公开(公告)号：US20110214994A1

公开(公告)日：2011-09-08

申请号：US13037900

申请日：2011-03-01

Applicant: Masayuki Utsumi ,  Naoyuki Omura ,  Takuya Okamachi

Inventor： Masayuki Utsumi ,  Naoyuki Omura ,  Takuya Okamachi

IPC: C25D5/34 ,  C09K3/00

CPC classification number: C09K3/00 ,  C25D5/34

Abstract: A pretreating agent for electroplating includes an aqueous solution containing, as essential ingredient, (A) at least one anti-adsorption agent selected from among a triazole compound, a pyrazole compound, an imidazole compound, a cationic surfactant, and an amphoteric surfactant, and (B) chloride ion. The pretreating agent does not impair adhesion between substrate copper and a photoresist, and does not damage adhesion between the substrate copper and an electrolytic copper plating film.

Abstract translation: 用于电镀的预处理剂包括含有（A）至少一种选自三唑化合物，吡唑化合物，咪唑化合物，阳离子表面活性剂和两性表面活性剂中的至少一种抗吸附剂作为必要成分的水溶液，以及 （B）氯离子。 预处理剂不会损害基板铜和光致抗蚀剂之间的粘附，并且不会损坏基板铜和电解镀铜膜之间的粘附。

公开(公告)号：US20110062029A1

公开(公告)日：2011-03-17

申请号：US12840564

申请日：2010-07-21

Applicant: Toshihisa Isono ,  Naoyuki Omura ,  Koji Shimizu ,  Shinji Tachibana

Inventor： Toshihisa Isono ,  Naoyuki Omura ,  Koji Shimizu ,  Shinji Tachibana

IPC: C25D5/02 ,  C25D3/38

CPC classification number: C25D3/38 ,  C25D5/02

Abstract: For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ε-caprolactam, is contained in the bath as a leveler.

Abstract translation: 为了用于通孔和盲通孔共存的电路板，其中通孔的覆盖功率和盲孔的堵塞性能足够的电解铜电镀浴和电镀方法， 使用电解铜电镀浴。 电解镀铜浴主要由水溶性铜盐，硫酸和氯离子组成。 通过加热二乙烯三胺，己二酸和ε-己内酰胺的缩聚产物的表氯醇改性产物加工得到的聚酰胺多胺作为整平剂包含在浴中。

公开(公告)号：US07892411B2

公开(公告)日：2011-02-22

申请号：US12187918

申请日：2008-08-07

Applicant: Shinji Tachibana ,  Tomohiro Kawase ,  Naoyuki Omura ,  Toshihisa Isono ,  Koji Shimizu

Inventor： Shinji Tachibana ,  Tomohiro Kawase ,  Naoyuki Omura ,  Toshihisa Isono ,  Koji Shimizu

IPC: C25D21/18 ,  C25D3/38

CPC classification number: C25D3/38 ,  C25D21/16 ,  H05K3/241

Abstract: Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm2/L based on the plating bath, and applying air bubbling to the oxidative decomposition region at not lower than 0.01 L/dm2·min based on the immersed area.

Abstract translation: 本发明公开了一种电解铜电镀工艺，该方法是在使用可溶性阳极或不溶性阳极作为阳极并将工件作为阴极的情况下，在填充于镀槽中的含硫酸铜电镀液中的铜上电镀铜并含有有机添加剂， 设定浴电流密度不高于5A / L，将金属铜浸入硫酸铜电镀槽区域，该区域与阳极和阴极之间的区域以及与阳极和阴极相邻的区域分开 ，使得这样浸入的金属铜的附近可以用作氧化分解区域，基于电镀槽将金属铜的浸渍面积设定为不小于0.001dm 2 / L，并将空气鼓泡 氧化分解区域根据浸渍面积不低于0.01 L / dm2·min。

公开(公告)号：US09730337B2

公开(公告)日：2017-08-08

申请号：US14122981

申请日：2012-05-22

Applicant: Toshihisa Isono ,  Shinji Tachibana ,  Naoyuki Omura ,  Kanako Matsuda

Inventor： Toshihisa Isono ,  Shinji Tachibana ,  Naoyuki Omura ,  Kanako Matsuda

IPC: B05D5/12 ,  H05K3/42 ,  C23C18/16 ,  C25D5/02 ,  C25D21/10 ,  C25D21/12 ,  C25D17/00 ,  C23C4/12 ,  B05D1/02 ,  H05K3/12 ,  H05K3/10 ,  C25D3/38 ,  C23C18/38

CPC classification number: H05K3/422 ,  B05D1/02 ,  B05D5/12 ,  C23C4/12 ,  C23C18/161 ,  C23C18/1628 ,  C23C18/1669 ,  C23C18/1675 ,  C23C18/1683 ,  C23C18/38 ,  C25D3/38 ,  C25D5/026 ,  C25D17/00 ,  C25D21/10 ,  C25D21/12 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/423 ,  H05K2201/09563 ,  H05K2203/075 ,  H05K2203/081 ,  H05K2203/1518 ,  H05K2203/1554 ,  H05K2203/1563

Abstract: The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.

