摘要:
A primer composition comprises (A) an organosilicon compound of the general formula (1) ##STR1## wherein R represents an alkylene group having from 1 to 6 carbon atoms, R.sup.1 represents a divalent hydrocarbon group having not less than 4 carbon atoms, R.sup.2 's may be the same or different and independently represent an unsubstituted or substituted monovalent hydrocarbon group, a is 0 or 1, and b is 0, 1, 2 or 3, and (B) a catalyst for condensation of the organosilicon compound and (C) an organopolysiloxane resin.
摘要:
A hydrophilic organopolysiloxane composition of the hydrosilylation reaction cure type for use as dental impression material is characterized by comprising as essential components (A) a diorganopolysiloxane having at least 0.1 silicon-bonded alkenyl group in a molecule, (B) a liquid or solid organopolysiloxane having average compositional formula (1), comprising SiO2 units and R3SiO1/2 units (R is a monovalent hydrocarbon, alkoxy or hydroxyl group) and having a viscosity of at least 10 mPa-s at 23° C., (C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (D) a hydrosilylation catalyst, and (E) a polyether having average compositional formula (2).
摘要:
A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): {(CH2═CH)R12SiO1/2}L(R1SiO3/2)m(R12SiO)n{O1/2SiR12—R2—SiR1(3-a)(OR3)a}o (1) wherein R1 represents monovalent hydrocarbon groups, R2 represents an oxygen atom or a bivalent hydrocarbon group, R3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties.
摘要:
An amino compound having a secondary amino group directly bonded to a phenyl group is modified by silylating the secondary amino group. When the silylated amino compound is compounded in a silicone composition comprising an organopolysiloxane containing at least two lower alkenyl groups, an organohydrogenpolysiloxane, and a platinum base curing catalyst, the composition is improved in flame retardance to the level of UL-94 V-0 without sacrificing the activity of the curing catalyst.
摘要:
A liquid organopolysiloxane composition is provided. This composition can readily form a cured article having a matted surface without requiring separate step such as mechanical surface roughening, and this composition is well adapted for use as a potting material or a coating material in electric and electronic components such as LED. An article having a matted surface produced by curing such composition is also provided. The liquid organopolysiloxane composition for matting comprises (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition, and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., a specific weight of 0.01 to 0.8, and a particle size of up to 200 μm. The composition has a viscosity at room temperature of 100 to 100,000 mPa·s. The resulting cured article has a surface glossiness of up to 40.
摘要:
A resin composition suited for rapid prototyping is provided comprising (I) an actinic energy radiation-curable silicone composition, (II) an actinic energy radiation-sensitive polymerization initiator, and (III) an actinic energy radiation absorber. The resin composition experiences little viscosity buildup and maintains fluidity during long-term storage at elevated temperature, and is effective in rapid prototyping or shaping by stereolithography using any actinic energy radiation.
摘要:
Provided is a heat-curable silicone composition containing: (A) an organopolysiloxane having at least one structure represented by the following general formula (2) within each molecule: wherein m represents an integer of 0, 1 or 2, R1 represents a hydrogen atom, a phenyl group or a halogenated phenyl group, R2 represents a hydrogen atom or a methyl group, R3 represents an identical or different monovalent organic group having 1 to 10 carbon atoms, and R4 represents an identical or different bivalent organic group having 1 to 10 carbon atoms; and (B) a quantity of an organic peroxide that is effective as a curing catalyst. The heat-curable silicon composition yields a cured product having excellent transparency and minimal discoloration over time. Also provided is a light emitting diode element having a material composed of the cured product.
摘要:
A hydrophilic polyorganosiloxane composition comprising (A) a curable organopolysiloxane containing at least 5 mol % of diphenylsiloxane units or at least 10 mol % of methylphenylsiloxane units, (B) a curing agent, and (C) a specific polyether cures into an elastomeric or gel-like silicone product having excellent hydrophilic properties and prevents separation of the polyether over time.
摘要:
An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.
摘要翻译:由以下通式(1)表示的有机硅化合物:其中R 1是氢原子,苯基或卤代苯基; R 2是氢原子或甲基; R 3各自为取代或未取代的碳原子数为1〜10的一价烃基; X是可水解基团; Z 1是-R 4 - , - R 4 O-或-R 4(CH 3) 3 sub> SiO 2,其中R 4是取代或未取代的具有1至10个碳原子的二价烃基; Z 2是氧原子或取代或未取代的碳原子数为1〜10的二价烃基; 并且m为0,1或2,n为0,1或2.当掺入有机硅组合物中时,有机硅化合物用作具有良好平衡光聚合性和缩合固化性的交联剂。
摘要:
A silicone rubber coating composition comprising (A) a diorganopolysiloxane containing an average of at least two alkenyl groups, (B) silica powder having a specific surface area of at least 50 m2/g, (C) an organosilicon compound containing a ureido group, an isocyanuric acid ester modified with an organosilicon compound or a (partial) hydrolytic condensate thereof, and (D) a curing agent is applied and vulcanized to base fabric to form a coated fabric, from which airbags are prepared. The composition has a sufficient adhesion to withstand high temperature and abrupt elongation upon inflation of the airbag even after long-term storage under hot humid conditions.