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1.发明授权Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging 有权通过偏移来减少微电子封装中第一级互连（FLI）下的应力公开(公告)号：US07812438B2
公开(公告)日：2010-10-12
申请号：US11970130
申请日：2008-01-07
IPC分类号： H01L23/04
CPC分类号： H01L24/12 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/13099 , H01L2224/141 , H01L2224/14104 , H01L2224/16 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： The invention is directed to an improved microelectronics device that reduces BEOL delamination by reducing the tensile stress imposed on the via which connects first level interconnects with the BEOL. Tensile stress imposed on the via is reduced by shifting the via towards the center of a silicon chip or alternatively shifting the UBM towards the corners of the silicon chip.
摘要翻译： 本发明涉及一种改进的微电子器件，其通过减小施加在通孔上的拉应力来降低BEOL分层，所述通孔将第一级互连与BEOL连接。 通过将通孔移向硅芯片的中心或者将UBM转移到硅芯片的角部来减小施加在通孔上的拉伸应力。
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2.发明申请VIA OFFSETTING TO REDUCE STRESS UNDER THE FIRST LEVEL INTERCONNECT (FLI) IN MICROELECTRONICS PACKAGING 有权通过微电子封装中的第一级互连（FLI）降低压力公开(公告)号：US20090174084A1
公开(公告)日：2009-07-09
申请号：US11970130
申请日：2008-01-07
IPC分类号： H01L23/488
CPC分类号： H01L24/12 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/13099 , H01L2224/141 , H01L2224/14104 , H01L2224/16 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： The invention is directed to an improved microelectronics device that reduces BEOL delamination by reducing the tensile stress imposed on the via which connects first level interconnects with the BEOL. Tensile stress imposed on the via is reduced by shifting the via towards the center of a silicon chip or alternatively shifting the UBM towards the corners of the silicon chip.
摘要翻译： 本发明涉及一种改进的微电子器件，其通过减小施加在通孔上的拉应力来降低BEOL分层，所述通孔将第一级互连与BEOL连接。 通过将通孔移向硅芯片的中心或者将UBM转移到硅芯片的角部来减小施加在通孔上的拉伸应力。
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公开(公告)号：US20130027063A1
公开(公告)日：2013-01-31
申请号：US13191729
申请日：2011-07-27
IPC分类号： G01R27/26
摘要： An apparatus for determining a thickness change of thermal interface material (TIM) disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the TIM thickness is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to the TIM thickness change.
摘要翻译： 提供一种用于确定设置在第一和第二元件之间的热界面材料（TIM）的厚度变化的装置。 该装置包括：第一部件，沿第一部件可沿着移动方向移动，TIM移动方向上沿着移动方向确定TIM厚度;第二部件，其沿着移动方向与第二部件移动;以及传感器，用于测量第一部件和第二部件之间的距离 在移动方向上，测量的距离与TIM厚度变化有关。
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公开(公告)号：US07875972B2
公开(公告)日：2011-01-25
申请号：US12491517
申请日：2009-06-25
IPC分类号： H01L23/34
CPC分类号： H01L23/3735 , H01L2224/73204 , H01L2224/73253 , H01L2224/83951
摘要： Disclosed is a multilayer thermal interface material which includes a first layer of metallic thermal interface material, a buffer layer and preferably a second layer of thermal interface material which may be metallic or nonmetallic. The multilayer thermal interface material is used in conjunction with a semiconductor device assembly of a chip carrier substrate, a heat spreader for attaching to the substrate, a semiconductor device mounted on the substrate and underneath the heat spreader and the multilayer thermal interface material interposed between the heat spreader and the semiconductor device. The heat spreader has a first coefficient of thermal expansion (CTE), CTE1, the buffer layer has a second CTE, CTE2, and the semiconductor device has a third CTE, CTE3, wherein CTE1>CTE2>CTE3.
摘要翻译： 公开了一种多层热界面材料，其包括金属热界面材料的第一层，缓冲层，优选为第二层热界面材料，其可以是金属或非金属的。 多层热界面材料与芯片载体衬底的半导体器件组件，用于附接到衬底的散热器，安装在衬底上的散热器和放置在散热器下方的多层热界面材料结合使用 散热器和半导体器件。 散热器具有第一热膨胀系数（CTE），CTE1，缓冲层具有第二CTE，CTE2，半导体器件具有第三个CTE CTE3，其中CTE1> CTE2> CTE3。
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公开(公告)号：US20100327430A1
公开(公告)日：2010-12-30
申请号：US12491517
申请日：2009-06-25
CPC分类号： H01L23/3735 , H01L2224/73204 , H01L2224/73253 , H01L2224/83951
摘要： Disclosed is a multilayer thermal interface material which includes a first layer of metallic thermal interface material, a buffer layer and preferably a second layer of thermal interface material which may be metallic or nonmetallic. The multilayer thermal interface material is used in conjunction with a semiconductor device assembly of a chip carrier substrate, a heat spreader for attaching to the substrate, a semiconductor device mounted on the substrate and underneath the heat spreader and the multilayer thermal interface material interposed between the heat spreader and the semiconductor device. The heat spreader has a first coefficient of thermal expansion (CTE), CTE1, the buffer layer has a second CTE, CTE2, and the semiconductor device has a third CTE, CTE3, wherein CTE1>CTE2>CTE3.