公开(公告)号：US08801912B2

公开(公告)日：2014-08-12

申请号：US12401113

申请日：2009-03-10

Applicant: Naoyuki Omura ,  Toshihisa Isono ,  Koji Shimizu ,  Shinji Tachibana ,  Tomohiro Kawase ,  Shunsaku Hoshi

Inventor： Naoyuki Omura ,  Toshihisa Isono ,  Koji Shimizu ,  Shinji Tachibana ,  Tomohiro Kawase ,  Shunsaku Hoshi

IPC: C25D21/18 ,  C25D17/00 ,  C25D3/38 ,  H05K3/24

CPC classification number: C25D17/00 ,  C25D3/38 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/18 ,  H05K3/241

Abstract: Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel. Plating performance impairing components, which are produced when the copper ion supplying salt is dissolved in the plating bath for replenishing the copper ions, are oxidized and decomposed, whereby defective plating due to the presence of the plating performance impairing components can be prevented.

Abstract translation: 公开了一种通过在容纳硫酸铜电镀浴的电镀槽中使用不溶性阳极来重复电镀作为阴极的工件的方法，其中提供了不同于电镀槽的铜溶解容器，电镀浴是 转移到铜溶解容器中，并从铜溶解容器返回到电镀槽，用于使电镀槽和铜溶解容器之间的电镀槽循环，将铜离子供应盐装入铜溶解容器中并溶解在镀浴中 使得可以补充由电镀消耗的铜离子，并且将被镀工件连续电镀，其特征在于允许电镀液在阳极侧和阴极侧之间转移，电镀浴返回到 阳极将电镀液从铜溶解容器返回到电镀槽中。 当铜离子供应盐溶解在用于补充铜离子的镀浴中时产生的电镀性能损害部件被氧化分解，从而可以防止由于存在电镀性能损害部件而导致的不良电镀。

公开(公告)号：US08679317B2

公开(公告)日：2014-03-25

申请号：US12599436

申请日：2007-05-21

Applicant: Toshihisa Isono ,  Shinji Tachibana ,  Tomohiro Kawase ,  Naoyuki Omura

Inventor： Toshihisa Isono ,  Shinji Tachibana ,  Tomohiro Kawase ,  Naoyuki Omura

IPC: C25D3/00 ,  C25D3/38 ,  C25D3/02 ,  H01L21/02 ,  H05K3/42

CPC classification number: C25D3/38 ,  C25D3/00 ,  C25D3/02 ,  H01L21/02 ,  H01L21/2885 ,  H01L21/76877 ,  H01L21/76898 ,  H05K3/423 ,  H05K3/424

Abstract: A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a brightener, a carrier, and a leveler as additives, wherein the leveler contains at least one water-soluble polymer containing quaternary nitrogen, tertiary nitrogen, or both which are cationizable in a solution. In the copper electroplating bath, the filling power for non-through holes formed on a substrate can be easily controlled so as to fit to the size of the holes only by changing the quaternary nitrogen to tertiary nitrogen ratio of the water-soluble polymer to be used as the leveler, which enables copper electroplating of non-through holes of various sizes with a good fit to the sizes.

Abstract translation: 一种铜电镀槽，其可用于填充形成在包含水溶性铜盐，硫酸和氯离子的基底上的非通孔，并且还包含作为添加剂的增白剂，载体和矫味剂，其中所述矫平剂含有 含有在溶液中可阳离子化的季氮，叔氮或二者的至少一种水溶性聚合物。 在铜电镀槽中，通过将水溶性聚合物的季氮与叔氮比例变更为容易控制，可以容易地控制在基板上形成的非贯通孔的填充力，以适应孔的尺寸 用作平整机，其使得能够对各种尺寸的非通孔的铜电镀具有很好的尺寸。

公开(公告)号：US20090038952A1

公开(公告)日：2009-02-12

申请号：US12187918

申请日：2008-08-07

Applicant: Shinji TACHIBANA ,  Tomohiro KAWASE ,  Naoyuki OMURA ,  Toshihisa ISONO ,  Koji SHIMIZU

Inventor： Shinji TACHIBANA ,  Tomohiro KAWASE ,  Naoyuki OMURA ,  Toshihisa ISONO ,  Koji SHIMIZU

IPC: C25D3/38

CPC classification number: C25D3/38 ,  C25D21/16 ,  H05K3/241

Abstract: Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm2/L based on the plating bath, and applying air bubbling to the oxidative decomposition region at not lower than 0.01 L/dm2·min based on the immersed area.

