的特征值比。 当对应于到达雷达波的一对特征值具有很强的相关性时，特征值比率具有小的值。 另一方面，当在特征值和热噪声之间计算特征值比率时，特征值比率具有大的值。 当没有不大于参考阈值的特征值时，雷达装置指示当前环境适合于雷达装置的校准的通知。 另一方面，当存在不超过参考阈值的至少一个特征值时，雷达装置指示当前环境不适合于雷达装置的校准的通知。

公开(公告)号：US08431333B2

公开(公告)日：2013-04-30

申请号：US13243090

申请日：2011-09-23

申请人： Masato Kaneda ,  Yasuhiro Mikawa ,  Koji Shimizu ,  Kouichi Terao

发明人： Masato Kaneda ,  Yasuhiro Mikawa ,  Koji Shimizu ,  Kouichi Terao

IPC分类号： G03F7/30 ,  G03F7/32 ,  B08B3/00

CPC分类号： G03F7/168 ,  G03F7/0007 ,  G03F7/325

摘要： A photosensitive composition remover used for removal of an uncured photosensitive composition, which remover includes 1 to 80 percent by mass of at least one type of aromatic hydrocarbon having 9 carbon atoms or more within the molecule. The photosensitive composition remover further includes an aprotic polar solvent and/or another solvent other than aprotic polar solvents. The photosensitive composition remover is effective for removal of an uncured photosensitive composition film deposited at the periphery, edges, or back of a substrate or removal of an uncured photosensitive composition deposited at the surface of system members or equipment in a process for forming a photosensitive composition film on a glass substrate, a semiconductor wafer, or the like.

摘要翻译： 用于去除未固化的光敏组合物的光敏组合物去除剂，该去除剂包括1至80质量％的至少一种在分子内具有9个或更多碳原子的芳族烃。 光敏组合物去除剂还包括非质子极性溶剂和/或非质子极性溶剂以外的其它溶剂。 光敏组合物去除剂对于去除沉积在基材的周边，边缘或背面的未固化光敏组合物薄膜或去除沉积在系统构件或设备的表面上的未固化光敏组合物在用于形成光敏组合物的方法中是有效的 玻璃基板上的薄膜，半导体晶片等。

公开(公告)号：US08323828B2

公开(公告)日：2012-12-04

申请号：US10638326

申请日：2003-08-12

申请人： Takuya Yamazaki ,  Kiyoshi Oguchi ,  Koji Shimizu ,  Kenichiro Suto ,  Tsutomu Yoshinaka ,  Hideki Kurokawa ,  Hitoshi Sekino ,  Masahiro Yoshikawa ,  Hiroshi Miyama ,  Katsuhiko Hayashi ,  Jun Fukuda

发明人： Takuya Yamazaki ,  Kiyoshi Oguchi ,  Koji Shimizu ,  Kenichiro Suto ,  Tsutomu Yoshinaka ,  Hideki Kurokawa ,  Hitoshi Sekino ,  Masahiro Yoshikawa ,  Hiroshi Miyama ,  Katsuhiko Hayashi ,  Jun Fukuda

IPC分类号： H01M2/02

CPC分类号： H01M2/0275 ,  H01M2/021 ,  H01M2/0277 ,  H01M2/0287 ,  H01M2/06 ,  H01M10/0525 ,  H01M2300/0085 ,  Y10S428/91 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/2804 ,  Y10T428/2817 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31913 ,  Y10T428/31938

摘要： A battery packet (50) comprises a battery case (51) formed by processing a battery case forming laminated sheet (10), a battery 50a contained in the battery case (51), and tabs (59, 60) extending outside from the battery case (51). The battery case forming laminated sheet (10) is formed by laminating a first base film layer (1a), i.e., an outermost layer, a metal foil layer (2), and a heat-adhesive resin layer (3) in that order. The first base film layer (1a) is a biaxially oriented polyethylene terephthalate resin film or a biaxially oriented nylon resin film. The metal foil layer (2) is an aluminum or copper foil. The heat-adhesive resin layer (3) is formed of a polyolefin resin, more preferably, of an acid-denatured polyolefin resin.

摘要翻译： 电池组件（50）包括通过处理电池盒形成层压片（10）形成的电池壳体（51），容纳在电池壳体（51）中的电池50a以及从电池外部延伸的突片（59,60） 情况（51）。 电池盒形成叠层片（10）通过依次层叠第一基膜层（1a）即最外层，金属箔层（2）和热粘树脂层（3）而形成。 第一基膜层（1a）是双轴取向聚对苯二甲酸乙二醇酯树脂膜或双轴取向尼龙树脂膜。 金属箔层（2）是铝箔或铜箔。 热粘树脂层（3）由聚烯烃树脂形成，更优选由酸改性的聚烯烃树脂形成。