摘要翻译： 公开了一种多层热界面材料，其包括金属热界面材料的第一层，缓冲层，优选为第二层热界面材料，其可以是金属或非金属的。 多层热界面材料与芯片载体衬底的半导体器件组件，用于附接到衬底的散热器，安装在衬底上的散热器和放置在散热器下方的多层热界面材料结合使用 散热器和半导体器件。 散热器具有第一热膨胀系数（CTE），CTE1，缓冲层具有第二CTE，CTE2，半导体器件具有第三个CTE CTE3，其中CTE1> CTE2> CTE3。
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公开(公告)号：US08717043B2
公开(公告)日：2014-05-06
申请号：US13191729
申请日：2011-07-27
摘要： An apparatus for determining a thickness change of thermal interface material (TIM) disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the TIM thickness is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to the TIM thickness change.
摘要翻译： 提供一种用于确定设置在第一和第二元件之间的热界面材料（TIM）的厚度变化的装置。 该装置包括：第一部件，沿第一部件可沿着移动方向移动，TIM移动方向上沿着移动方向确定TIM厚度;第二部件，其沿着移动方向与第二部件移动;以及传感器，用于测量第一部件和第二部件之间的距离 在移动方向上，测量的距离与TIM厚度变化有关。
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公开(公告)号：US20120007229A1
公开(公告)日：2012-01-12
申请号：US12832732
申请日：2010-07-08
申请人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
发明人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
CPC分类号： H01L23/49827 , H01L23/055 , H01L23/14 , H01L23/147 , H01L23/3677 , H01L23/42 , H01L23/433 , H01L24/16 , H01L25/0657 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/3003 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/3303 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06572 , H01L2225/06589 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10271 , H01L2924/16195 , H01L2924/163 , H01L2924/167 , H01L2924/00 , H01L2224/0401
摘要： A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.
摘要翻译： 提供了一个管芯堆叠封装，包括一个基板，一堆计算部件，至少一个与该堆叠热交换的热板，以及一个支撑在基板上的盖子，以围绕堆叠和至少一个热板，从而 限定从所述计算部件之一经由所述至少一个热板和联接到所述盖的表面和所述至少一个热板的翅片延伸到所述盖的第一热传递路径，以及从所述至少一个热板延伸的第二传热路径 计算组件之一到盖表面而不通过至少一个热板。
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公开(公告)号：US08299608B2
公开(公告)日：2012-10-30
申请号：US12832732
申请日：2010-07-08
申请人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
发明人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
CPC分类号： H01L23/49827 , H01L23/055 , H01L23/14 , H01L23/147 , H01L23/3677 , H01L23/42 , H01L23/433 , H01L24/16 , H01L25/0657 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/3003 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/3303 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06572 , H01L2225/06589 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10271 , H01L2924/16195 , H01L2924/163 , H01L2924/167 , H01L2924/00 , H01L2224/0401
摘要： A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.
摘要翻译： 提供了一个管芯堆叠封装，包括一个基板，一堆计算部件，至少一个与该堆叠热交换的热板，以及一个支撑在基板上的盖子，以围绕堆叠和至少一个热板，从而 限定从所述计算部件之一经由所述至少一个热板和联接到所述盖的表面和所述至少一个热板的翅片延伸到所述盖的第一热传递路径，以及从所述至少一个热板延伸的第二传热路径 计算组件之一到盖表面而不通过至少一个热板。
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公开(公告)号：US20130112006A1
公开(公告)日：2013-05-09
申请号：US13289121
申请日：2011-11-04
申请人： PAUL F. BODENWEBER , Virendra R. Jadhav , Steven P. Ostrander , Kamal Sikka , Jiantao Zheng , Jeffrey A. Zitz
发明人： PAUL F. BODENWEBER , Virendra R. Jadhav , Steven P. Ostrander , Kamal Sikka , Jiantao Zheng , Jeffrey A. Zitz
IPC分类号： G01N3/08
CPC分类号： G01L5/0038 , G01L5/0057 , G01L5/0076 , G01N3/08 , G01N27/22 , G01N2203/0617 , G01N2203/0629 , G01N2203/0682
摘要： An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.
摘要翻译： 提供一种用于确定施加到包括设置在第一和第二元件之间的柔性膜的活塞的压缩载荷的大小的装置。 该装置包括第一部分，该第一部分沿着移动方向可移动地沿着移动方向移动，沿该运动方向确定压缩载荷的大小，第二部分，可沿着运动方向与第二部件移动;以及传感器，用于测量第一 和运动方向上的第二部分，所测量的距离与施加压缩载荷时柔顺膜的变形有关。
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公开(公告)号：US08232636B2
公开(公告)日：2012-07-31
申请号：US12693646
申请日：2010-01-26
申请人： James N Humenik , Sushumna Iruvanti , Richard Langlois , Hsichang Liu , Govindarajan Natarajan , Kamal K Sikka , Hilton T Toy , Jiantao Zheng , Gregg B Monjeau , Mark Kapfhammer
发明人： James N Humenik , Sushumna Iruvanti , Richard Langlois , Hsichang Liu , Govindarajan Natarajan , Kamal K Sikka , Hilton T Toy , Jiantao Zheng , Gregg B Monjeau , Mark Kapfhammer
CPC分类号： H01L23/42 , H01L23/10 , H01L23/3675 , H01L23/3736 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.
摘要翻译： 芯片的前端结合到芯片载体的顶表面。 密封材料被分配在芯片载体的顶表面的周边。 提供具有第一侧和第二侧的焊料TIM。 TIM的第一面接触芯片的背面。 进行回流以融化TIM。 TIM的第二面粘合到盖子上。 密封材料固化。 盖子附接到芯片载体的顶表面。 回填材料被注入到芯片载体的顶表面和盖子之间的空间中。 回填材料邻接TIM的两侧。 回填材料固化。 TIM焊料裂纹和相关的热降解得到缓解。
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