Abstract translation: 本发明公开了一种电解铜电镀工艺，该方法是在使用可溶性阳极或不溶性阳极作为阳极并将工件作为阴极的情况下，在填充于镀槽中的含硫酸铜电镀液中的铜上电镀铜并含有有机添加剂， 设定浴电流密度不高于5A / L，将金属铜浸入硫酸铜电镀槽区域，该区域与阳极和阴极之间的区域以及与阳极和阴极相邻的区域分开 ，使得这样浸入的金属铜的附近可以用作氧化分解区域，基于电镀槽将金属铜的浸渍面积设定为不小于0.001dm 2 / L，并将空气鼓泡 氧化分解区域以不低于0.01L / dm2.min为基础的浸渍面积。

公开(公告)号：US09028668B2

公开(公告)日：2015-05-12

申请号：US12840564

申请日：2010-07-21

Applicant: Toshihisa Isono ,  Naoyuki Omura ,  Koji Shimizu ,  Shinji Tachibana

Inventor： Toshihisa Isono ,  Naoyuki Omura ,  Koji Shimizu ,  Shinji Tachibana

IPC: C25D3/38 ,  C25D5/02

CPC classification number: C25D3/38 ,  C25D5/02

Abstract: For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ε-caprolactam, is contained in the bath as a leveler.

Abstract translation: 为了用于通孔和盲通孔共存的电路板，其中通孔的覆盖功率和盲孔的堵塞性能足够的电解铜电镀浴和电镀方法， 使用电解铜电镀浴。 电解镀铜浴主要由水溶性铜盐，硫酸和氯离子组成。 通过加热二乙烯三胺，己二酸和ε-己内酰胺的缩聚产物的表氯醇改性产物加工得到的聚酰胺多胺作为整平剂包含在浴中。

公开(公告)号：US20140120245A1

公开(公告)日：2014-05-01

申请号：US14122981

申请日：2012-05-22

Applicant: Toshihisa Isono ,  Shinji Tachibana ,  Naoyuki Omura ,  Kanako Matsuda

Inventor： Toshihisa Isono ,  Shinji Tachibana ,  Naoyuki Omura ,  Kanako Matsuda

IPC: H05K3/42

CPC classification number: H05K3/422 ,  B05D1/02 ,  B05D5/12 ,  C23C4/12 ,  C23C18/161 ,  C23C18/1628 ,  C23C18/1669 ,  C23C18/1675 ,  C23C18/1683 ,  C23C18/38 ,  C25D3/38 ,  C25D5/026 ,  C25D17/00 ,  C25D21/10 ,  C25D21/12 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/423 ,  H05K2201/09563 ,  H05K2203/075 ,  H05K2203/081 ,  H05K2203/1518 ,  H05K2203/1554 ,  H05K2203/1563

Abstract: The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.

Abstract translation: 本发明消除了在通过改变喷镀电镀液的角度或者通过改变印刷电路板的姿势的金属来填充印刷电路板的通孔所产生的缺陷。 溶液，并将沉淀的金属填充到通孔中，同时将电镀溶液或气泡喷涂到印刷板上。

公开(公告)号：US20110089044A1

公开(公告)日：2011-04-21

申请号：US12903555

申请日：2010-10-13

Applicant: Toshihisa Isono ,  Shinji Tachibana ,  Naoyuki Omura ,  Shunsaku Hoshi

Inventor： Toshihisa Isono ,  Shinji Tachibana ,  Naoyuki Omura ,  Shunsaku Hoshi

IPC: C25D3/38

CPC classification number: C25D3/38 ,  H05K3/423

Abstract: Disclosed herein is a copper electrolytic plating bath including copper sulfate used in an amount of 50 to 250 g/liter calculated as copper sulfate pentahydrate, 20 to 200 g/liter of sulfuric acid, and 20 to 150 mg/liter of a chloride ion, and a sulfur atom-containing organic compound and a nitrogen atom-containing organic compound serving as organic additives. The nitrogen atom-containing organic compound includes a nitrogen atom-containing polymer compound obtained by a two-stage reaction including reacting one mole of morpholine with two moles of epichlorohydrin in an acidic aqueous solution to obtain a reaction product and further reacting one to two moles, relative to one mole of the morpholine, of imidazole with the reaction product.

Abstract translation: 本发明公开了一种铜电解电镀浴，包括硫酸铜的使用量为50-250g / l，硫酸铜五水合物，20-200g / l硫酸和20-150mg /升氯离子， 和含硫原子的有机化合物和作为有机添加剂的含氮原子的有机化合物。 含氮原子的有机化合物包括通过两步反应获得的含氮原子的聚合物化合物，包括在酸性水溶液中使1摩尔吗啉与2摩尔表氯醇反应，得到反应产物，并进一步使1至2摩尔 相对于1摩尔的吗啉，与反应产物相比。